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* thermal/drivers/rcar_gen3: Add support for R-Car V4MGeert Uytterhoeven2024-03-111-0/+4
| | | | | | | | | | | | | | | Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4M (R8A779H0) SoC. The conversion formulas for R-Car V4M are the same as for other R-Car Gen4 SoCs. Based on a patch in the BSP by Duy Nguyen. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/bd5b002a802c1e058e0048592f17862db1d04263.1709722342.git.geert+renesas@glider.be
* thermal: rcar_gen3: Convert to platform remove callback returning voidUwe Kleine-König2023-09-291-4/+2
| | | | | | | | | | | | | | | | | | | | | The .remove() callback for a platform driver returns an int which makes many driver authors wrongly assume it's possible to do error handling by returning an error code. However the value returned is ignored (apart from emitting a warning) and this typically results in resource leaks. To improve here there is a quest to make the remove callback return void. In the first step of this quest all drivers are converted to .remove_new(), which already returns void. Eventually after all drivers are converted, .remove_new() will be renamed to .remove(). Trivially convert this driver from always returning zero in the remove callback to the void returning variant. Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: Explicitly include correct DT includesRob Herring2023-07-311-1/+1
| | | | | | | | | | | | | | | The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* drivers/thermal/rcar_gen3_thermal: add reading fuses for Gen4Wolfram Sang2023-06-261-2/+42
| | | | | | | | | | | | The registers are differently named and at different offsets, but their functionality is the same as for Gen3. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
* drivers/thermal/rcar_gen3_thermal: refactor reading fuses into seprarate ↵Wolfram Sang2023-06-261-24/+36
| | | | | | | | | | | | | | function Gen4 will be very different, so refactor Gen3 access into separate call first. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
* drivers/thermal/rcar_gen3_thermal: introduce 'info' structureWolfram Sang2023-06-261-15/+26
| | | | | | | | | | | | More items to describe the TSCs are needed soon, so encapsulate the current 'ths_tj_1' item into a struct. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
* thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handlingWolfram Sang2023-04-011-50/+2
| | | | | | | | | | | | | | R-Car H3 ES1.* was only available to an internal development group and needed a lot of quirks and workarounds. These become a maintenance burden now, so our development group decided to remove upstream support and disable booting for this SoC. Public users only have ES2 onwards. Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()Daniel Lezcano2023-03-031-1/+0
| | | | | | | | | | | | | | | | | The thermal->tzp->no_hwmon parameter is only used when calling thermal_zone_device_register(). Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no effect. Remove the call and again prevent the drivers to access the thermal internals. Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/core: Use the thermal zone 'devdata' accessor in thermal located driversDaniel Lezcano2023-03-031-2/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car Acked-by: Mark Brown <broonie@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062 Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: Remove core header inclusion from driversDaniel Lezcano2023-02-151-1/+0
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | As the name states "thermal_core.h" is the header file for the core components of the thermal framework. Too many drivers are including it. Hopefully the recent cleanups helped to self encapsulate the code a bit more and prevented the drivers to need this header. Remove this inclusion in every place where it is possible. Some other drivers did a confusion with the core header and the one exported in linux/thermal.h. They include the former instead of the latter. The changes also fix this. The tegra/soctherm driver still remains as it uses an internal function which need to be replaced. The Intel HFI driver uses the netlink internal framework core and should be changed to prevent to deal with the internals. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/drivers/rcar_gen3_thermal: Fix device initializationNiklas Söderlund2023-02-151-10/+13
| | | | | | | | | | | | | | | | | | | | | The thermal zone is registered before the device is register and the thermal coefficients are calculated, providing a window for very incorrect readings. The reason why the zone was register before the device was fully initialized was that the presence of the set_trips() callback is used to determine if the driver supports interrupt or not, as it is not defined if the device is incapable of interrupts. Fix this by using the operations structure in the private data instead of the zone to determine if interrupts are available or not, and initialize the device before registering the zone. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/drivers/rcar_gen3_thermal: Create device local ops structNiklas Söderlund2023-02-151-4/+5
