Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:

 - add thermal driver for R-Car Gen3 thermal sensors.

 - add thermal driver for ZTE' zx2967 family thermal sensors.

 - convert thermal ID allocation from IDR to IDA.

 - fix a possible NULL dereference in imx thermal driver.

 - fix a ti-soc-thermal driver dependency issue so that critical thermal
   control is still available when CPU_THERMAL is not defined.

 - update binding information for QorIQ thermal driver.

 - a couple of cleanups in thermal core, intel_powerclamp, exynos,
   dra752-thermal, mtk-thermal driver.

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
  powerpc/mpc85xx: Update TMU device tree node for T1023/T1024
  powerpc/mpc85xx: Update TMU device tree node for T1040/T1042
  dt-bindings: Update QorIQ TMU thermal bindings
  thermal: mtk_thermal: Staticise a number of data variables
  thermal: arm: dra752: Remove all TSHUT related definitions
  thermal: arm: dra752: Remove TSHUT configuration
  thermal: ti-soc-thermal: Remove CPU_THERMAL Dependency from TI_THERMAL
  thermal: imx: Fix possible NULL dereference.
  thermal: exynos: Remove parsing unused samsung,tmu_cal_mode property
  thermal: zx2967: add thermal driver for ZTE's zx2967 family
  thermal: use cpumask_var_t for on-stack cpu masks
  dt: bindings: add documentation for zx2967 family thermal sensor
  thermal/intel_powerclamp: Remove set-but-not-used variables
  thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver
  thermal: rcar_gen3_thermal: Document the R-Car Gen3
  thermal: convert devfreq_cooling to use an IDA
  thermal: convert cpu_cooling to use an IDA
  thermal: convert clock cooling to use an IDA
  thermal core: convert ID allocation to IDA

3 files changed, 179 insertions, 0 deletions

diff --git a/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt b/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt
index 66223d561972..20ca4ef9d776 100644
--- a/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt
@@ -17,6 +17,12 @@ Required properties:
 	calibration data, as specified by the SoC reference manual.
 	The first cell of each pair is the value to be written to TTCFGR,
 	and the second is the value to be written to TSCFGR.
+- #thermal-sensor-cells : Must be 1. The sensor specifier is the monitoring
+	site ID, and represents the "n" in TRITSRn and TRATSRn.
+
+Optional property:
+- little-endian : If present, the TMU registers are little endian. If absent,
+	the default is big endian.
 
 Example:
 
