# Applies to unbuffered DIMM types # UDIMM, SO-DIMM, Micro-DIMM, Micro-UDIMM, # 72b-SO-UDIMM, 16b-SO-UDIMM, 32b-SO-UDIMM # 4_01_02_11R24.pdf # # JEDEC Standard No. 21-C # Page 4.1.2.11 - 1 # Annex K: Serial Presence Detect (SPD) for DDR3 SDRAM Modules # DDR3 SPD # Document Release 6 # UDIMM Revision 1.3 # RDIMM Revision 1.3 # CDIMM Revision 1.3 # LRDIMM Revision 1.2 { # Byte 0: Number of Bytes Used / Number of Bytes in SPD Device / # CRC Coverage "SPD_Bytes_Used" : 4, "SPD_Bytes_Total" : 3, "CRC_Coverage" : 1, # Byte 1: SPD Revision "SPD_Revision" : 8, # Byte 2: Key Byte / DRAM Device Type "DRAM_Device_Type" : 8, # Byte 3: Key Byte / Module Type "Module_Type" : 4, "Byte_3_reserved" : 4, # Byte 4: SDRAM Density and Banks "SDRAM_Capacity" : 4, "Bank_Address_Bits" : 3, "Byte_4_reserved" : 1, # Byte 5: SDRAM Addressing "Column_Address_Bits" : 3, "Row_Address_Bits" : 3, "Byte_5_reserved" : 2, # Byte 6: Module Nominal Voltage, VDD "NOT_1.5_V_Operable" : 1, "1.35_V_Operable" : 1, "1.25_V_Operable" : 1, "Byte_6_reserved" : 5, # Byte 7: Module Organization "SDRAM_Device_Width" : 3, "Number_of_Ranks" : 3, "Byte_7_reserved" : 2, # Byte 8: Module Memory Bus Width "Primary_Bus_Width" : 3, "Bus_Width_Extension" : 3, "Byte_8_reserved" : 2, # Byte 9: Fine Timebase (FTB) Dividend / Divisor "Fine_Timebase_Divisor" : 4, "Fine_Timebase_Dividend" : 4, # Bytes 10 / 11: Medium Timebase (MTB) Dividend / Divisor "Medium_Timebase_Dividend" : 8, "Medium_Timebase_Divisor" : 8, # Byte 12: SDRAM Minimum Cycle Time (t CK min) "Minimum_SDRAM_Cycle_Time" : 8, # Byte 13: Reserved "Byte_13_Reserved" : 8, # Bytes 14 / 15: CAS Latencies Supported "CL_4_Supported" : 1, "CL_5_Supported" : 1, "CL_6_Supported" : 1, "CL_7_Supported" : 1, "CL_8_Supported" : 1, "CL_9_Supported" : 1, "CL_10_Supported" : 1, "CL_11_Supported" : 1, "CL_12_Supported" : 1, "CL_13_Supported" : 1, "CL_14_Supported" : 1, "CL_15_Supported" : 1, "CL_16_Supported" : 1, "CL_17_Supported" : 1, "CL_18_Supported" : 1, "Byte_15_Reserved" : 1, # Byte 16: Minimum CAS Latency Time (tAAmin) "tAAmin" : 8, # Byte 17: Minimum Write Recovery Time (tWRmin) "tWRmin" : 8, # Byte 18: Minimum RAS to CAS Delay Time (tRCDmin) "tRCDmin" : 8, # Byte 19: Minimum Row Active to Row Active Delay Time (tRRDmin) "tRRDmin" : 8, # Byte 20: Minimum Row Precharge Delay Time (tRPmin) "tRPmin" : 8, # Bytes 21 - 23: Minimum Active to Precharge Delay Time (tRASmin) # / Minimum Active to Active/Refresh Delay Time # (tRCmin) "tRASmin_Most_Significant Nibble" : 4, "tRCmin_Most_Significant Nibble" : 4, "tRASmin_LSB" : 8, "tRCmin_LSB" : 8, # Bytes 24 - 25: Minimum Refresh Recovery Delay Time (tRFCmin) "tRFCmin LSB" : 8, "tRFCmin MSB" : 8, # Byte 26: Minimum Internal Write to Read Command Delay Time "tWTRmin" : 8, # Byte 27: Minimum Internal Read to Precharge Command Delay Time # (tRTPmin) "tRTPmin" : 8, # Byte 28 - 29: Minimum Four Activate Window Delay Time # (tFAWmin) "tFAWmin