| | | | | | | | | | | | | | | The callback operations are modified on a driver global level. If one device tree description do not define interrupts, the set_trips() operation was disabled globally for all users of the driver. Fix this by creating a device local copy of the operations structure and modify the copy depending on what the device can do. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/drivers/rcar_gen3_thermal: Do not call set_trips() when resumingNiklas Söderlund2023-02-151-4/+0
| | | | | | | | | | | | There is no need to explicitly call set_trips() when resuming from suspend. The thermal framework calls thermal_zone_device_update() that restores the trip points. Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/drivers/rcar_gen3: Add support for R-Car V4HGeert Uytterhoeven2023-02-151-0/+4
| | | | | | | | | | | | | | | | | Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC. According to the R-Car V4H Hardware User's Manual Rev. 0.70, the (preliminary) conversion formula for the thermal sensor is the same as for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary) conversion formula for the chip internal voltage monitor differs. As the driver only uses the former, no further changes are needed. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/drivers/rcar_gen3: Use the generic function to get the number of tripsDaniel Lezcano2023-01-061-1/+1
| | | | | | | | | The thermal core framework allows to get the number of thermal trips, use it instead of visiting the thermal core structure internals. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/20221003092602.1323944-16-daniel.lezcano@linaro.org
* thermal/drivers/rcar: Switch to new of APIDaniel Lezcano2022-08-171-8/+8
| | | | | | | | | | | | | | The thermal OF code has a new API allowing to migrate the OF initialization to a simpler approach. The ops are no longer device tree specific and are the generic ones provided by the core code. Convert the ops to the thermal_zone_device_ops format and use the new API to register the thermal zone with these generic ops. Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org> Tested-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/20220804224349.1926752-18-daniel.lezcano@linexp.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* Merge tag 'thermal-5.20-rc1' of ↵Linus Torvalds2022-08-021-2/+2
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control updates from Rafael Wysocki: "These start a rework of the handling of trip points in the thermal core, improve the cpufreq/devfreq cooling device handling, update some thermal control drivers and the tmon utility and clean up code. Specifics: - Consolidate the thermal core code by beginning to move the thermal trip structure from the thermal OF code as a generic structure to be used by the different sensors when registering a thermal zone (Daniel Lezcano). - Make per cpufreq / devfreq cooling device ops instead of using a global variable, fix comments and rework the trace information (Lukasz Luba). - Add the include/dt-bindings/thermal.h under the area covered by the thermal maintainer in the MAINTAINERS file (Lukas Bulwahn). - Improve the error output by giving the sensor identification when a thermal zone failed to initialize, the DT bindings by changing the positive logic and adding the r8a779f0 support on the rcar3 (Wolfram Sang). - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof Kozlowski). - Remove the pointless get_trend() function in the QCom, Ux500 and tegra thermal drivers, along with the unused DROP_FULL and RAISE_FULL trends definitions. Simplify the code by using clamp() macros (Daniel Lezcano). - Fix ref_table memory leak at probe time on the k3_j72xx bandgap (Bryan Brattlof). - Fix array underflow in prep_lookup_table (Dan Carpenter). - Add static annotation to the k3_j72xx_bandgap_j7* data structure (Jin Xiaoyun). - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall). - Fix typos in comments on rzg2l (Biju Das). - Remove as unnecessary call to dev_err() as the error is already printed by the failing function on u8500 (Yang Li). - Register the thermal zones as hwmon sensors for the Qcom thermal sensors (Dmitry Baryshkov). - Fix 'tmon' tool compilation issue by adding phtread.h include (Markus Mayer). - Fix typo in the comments for the 'tmon' tool (Slark Xiao). - Make the thermal core use ida_alloc()/free() directly instead of ida_simple_get()/ida_simple_remove() that have been deprecated (keliu). - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control driver (Rafael Wysocki)" * tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits) thermal/of: Initialize trip points separately thermal/of: Use thermal trips stored in the thermal zone thermal/core: Add thermal_trip in thermal_zone thermal/core: Rename 'trips' to 'num_trips' thermal/core: Move thermal_set_delay_jiffies to static thermal/core: Remove unneeded EXPORT_SYMBOLS thermal/of: Move thermal_trip structure to thermal.h thermal/of: Remove the device node pointer for thermal_trip thermal/of: Replace device node match with device node search thermal/core: Remove duplicate information when an error occurs thermal/core: Avoid calling ->get_trip_temp() unnecessarily thermal/tools/tmon: Fix typo 'the the' in comment thermal/tools/tmon: Include pthread and time headers in tmon.h thermal/ti-soc-thermal: Fix comment typo thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors thermal/drivers/u8500: Remove unnecessary print function dev_err() thermal/drivers/rzg2l: Fix comments thermal/drivers/sun8i: Fix typo in comment thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static ...