@@ -60,4 +66,5 @@ tmu@f0000 {
 
 			       0x00030000 0x00000012
 			       0x00030001 0x0000001d>;
+	#thermal-sensor-cells = <1>;
 };
diff --git a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt
new file mode 100644
index 000000000000..07a9713ae6a7
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt
@@ -0,0 +1,56 @@
+* DT bindings for Renesas R-Car Gen3 Thermal Sensor driver
+
+On R-Car Gen3 SoCs, the thermal sensor controllers (TSC) control the thermal
+sensors (THS) which are the analog circuits for measuring temperature (Tj)
+inside the LSI.
+
+Required properties:
+- compatible		: "renesas,<soctype>-thermal",
+			  Examples with soctypes are:
+			    - "renesas,r8a7795-thermal" (R-Car H3)
+			    - "renesas,r8a7796-thermal" (R-Car M3-W)
+- reg			: Address ranges of the thermal registers. Each sensor
+			  needs one address range. Sorting must be done in
+			  increasing order according to datasheet, i.e.
+			  TSC1, TSC2, ...
+- clocks		: Must contain a reference to the functional clock.
+- #thermal-sensor-cells : must be <1>.
+
+Optional properties:
+
+- interrupts           : interrupts routed to the TSC (3 for H3 and M3-W)
+- power-domain		: Must contain a reference to the power domain. This
+			  property is mandatory if the thermal sensor instance
+			  is part of a controllable power domain.
+
+Example:
+
+	tsc: thermal@e6198000 {
+		compatible = "renesas,r8a7795-thermal";
+		reg = <0 0xe6198000 0 0x68>,
+		      <0 0xe61a0000 0 0x5c>,
+		      <0 0xe61a8000 0 0x5c>;
+		interrupts = <GIC_SPI 67 IRQ_TYPE_LEVEL_HIGH>,
+			     <GIC_SPI 68 IRQ_TYPE_LEVEL_HIGH>,
+			     <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>;
+		clocks = <&cpg CPG_MOD 522>;
+		power-domains = <&sysc R8A7795_PD_ALWAYS_ON>;
+		#thermal-sensor-cells = <1>;
+		status = "okay";
+	};
+
+	thermal-zones {
+		sensor_thermal1: sensor-thermal1 {
+			polling-delay-passive = <250>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsc 0>;
+
+			trips {
+				sensor1_crit: sensor1-crit {
+					temperature = <90000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};
+	};
diff --git a/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt b/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt
new file mode 100644
index 000000000000..3dc1c6bf0478
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt
@@ -0,0 +1,116 @@
+* ZTE zx2967 family Thermal
+
+Required Properties:
+- compatible: should be one of the following.
+    * zte,zx296718-thermal
+- reg: physical base address of the controller and length of memory mapped
+    region.
+- clocks : Pairs of phandle and specifier referencing the controller's clocks.
+- clock-names: "topcrm" for the topcrm clock.
+	       "apb" for the apb clock.
+- #thermal-sensor-cells: must be 0.
+
+Please note: slope coefficient defined in thermal-zones section need to be
+multiplied by 1000.
+
+Example for tempsensor:
+
+	tempsensor: tempsensor@148a000 {
+		compatible = "zte,zx296718-thermal";
+		reg = <0x0148a000 0x20>;
+		clocks = <&topcrm TEMPSENSOR_GATE>, <&audiocrm AUDIO_TS_PCLK>;
+		clock-names = "topcrm", "apb";
+		#thermal-sensor-cells = <0>;
+	};
+
+Example for cooling device:
+
+	cooling_dev: cooling_dev {
+		cluster0_cooling_dev: cluster0-cooling-dev {
+			#cooling-cells = <2>;
+			cpumask = <0xf>;
+			capacitance = <1500>;
+		};
+
+	cluster1_cooling_dev: cluster1-cooling-dev {
+			#cooling-cells = <2>;
+			cpumask = <0x30>;
+			capacitance = <2000>;
+		};
+	};
+
+Example for thermal zones:
+
+	thermal-zones {
+		zx296718_thermal: zx296718_thermal {
+			polling-delay-passive = <500>;
+			polling-delay = <1000>;
+			sustainable-power = <6500>;
+
+			thermal-sensors = <&tempsensor 0>;
+			/*
+			 * slope need to be multiplied by 1000.
+			 */
+			coefficients = <1951 (-922)>;
+
+			trips {
+				trip0: switch_on_temperature {
+					temperature = <90000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+
+				trip1: desired_temperature {
+					temperature = <100000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+
+				crit: critical_temperature {
+					temperature = <110000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+
+			cooling-maps {
+				map0 {
+					trip = <&trip0>;
+					cooling-device = <&gpu 2 5>;
+				};
+
+				map1 {
+					trip = <&trip0>;
+					cooling-device = <&cluster0_cooling_dev 1 2>;
+				};
+
+				map2 {
+					trip = <&trip1>;
+					cooling-device = <&cluster0_cooling_dev 1 2>;
+				};
+
+				map3 {
+					trip = <&crit>;
+					cooling-device = <&cluster0_cooling_dev 1 2>;
+				};
+
+				map4 {
+					trip = <&trip0>;
+					cooling-device = <&cluster1_cooling_dev 1 2>;
+					contribution = <9000>;
+				};
+
+				map5 {
+					trip = <&trip1>;
+					cooling-device = <&cluster1_cooling_dev 1 2>;
+					contribution = <4096>;
+				};
+
+				map6 {
+					trip = <&crit>;
+					cooling-device = <&cluster1_cooling_dev 1 2>;
+					contribution = <4096>;
+				};
+			};
+		};
+	};