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* Thermal: update documentation for thermal_zone_device_registerZhang Rui2013-04-271-3/+11
| | | | | | Update kernel Documentation for thermal_zone_device_register. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rename notify_thermal_framework to thermal_notify_frameworkEduardo Valentin2013-04-251-1/+1
| | | | | | | | To follow the prefix names used by the thermal functions, this patch renames notify_thermal_framework to thermal_notify_framework. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: build thermal governors into thermal_sys moduleZhang Rui2013-04-141-8/+0
| | | | | | | | | | | | | | | | | The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
* thermal: add a warning for temperature emulation featureEduardo Valentin2013-04-021-0/+4
| | | | | | | | | | Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: exynos: Adapt to temperature emulation core thermal frameworkAmit Daniel Kachhap2013-04-021-4/+4
| | | | | | | | | | | | | | | | | This removes the driver specific sysfs support of the temperature emulation and uses the newly added core thermal framework for thermal emulation. An exynos platform specific handler is added to support this. In this patch, the exynos senor(tmu) related code and exynos framework related (thermal zone, cooling devices) code are intentionally kept separate. So an emulated function pointer is passed from sensor to framework. This is beneficial in adding more sensor support using the same framework code which is an ongoing work. The goal is to finally split them totally. Even the existing read_temperature also follows the same execution method. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branch 'release' of ↵Linus Torvalds2013-02-283-2/+376
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "Highlights: - introduction of Dove thermal sensor driver. - introduction of Kirkwood thermal sensor driver. - introduction of intel_powerclamp thermal cooling device driver. - add interrupt and DT support for rcar thermal driver. - add thermal emulation support which allows platform thermal driver to do software/hardware emulation for thermal issues." * 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits) thermal: rcar: remove __devinitconst thermal: return an error on failure to register thermal class Thermal: rename thermal governor Kconfig option to avoid generic naming thermal: exynos: Use the new thermal trend type for quick cooling action. Thermal: exynos: Add support for temperature falling interrupt. Thermal: Dove: Add Themal sensor support for Dove. thermal: Add support for the thermal sensor on Kirkwood SoCs thermal: rcar: add Device Tree support thermal: rcar: remove machine_power_off() from rcar_thermal_notify() thermal: rcar: add interrupt support thermal: rcar: add read/write functions for common/priv data thermal: rcar: multi channel support thermal: rcar: use mutex lock instead of spin lock thermal: rcar: enable CPCTL to use hardware TSC deciding thermal: rcar: use parenthesis on macro Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared Thermal: fix a wrong comment thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation PM: intel_powerclamp: off by one in start_power_clamp() thermal: exynos: Miscellaneous fixes to support falling threshold interrupt ...
| * thermal: sysfs: Add a new sysfs node emul_temp for thermal emulationAmit Daniel Kachhap2013-02-061-0/+13
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * PM: Introduce Intel PowerClamp DriverJacob Pan2013-02-061-0/+307
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: Use thermal zone device id in netlink messagesEduardo Valentin2013-01-161-2/+3
| | | | | | | | | | | | | | | | | | | | | | This patch changes the function thermal_generate_netlink_event to receive a thermal zone device instead of a originator id. This way, the messages will always be bound to a thermal zone. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Thermal: exynos: Add sysfs node supporting exynos's emulation mode.Jonghwa Lee2013-01-041-0/+53
| | | | | | | | | | | | | | | | | | | | | | | | This patch supports exynos's emulation mode with newly created sysfs node. Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit. Thermal emulation mode supports software debug for TMU's operation. User can set temperature manually with software code and TMU will read current temperature from user value not from sensor's value. This patch includes also documentary placed under Documentation/thermal/. Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | drm/nouveau/hwmon: s/fan0/fan1/Ben Skeggs2013-02-201-1/+1