| * drivers/thermal/rcar_gen3_thermal: Improve logging during probeWolfram Sang2022-07-281-2/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | When setting up a new board, a plain "Can't register thermal zone" didn't help me much because the thermal zones in DT were all fine. I just had a sensor entry too much in the parent TSC node. Reword the failure/success messages to contain the sensor number to make it easier to understand which sensor is affected. Example output now: rcar_gen3_thermal e6198000.thermal: Sensor 0: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 1: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 2: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 3: Can't register thermal zone Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/20220610200500.6727-1-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | thermal/drivers/rcar_gen3_thermal: Add r8a779f0 supportWolfram Sang2022-07-161-0/+4
|/ | | | | | | | | | Add support for R-Car S4. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20220705195520.2581-1-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* thermal: rcar_gen3_thermal: Read calibration from hardwareNiklas Söderlund2021-10-151-20/+74
| | | | | | | | | | | | | | | | In production hardware the calibration values used to convert register values to temperatures can be read from hardware. While pre-production hardware still depends on pseudo values hard-coded in the driver. Add support for reading out calibration values from hardware if it's fused. The presence of fused calibration is indicated in the THSCP register. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Tested-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20211014103816.1939782-3-niklas.soderlund+renesas@ragnatech.se Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* thermal: rcar_gen3_thermal: Store thcode and ptat in priv dataNiklas Söderlund2021-10-151-23/+28
| | | | | | | | | | | | | | | | Prepare for reading the THCODE and PTAT values from hardware fuses by storing the values used during calculations in the drivers private data structures. As the values are now stored directly in the private data structures there is no need to keep track of the TSC channel id as its only usage was to lookup the THCODE row, drop it. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Tested-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20211014103816.1939782-2-niklas.soderlund+renesas@ragnatech.se Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned intNiklas Söderlund2021-08-141-3/+4
| | | | | | | | | | The TSC id and number of TSC ids should be stored as unsigned int as they can't be negative. Fix the datatype of the loop counter 'i' and rcar_gen3_thermal_tsc.id to reflect this. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210804091818.2196806-3-niklas.soderlund+renesas@ragnatech.se
* thermal/drivers/rcar_gen3_thermal: Add support for hardware trip pointsNiklas Söderlund2021-08-141-4/+99
| | | | | | | | | | | | | | | | | | All supported hardware except V3U is capable of generating interrupts to the CPU when the temperature go below or above a set value. Use this to implement support for the set_trip() feature of the thermal core on supported hardware. The V3U have its interrupts routed to the ECM module and therefore can not be used to implement set_trip() as the driver can't be made aware of when the interrupt triggers. Each TSC is capable of tracking up-to three different temperatures while only two are needed to implement the tracking of the thermal window. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210804091818.2196806-2-niklas.soderlund+renesas@ragnatech.se
* thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1Geert Uytterhoeven2021-06-141-3/+2
| | | | | | | | | | | | | | | | | | | | | With -Wshadow: drivers/thermal/rcar_gen3_thermal.c: In function ‘rcar_gen3_thermal_probe’: drivers/thermal/rcar_gen3_thermal.c:310:13: warning: declaration of ‘rcar_gen3_ths_tj_1’ shadows a global declaration [-Wshadow] 310 | const int *rcar_gen3_ths_tj_1 = of_device_get_match_data(dev); | ^~~~~~~~~~~~~~~~~~ drivers/thermal/rcar_gen3_thermal.c:246:18: note: shadowed declaration is here 246 | static const int rcar_gen3_ths_tj_1 = 126; | ^~~~~~~~~~~~~~~~~~ To add to the confusion, the local variable has a different type. Fix the shadowing by renaming the local variable to ths_tj_1. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/9ea7e65d0331daba96f9a7925cb3d12d2170efb1.1623076804.git.geert+renesas@glider.be
