summaryrefslogtreecommitdiffstats
path: root/Documentation/hwmon
diff options
context:
space:
mode:
authorGong Jun <JGong@nuvoton.com>2009-03-30 21:46:42 +0200
committerJean Delvare <khali@linux-fr.org>2009-03-30 21:46:42 +0200
commit237c8d2f54ff12bd4fea1a9d18a94ae5810271d3 (patch)
treef93114b8b4c24a59151353cdfb63dd52fa055f9b /Documentation/hwmon
parent1704b26ee3fd89c76724cbea238e951dc019faca (diff)
downloadlinux-237c8d2f54ff12bd4fea1a9d18a94ae5810271d3.tar.gz
linux-237c8d2f54ff12bd4fea1a9d18a94ae5810271d3.tar.bz2
linux-237c8d2f54ff12bd4fea1a9d18a94ae5810271d3.zip
hwmon: (w83627ehf) Add support for W83667HG
Add initial support for the Nuvoton W83667HG chip to the w83627ehf driver. It has been tested on ASUS P5QL PRO by Gong Jun. At the moment there is still a usability issue which is that only in6 or temp3 can be present on the W83667HG, so the driver shouldn't expose both. This will be addressed later. Signed-off-by: Gong Jun <JGong@nuvoton.com> Acked-by: David Hubbard <david.c.hubbard@gmail.com> Signed-off-by: Jean Delvare <khali@linux-fr.org>
Diffstat (limited to 'Documentation/hwmon')
-rw-r--r--Documentation/hwmon/w83627ehf29
1 files changed, 20 insertions, 9 deletions
diff --git a/Documentation/hwmon/w83627ehf b/Documentation/hwmon/w83627ehf
index d6e1ae30fa6e..b6eb59384bb3 100644
--- a/Documentation/hwmon/w83627ehf
+++ b/Documentation/hwmon/w83627ehf
@@ -2,30 +2,40 @@ Kernel driver w83627ehf
=======================
Supported chips:
- * Winbond W83627EHF/EHG/DHG (ISA access ONLY)
+ * Winbond W83627EHF/EHG (ISA access ONLY)
Prefix: 'w83627ehf'
Addresses scanned: ISA address retrieved from Super I/O registers
Datasheet:
- http://www.winbond-usa.com/products/winbond_products/pdfs/PCIC/W83627EHF_%20W83627EHGb.pdf
- DHG datasheet confidential.
+ http://www.nuvoton.com.tw/NR/rdonlyres/A6A258F0-F0C9-4F97-81C0-C4D29E7E943E/0/W83627EHF.pdf
+ * Winbond W83627DHG
+ Prefix: 'w83627dhg'
+ Addresses scanned: ISA address retrieved from Super I/O registers
+ Datasheet:
+ http://www.nuvoton.com.tw/NR/rdonlyres/7885623D-A487-4CF9-A47F-30C5F73D6FE6/0/W83627DHG.pdf
+ * Winbond W83667HG
+ Prefix: 'w83667hg'
+ Addresses scanned: ISA address retrieved from Super I/O registers
+ Datasheet: not available
Authors:
Jean Delvare <khali@linux-fr.org>
Yuan Mu (Winbond)
Rudolf Marek <r.marek@assembler.cz>
David Hubbard <david.c.hubbard@gmail.com>
+ Gong Jun <JGong@nuvoton.com>
Description
-----------
-This driver implements support for the Winbond W83627EHF, W83627EHG, and
-W83627DHG super I/O chips. We will refer to them collectively as Winbond chips.
+This driver implements support for the Winbond W83627EHF, W83627EHG,
+W83627DHG and W83667HG super I/O chips. We will refer to them collectively
+as Winbond chips.
The chips implement three temperature sensors, five fan rotation
speed sensors, ten analog voltage sensors (only nine for the 627DHG), one
-VID (6 pins for the 627EHF/EHG, 8 pins for the 627DHG), alarms with beep
-warnings (control unimplemented), and some automatic fan regulation
-strategies (plus manual fan control mode).
+VID (6 pins for the 627EHF/EHG, 8 pins for the 627DHG and 667HG), alarms
+with beep warnings (control unimplemented), and some automatic fan
+regulation strategies (plus manual fan control mode).
Temperatures are measured in degrees Celsius and measurement resolution is 1
degC for temp1 and 0.5 degC for temp2 and temp3. An alarm is triggered when
@@ -54,7 +64,8 @@ follows:
temp1 -> pwm1
temp2 -> pwm2
temp3 -> pwm3
-prog -> pwm4 (the programmable setting is not supported by the driver)
+prog -> pwm4 (not on 667HG; the programmable setting is not supported by
+ the driver)
/sys files
----------