| | | | | | | | | | | | Fan speed info now shown by sensors. Signed-off-by: Ben Skeggs <bskeggs@redhat.com>
* | drm/nouveau/doc: document the sysfs thermal management interfaceMartin Peres2013-02-201-0/+81
|/ | | | | Signed-off-by: Martin Peres <martin.peres@labri.fr> Signed-off-by: Ben Skeggs <bskeggs@redhat.com>
* Thermal: Add documentation for platform layer dataDurgadoss R2012-11-051-0/+64
| | | | | | | | | This patch adds documentation for thermal_bind_params and thermal_zone_params structures. Also, adds details on EXPORT_SYMBOL APIs. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap2012-09-241-0/+52
| | | | | | | | | | | | | | | | | | | This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap2012-09-241-0/+32
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: set upper and lower limitsZhang Rui2012-09-241-1/+8
| | | | | | | | | set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Documentation updateZhang Rui2012-07-241-10/+10
| | | | | | | | | | With commit 6503e5df08008b9a47022b5e9ebba658c8fa69af, the value of /sys/class/thermal/thermal_zoneX/mode has been changed from user/kernel to enabled/disabled. Update the documentation so that users won't be confused. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* Thermal: Add Hysteresis attributesDurgadoss R2012-07-241-0/+6
| | | | | | | | | | | | | | The Linux Thermal Framework does not support hysteresis attributes. Most thermal sensors, today, have a hysteresis value associated with trip points. This patch adds hysteresis attributes on a per-trip-point basis, to the Thermal Framework. These attributes are optionally writable. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* Thermal: Make Thermal trip points writeableDurgadoss R2012-07-241-1/+3
| | | | | | | | | | | | Some of the thermal drivers using the Generic Thermal Framework require (all/some) trip points to be writeable. This patch makes the trip point temperatures writeable on a per-trip point basis, and modifies the required function call in thermal.c. This patch also updates the Documentation to reflect the new change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: Rename generate_netlink_eventJean Delvare2012-01-231-1/+1
| | | | | | | | | | | | It doesn't seem right for the thermal subsystem to export a symbol named generate_netlink_event. This function is thermal-specific and its name should reflect that fact. Rename it to thermal_generate_netlink_event. Signed-off-by: Jean Delvare <khali@linux-fr.org> Acked-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: Add event notification to thermal frameworkR.Durgadoss2011-01-121-0/+12
| | | | | | | | | This patch adds event notification support to the generic thermal sysfs framework in the kernel. The notification is in the form of a netlink event. Signed-off-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: add sanity check for the passive attributeFrans Pop2009-11-051-0/+1
| | | | | | | | | | | | | | | | | | | | | | | Values below 1000 milli-celsius don't make sense and can cause the system to go into a thermal heart attack: the actual temperature will always be lower and thus the system will be throttled down to its lowest setting. An additional problem is that values below 1000 will show as 0 in /proc/acpi/thermal/TZx/trip_points:passive. cat passive 0 echo -n 90 >passive bash: echo: write error: Invalid argument echo -n 90000 >passive cat passive 90000 Signed-off-by: Frans Pop <elendil@planet.nl> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: sysfs-api.txt - document passive attribute for thermal zonesFrans Pop2009-11-051-0/+9
| | | | | | | Signed-off-by: Frans Pop <elendil@planet.nl> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: sysfs-api.txt - reformat for improved readabilityFrans Pop2009-11-051-188/+192
| | | | | | | | | | The document currently uses large indentations which make the text too wide for easy readability. Also improve general consistency. Signed-off-by: Frans Pop <elendil@planet.nl> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: update the documentationZhang Rui2008-04-291-6/+27
| | | | | | | | | | Update the documentation for the thermal driver hwmon sys I/F. Change the ACPI thermal zone type to be consistent with hwmon. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: fix generic thermal I/F for hwmonZhang, Rui2008-03-131-11/+11
| | | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* ACPI: thermal: syntax, spelling, kernel-docLen Brown2008-02-071-12/+11
| | | | | Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
* the generic thermal sysfs driverZhang Rui2008-02-011-0/+246
The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
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