* thermal/drivers/rcar_gen3_thermal: Fix coefficient calculationsNiklas Söderlund2021-06-141-1/+1
| | | | | | | | | | | | | | | The fixed value of 157 used in the calculations are only correct for M3-W, on other Gen3 SoC it should be 167. The constant can be derived correctly from the static TJ_3 constant and the SoC specific TJ_1 value. Update the calculation be correct on all Gen3 SoCs. Fixes: 4eb39f79ef44 ("thermal: rcar_gen3_thermal: Update value of Tj_1") Reported-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210605085211.564909-1-niklas.soderlund+renesas@ragnatech.se
* thermal: rcar_gen3_thermal: Add support for up to five TSC nodesNiklas Söderlund2021-03-101-1/+2
| | | | | | | | | | Add support for up to five TSC nodes. The new THCODE values are taken from the example in the datasheet. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210309162419.2621359-1-niklas.soderlund+renesas@ragnatech.se
* thermal: rcar_gen3_thermal: Add r8a779a0 supportNiklas Söderlund2020-12-081-1/+6
| | | | | | | | | Add support for R-Car V3U. The new THCODE values are taken from the example in the datasheet. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201126223028.3119044-4-niklas.soderlund+renesas@ragnatech.se
* thermal: rcar_gen3_thermal: Do not use interrupts for normal operationNiklas Söderlund2020-11-301-106/+2
| | | | | | | | | | | | Remove the usage of interrupts for the normal temperature operation and depend on the polling performed by the thermal core. This is done to prepare to use the interrupts as they are intended to trigger once specific trip points are passed and not to react to temperature changes in the normal operational range. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201126220923.3107213-1-niklas.soderlund+renesas@ragnatech.se
* Merge tag 'thermal-v5.9-rc1' of ↵Linus Torvalds2020-08-061-3/+7
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Add support to enable/disable the thermal zones resulting on core code and drivers cleanup (Andrzej Pietrasiewicz) - Add generic netlink support for userspace notifications: events, temperature and discovery commands (Daniel Lezcano) - Fix redundant initialization for a ret variable (Colin Ian King) - Remove the clock cooling code as it is used nowhere (Amit Kucheria) - Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian Rotariu) - Replace all references to thermal.txt in the documentation to the corresponding yaml files (Amit Kucheria) - Add maintainer entry for the IPA (Lukasz Luba) - Add support for MSM8939 for the tsens (Shawn Guo) - Update power allocator and devfreq cooling to SPDX licensing (Lukasz Luba) - Add Cannon Lake Low Power PCH support (Sumeet Pawnikar) - Add tsensor support for V2 mediatek thermal system (Henry Yen) - Fix thermal zone lookup by ID for the core code (Thierry Reding) * tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits) thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support thermal: mediatek: Add tsensor support for V2 thermal system thermal: mediatek: Prepare to add support for other platforms thermal: Update power allocator and devfreq cooling to SPDX licensing MAINTAINERS: update entry to thermal governors file name prefixing thermal: core: Add thermal zone enable/disable notification thermal: qcom: tsens-v0_1: Add support for MSM8939 dt-bindings: tsens: qcom: Document MSM8939 compatible thermal: core: Fix thermal zone lookup by ID thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id thermal: imx8mm: Support module autoloading thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor() MAINTAINERS: Add maintenance information for IPA thermal: rcar_gen3_thermal: Do not shadow thcode variable dt-bindings: thermal: Get rid of thermal.txt and replace references thermal: core: Move initialization after core initcall thermal: netlink: Improve the initcall ordering net: genetlink: Move initialization to core_initcall thermal: rcar_gen3_thermal: Add r8a774e1 support thermal/drivers/clock_cooling: Remove clock_cooling code ...
