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author | Eduardo Valentin <eduardo.valentin@ti.com> | 2013-05-29 15:07:46 +0000 |
---|---|---|
committer | Zhang Rui <rui.zhang@intel.com> | 2013-06-13 10:16:15 +0800 |
commit | ca0c711463565a8735b24f3b08310287adb6b4c9 (patch) | |
tree | 7b782c019d0b2396c79a304c93b2a8c3b0d7c3ac | |
parent | 25870e623476ac210f914d6a0a33bea8baa9eadb (diff) | |
download | linux-ca0c711463565a8735b24f3b08310287adb6b4c9.tar.gz linux-ca0c711463565a8735b24f3b08310287adb6b4c9.tar.bz2 linux-ca0c711463565a8735b24f3b08310287adb6b4c9.zip |
thermal: ti-soc-thermal: add DT example for DRA752 chip
Update documentation by adding an example for DRA752 on DT description.
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
-rw-r--r-- | Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt | 12 |
1 files changed, 12 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt index 1629652372b6..1953b33cad51 100644 --- a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt +++ b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt @@ -59,3 +59,15 @@ bandgap { compatible = "ti,omap5430-bandgap"; interrupts = <0 126 4>; /* talert */ }; + +DRA752: +bandgap { + reg = <0x4a0021e0 0xc + 0x4a00232c 0xc + 0x4a002380 0x2c + 0x4a0023C0 0x3c + 0x4a002564 0x8 + 0x4a002574 0x50>; + compatible = "ti,dra752-bandgap"; + interrupts = <0 126 4>; /* talert */ +}; |