Most Significant Nibble" : 4, "Byte_28_Reserved" : 4, "tFAWmin Most Significant Byte" : 8, # Byte 30: SDRAM Optional Features "RQZ_Div_6_Supported" : 1, "RQZ_Div_7_Supported" : 1, "Byte_30_Reserved" : 5, "DLL_Off_Mode_Supported" : 1, # Byte 31: SDRAM Thermal and Refresh # Options "Extended_Temp_range_supported" : 1, "Extended_Temp_Refresh_1x_Refresh" : 1, "Auto_Self_Refresh_Supported" : 1, "On-Die_Thermal_Sensor" : 1, "Byte_31_Reserved" : 3, "Partial_Array_Self_Refresh_Supported" : 1, # Byte 32: Module Thermal Sensor "Thermal_Sensor_Accuracy" : 7, "Thermal_Sensor_incorporated" : 1, # Byte 33: SDRAM Device Type "Signal_Loading" : 2, "Byte_33_Reserved" : 2, "Die_Count" : 3, "SDRAM_Device_Type" : 1, # Byte 34: Fine Offset for SDRAM Minimum # Cycle Time (tCKmin) "tCKmin_Fine_Offset" : 8, #Byte 35: Fine Offset for Minimum CAS Latency Time (tAAmin) "tAAmin_Fine_Offset" : 8, # Byte 36: Fine Offset for Minimum RAS to CAS Delay Time # (tRCDmin) "tRCDmin_Fine_Offset" : 8, #Byte 37: Fine Offset for Minimum Row Precharge Delay Time # (tRPmin) "tRPmin_Fine_Offset" : 8, # Byte 38: Fine Offset for Minimum Active to Active/Refresh # Delay Time (tRCmin) "tRCmin_Fine_Offset" : 8, # Bytes 39 / 40: Reserved "Byte_39_Reserved" : 8, "Byte_40_Reserved" : 8, # Byte 41: SDRAM Maximum Active Count (MAC) Value "Maximum_Activate_Count" : 4, "Maximum_Activate_Window" : 2, "Byte_41_Reserved" : 2, # Bytes 42 - 59: Reserved "Reserved_bytes_42_to_59_" [18] : 8, # Module-Specific Section: Bytes 60 - 116 for Unbuffered DIMMS # Byte 60 (Unbuffered): Raw Card Extension, Module Nominal Height "Module_Nominal_Height" : 5, "Raw_Card_Estension" : 3, # Byte 61 (Unbuffered): Module Maximum Thickness "Module_Thickness_Front" : 4, "Module_Thickness_Back" : 4, # Byte 62 (Unbuffered): Reference Raw Card Used "Reference_Raw_Card" : 5, "Reference_Raw_Card_Revision" : 2, "Reference_Raw_Card_Extension" : 1, # Byte 63: Address Mapping from Edge Connector to DRAM "Rank_1_Mapping_Mirrored" : 1, "Byte_63_Reserved" : 7, # Bytes 64 -116 (Unbuffered): Reserved "Module_Specific_Byte_Reserved_"[53] : 8, # Bytes 117 - 118: Module ID: Module Manufacturers JEDEC ID Code "Module_Manufacturer_JEDEC_ID_Code" : 16, # Byte 119: Module ID: Module Manufacturing Location "Module_Manufacturing_Location" : 8, # Bytes 120 - 121: Module ID: Module Manufacturing Date "Module_Manufacturing_Date" : 16, # Bytes 122 - 125: Module ID: Module Serial Number "Module_Serial_Number" : 32, # Bytes 126 - 127: Cyclical Redundancy Code "Module_CRC" : 16, # Bytes 128 - 145: Module Part Number "Module_Part_Number"[18] : 8, # Bytes 146 - 147: Module Revision Code "Module_Revision_Code" : 16, # Bytes 148 - 149: DRAM Manufacturers JEDEC ID Code "DRAM_Manufacturer_JEDEC_ID_Code" : 16, # Bytes 150 - 175: Manufacturers Specific Data "Manufacturer_Specific_Data_byte_" [26] : 8, # Bytes 176 - 255: Open for customer use "Customer_use_byte_" [80] : 8 }