| * thermal: rcar_gen3_thermal: Do not shadow thcode variableNiklas Söderlund2020-07-211-3/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The function rcar_gen3_thermal_calc_coefs() takes an argument called 'thcode' which shadows the static global 'thcode' variable. This is not harmful but bad for readability and is harmful for planned changes to the driver. The THCODE values should be read from hardware fuses if they are available and only fallback to the global 'thcode' variable if they are not fused. Rename the global 'thcode' variable to 'thcodes' to avoid shadowing the symbol in functions that take it as an argument. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200610003300.884258-1-niklas.soderlund+renesas@ragnatech.se
| * thermal: rcar_gen3_thermal: Add r8a774e1 supportMarian-Cristian Rotariu2020-07-211-0/+4
| | | | | | | | | | | | | | | | | | | | | | Add r8a774e1 specific compatible string. Signed-off-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com> Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1594811350-14066-4-git-send-email-prabhakar.mahadev-lad.rj@bp.renesas.com
* | thermal/drivers/rcar_gen3: Fix undefined temperature if negativeDien Pham2020-06-291-1/+1
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | As description for DIV_ROUND_CLOSEST in file include/linux/kernel.h. "Result is undefined for negative divisors if the dividend variable type is unsigned and for negative dividends if the divisor variable type is unsigned." In current code, the FIXPT_DIV uses DIV_ROUND_CLOSEST but has not checked sign of divisor before using. It makes undefined temperature value in case the value is negative. This patch fixes to satisfy DIV_ROUND_CLOSEST description and fix bug too. Note that the variable name "reg" is not good because it should be the same type as rcar_gen3_thermal_read(). However, it's better to rename the "reg" in a further patch as cleanup. Signed-off-by: Van Do <van.do.xw@renesas.com> Signed-off-by: Dien Pham <dien.pham.ry@renesas.com> [shimoda: minor fixes, add Fixes tag] Fixes: 564e73d283af ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver") Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Reviewed-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se> Tested-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1593085099-2057-1-git-send-email-yoshihiro.shimoda.uh@renesas.com
* thermal: rcar_gen3_thermal: Add r8a77961 supportGeert Uytterhoeven2020-03-201-0/+4
| | | | | | | | | | | | | | Add support for the Thermal Sensor/Chip Internal Voltage Monitor in the R-Car M3-W+ (R8A77961) SoC. According to the R-Car Gen3 Hardware Manual Errata for Revision 2.00 of Jan 31, 2020, the thermal parameters for R-Car M3-W+ are the same as for R-Car M3-W. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200306105503.24267-3-geert+renesas@glider.be
* thermal: rcar_gen3_thermal: Generate interrupt when temperature changesNiklas Söderlund2020-03-121-12/+12
| | | | | | | | | | | | | | | | | | | | | | The desired behavior of the driver is to generate an interrupt and call thermal_zone_device_update() as soon as the temperature have changed more then one degree. When the set_trips operation was implemented it was believed that the trip window set by the framework would move around the current temperature and the hysteresis value described in devicetree. The behavior of the framework is however to set a window based on the trip points described in devicetree. Remove the set_trips operation which was not used correctly and update the temperatures that triggers interrupts directly from the interrupt handler. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200212224917.737314-1-niklas.soderlund+renesas@ragnatech.se
* thermal: rcar_gen3_thermal: Remove unneeded curly bracketsNiklas Söderlund2020-03-121-2/+1
| | | | | | | | | | | | When devm_add_action() was turned into devm_add_action_or_reset() the curly brackets for the error case where kept but are not needed, remove them to match the style of the driver. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200212224732.736785-1-niklas.soderlund+renesas@ragnatech.se
* thermal: rcar_gen3_thermal: Remove temperature boundNiklas Söderlund2020-01-271-3/+1
| | | | | | | | | | | The hardware manual states that the operation of the sensor is not guaranteed with temperatures above 125°C, not that the readings are invalid. Remove the bound check and try to deliver temperature readings even if we are outside the guaranteed operation range. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200117160554.3812787-3-niklas.soderlund+renesas@ragnatech.se
* thermal: rcar_gen3_thermal: Add r8a774b1 supportBiju Das2019-11-071-0/+4
| | | | | | | | | Add r8a774b1 specific compatible string. Signed-off-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1569248746-56718-1-git-send-email-biju.das@bp.renesas.com
* thermal: rcar_gen3_thermal: Replace devm_add_action() followed by failure ↵Fuqian Huang2019-08-281-2/+1
| | | | | | | | | | | | | action with devm_add_action_or_reset() devm_add_action_or_reset() is introduced as a helper function which internally calls devm_add_action(). If devm_add_action() fails then it will execute the action mentioned and return the error code. This reduce source code size (avoid writing the action twice) and reduce the likelyhood of bugs. Signed-off-by: Fuqian Huang <huangfq.daxian@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rcar_gen3_thermal: Update temperature conversion methodYoshihiro Kaneko2019-05-231-10/+18
| | | | | | | | | | | | | | Update the formula to calculate temperature: Currently, current TEMP is calculated as average of val1 (is calculated by formula 1) and val2 (is calculated by formula 2). But, as description in HWM (chapter 10A.3.1.2 Normal Mode.) If (TEMP_CODE < THCODE2[11:0]) CTEMP value should be val1. If (TEMP_CODE > THCODE2[11:0]) CTEMP value should be val2. Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: Update calculation formula of IRQTEMPYoshihiro Kaneko2019-05-231-16/+17
| | | | | | | | | | | | | Update the formula to calculate CTEMP: Currently, the CTEMP is average of val1 (is calculated by formula 1) and val2 (is calculated by formula 2). But, as description in HWM (chapter 10A.3.1.1 Setting of Normal Mode) If (STEMP < Tj_T) CTEMP value should be val1. If (STEMP > Tj_T) CTEMP value should be val2. Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: Update value of Tj_1Yoshihiro Kaneko2019-05-231-11/+30
| | | | | | | | | | As evaluation of hardware team, temperature calculation formula of M3-W is difference from all other SoCs as below: - M3-W: Tj_1: 116 (so Tj_1 - Tj_3 = 157) - Others: Tj_1: 126 (so Tj_1 - Tj_3 = 167) Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: Fix to show correct trip points numberJiada Wang2019-05-141-4/+4
| | | | | | | | | | | | | Currently after store trip points number in 'ret', it is overwritten afterwards, this cause incorrect trip point number always be shown in the debug information after register of each thermal zone. This patch fix this issue by moving get of trip number to end of thermal zone registration. Fixes: 6269e9f790e8d ("thermal: rcar_gen3_thermal: Register hwmon sysfs interface") Signed-off-by: Jiada Wang <jiada_wang@mentor.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: disable interrupt in .removeJiada Wang2019-05-141-0/+3
| | | | | | | | | | | | | | Currently IRQ remains enabled after .remove, later if device is probed, IRQ is requested before .thermal_init, this may cause IRQ function be called before device is initialized. this patch disables interrupt in .remove, to ensure irq function only be called after device is fully initialized. Signed-off-by: Jiada Wang <jiada_wang@mentor.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: fix interrupt typeJiada Wang2019-05-141-32/+6
| | | | | | | | | | | | | | | | | | | | | Currently IRQF_SHARED type interrupt line is allocated, but it is not appropriate, as the interrupt line isn't shared between different devices, instead IRQF_ONESHOT is the proper type. By changing interrupt type to IRQF_ONESHOT, now irq handler is no longer needed, as clear of interrupt status can be done in threaded interrupt context. Because IRQF_ONESHOT type interrupt line is kept disabled until the threaded handler has been run, so there is no need to protect read/write of REG_GEN3_IRQSTR with lock. Fixes: 7d4b269776ec6 ("enable hardware interrupts for trip points") Signed-off-by: Jiada Wang <jiada_wang@mentor.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Tested-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: Fix init value of IRQCTL registerHoan Nguyen An2019-05-141-1/+1
| | | | | | | | | | | Fix setting value for IRQCTL register. We are setting the last 6 bits of (IRQCTL) to be 1 (0x3f), this is only suitable for H3ES1.*, according to Hardware manual values 1 are "setting prohibited" for Gen3. Signed-off-by: Hoan Nguyen An <na-hoan@jinso.co.jp> Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rcar_gen3_thermal: Register hwmon sysfs interfaceMarek Vasut2019-02-201-0/+19
| | | | | | | | | | | | | | Register the hwmon sysfs interface on R-Car Gen3 thermal driver to align it with Gen2 driver. Use devm_add_action() to unregister the hwmon interface automatically. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Wolfram Sang <wsa+renesas@sang-engineering.com> Cc: linux-renesas-soc@vger.kernel.org To: linux-pm@vger.kernel.org From: Marek Vasut <marek.vasut+renesas@gmail.com> Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'linus' of ↵Linus Torvalds2018-10-261-0/+2
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Eduardo Valentin: "Several new things coming up. Specifics: - Rework of tsens and hisi thermal drivers - OF-thermal now allows sharing multiple cooling devices on maps - Added support for r8a7744 and R8A77970 on rcar thermal driver - Added support for r8a774a1 on rcar_gen3 thermal driver - New thermal driver stm32 - Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada, qcom-spmi, rcar, da9062/61" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits) thermal: da9062/61: Prevent hardware access during system suspend thermal: rcar_thermal: Prevent doing work after unbind thermal: rcar_thermal: Prevent hardware access during system suspend thermal: rcar_gen3_thermal: add R8A77980 support dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings thermal: add stm32 thermal driver dt-bindings: stm32-thermal: add binding documentation thermal: rcar_thermal: add R8A77970 support dt-bindings: thermal: rcar-thermal: document R8A77970 bindings thermal: rcar_thermal: fix duplicate IRQ request dt-bindings: thermal: rcar: Add device tree support for r8a7744 thermal/drivers/hisi: Add the dual clusters sensors for hi3660 thermal/drivers/hisi: Add more sensors channel thermal/drivers/hisi: Remove pointless irq field thermal/drivers/hisi: Use platform_get_irq_byname thermal/drivers/hisi: Replace macro name with relevant sensor location thermal/drivers/hisi: Add multiple sensors support thermal/drivers/hisi: Prepare to support multiple sensors thermal/drivers/hisi: Factor out the probe functions thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer ...
| * thermal: rcar_gen3_thermal: add R8A77980 supportSergei Shtylyov2018-10-251-0/+1
| | | | | | | | | | | | | | | | | | Add the R-Car V3H (R8A77980) SoC support to the R-Car gen3 thermal driver. Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: rcar_gen3_thermal: Add r8a774a1 supportFabrizio Castro2018-08-241-0/+1
| | | | | | | | | | | | | | | | | | Add r8a774a1 specific compatible string. Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com> Reviewed-by: Biju Das <biju.das@bp.renesas.com> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: rcar_gen3_thermal: convert to SPDX identifiersKuninori Morimoto2018-08-201-10/+1
|/ | | | | | | | | Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
generated by cgit v1.2.3 (git 2.25.1) at 2024-12-13 15:09:59 +0000