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* thermal: core: introduce thermal_helpers.cEduardo Valentin2016-11-231-1/+2
| | | | | | | | | | | | Here we have a simple code organization. This patch moves functions that do not need to handle thermal core internal data structure to thermal_helpers.c file. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: core: move thermal_zone sysfs to thermal_sysfs.cEduardo Valentin2016-11-231-1/+1
| | | | | | | | | | | | | This is a code reorganization, simply to concentrate the code handling sysfs in a specific file: thermal_sysfs.c. Right now, moving only the sysfs entries of thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
*-. Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and ↵Zhang Rui2016-09-271-0/+1
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| | * thermal: add Intel BXT WhiskeyCove PMIC thermal driverBin Gao2016-09-061-0/+1
| |/ | | | | | | | | | | | | | | | | | | | | This change adds support for Intel BXT Whiskey Cove PMIC thermal driver which is intended to handle the alert interrupts triggered upon thermal trip point cross and notify the thermal framework appropriately with the zone, temp, crossed trip and event details. Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com> Signed-off-by: Bin Gao <bin.gao@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: max77620: Add thermal driver for reporting junction tempLaxman Dewangan2016-09-271-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | Maxim Semiconductor Max77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add thermal driver to register PMIC die temperature as thermal zone sensor and capture the die temperature warning interrupts to notifying the client. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: qoriq: Add thermal management supportJia Hongtao2016-09-271-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: qcom: tsens: Add a skeletal TSENS driversRajendra Nayak2016-09-271-0/+1
|/ | | | | | | | | | | | | | | | | | | | TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Reviewed-by: Lina Iyer <lina.iyer@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: generic-adc: Add ADC based thermal sensor driverLaxman Dewangan2016-05-171-0/+1
| | | | | | | | | | | | | | | In some of platform, thermal sensors like NCT thermistors are connected to the one of ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC. Lookup table for ADC read value to temperature is referred to get temperature. ADC is read via IIO framework. Add support for thermal sensor driver which read the voltage across sensor resistance from ADC through IIO framework. Acked-by: Jonathan Cameron <jic23@kernel.org> Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: add temperature sensor support for tango SoCMarc Gonzalez2016-05-171-0/+1
| | | | | | | | | | | The Tango thermal driver provides support for the primitive temperature sensor embedded in Tango chips since the SMP8758. This sensor only generates a 1-bit signal to indicate whether the die temperature exceeds a programmable threshold. Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: tegra: move tegra thermal files into tegra directoryWei Ni2016-05-171-1/+1
| | | | | | | | | | Move Tegra soctherm driver to tegra directory, it's easy to maintain and add more new function support for Tegra platforms. This will also help to split soctherm driver into common parts and chip specific data related parts. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add Mediatek thermal controller supportSascha Hauer2016-02-181-0/+1
| | | | | | | | | | | | This adds support for the Mediatek thermal controller found on MT8173 and likely other SoCs. The controller is a bit special. It does not have its own ADC, instead it controls the on-SoC AUXADC via AHB bus accesses. For this reason we need the physical address of the AUXADC. Also it controls a mux using AHB bus accesses, so we need the APMIXEDSYS physical address aswell. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add devfreq coolingØrjan Eide2015-10-301-0/+3
| | | | | | | | | | | | | | Add a generic thermal cooling device for devfreq, that is similar to cpu_cooling. The device must use devfreq. In order to use the power extension of the cooling device, it must have registered its OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Ørjan Eide <orjan.eide@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add Intel PCH thermal driverTushar Dave2015-08-041-0/+1
| | | | | | | | | | This change adds a thermal driver for Wildcat Point platform controller hub. This driver register PCH thermal sensor as a thermal zone and associate critical and hot trips if present. Signed-off-by: Tushar Dave <tushar.n.dave@intel.com> Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branches 'release' and 'thermal-soc' of .git into nextZhang Rui2015-06-111-0/+3
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| * thermal: hisilicon: add new hisilicon thermal sensor driverkongxinwei2015-06-031-0/+1
| | | | | | | | | | | | | | | | | | | | This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: introduce the Power Allocator governorJavi Merino2015-05-041-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: Add QPNP PMIC temperature alarm driverIvan T. Ivanov2015-05-041-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: intel Quark SoC X1000 DTS thermal driverOng, Boon Leong2015-05-011-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS). The DTS offers both hot & critical trip points. However, in current distribution of UEFI BIOS for Quark platform, only critical trip point is configured to be 105 degree Celsius (based on Quark SW ver1.0.1 and hot trip point is not used due to lack of IRQ. There is no active cooling device for Quark SoC, so Quark SoC thermal management logic expects Linux distro to orderly power-off when temperature of the DTS exceeds the configured critical trip point. Kernel param "polling_delay" in milliseconds is used to control the frequency the DTS temperature is read by thermal framework. It defaults to 2-second. To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X". User interacts with Quark SoC DTS thermal driver through sysfs via: /sys/class/thermal/thermal_zone0/ For example: - to read DTS temperature $ cat temp - to read critical trip point $ cat trip_point_0_temp - to read trip point type $ cat trip_point_0_type - to emulate temperature raise to test orderly shutdown by Linux distro $ echo 105 > emul_temp Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com> Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: Intel SoC: DTS thermal IOSF coreSrinivas Pandruvada2015-05-011-0/+1
|/ | | | | | | | | | | This is becoming a common feature for Intel SoCs to expose the additional digital temperature sensors (DTSs) using side band interface (IOSF). This change remove common IOSF DTS handler function from the existing driver intel_soc_dts_thermal.c and creates a stand alone module, which can be selected from the SoC specific drivers. In this way there is less code duplication. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* thermal: rockchip: add driver for thermalCaesar Wang2014-11-241-0/+1
| | | | | | | | | | | | | | | | | | | | Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add Tegra SOCTHERM thermal management driverMikko Perttunen2014-11-201-0/+1
| | | | | | | | | This adds support for the Tegra SOCTHERM thermal sensing and management system found in the Tegra124 system-on-chip. This initial driver supports temperature polling for four thermal zones. Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: introduce clock cooling deviceEduardo Valentin2014-11-201-0/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'int340x-thermal' of .git into nextZhang Rui2014-10-171-1/+1
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| * Thermal: introduce int3403 thermal driverLan Tianyu2014-10-111-1/+0
| | | | | | | | | | | | | | | | | | | | | | | | ACPI INT3403 device object can be used to retrieve temperature date from temperature sensors present in the system, and to expose device' performance control. The previous INT3403 thermal driver supports temperature reporting only, thus remove it and introduce this new & enhanced one. Signed-off-by: Lan Tianyu <tianyu.lan@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Thermal: introduce int3400 thermal driverZhang Rui2014-10-101-0/+1
| | | | | | | | | | | | | | Introduce int3400 thermal driver. And make INT3400 driver enumerate the other int340x thermal components shown in _ART/_TRT. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: Added Bang-bang thermal governorPeter Feuerer2014-08-271-0/+1
|/ | | | | | | | | | | | | | | | | | The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: sti: Introduce ST Thermal core codeLee Jones2014-07-151-0/+1
| | | | | | | | | | This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Intel SoC DTS thermalSrinivas Pandruvada2014-05-151-0/+1
| | | | | | | | | | | | | | | | | | | | | | In the Intel SoCs like Bay Trail, there are 2 additional digital temperature sensors(DTS), in addition to the standard DTSs in the core. Also they support 4 programmable thresholds, out of which two can be used by OSPM. These thresholds can be used by OSPM thermal control. Out of these two thresholds, one is used by driver and one user mode can change via thermal sysfs to get notifications on threshold violations. The driver defines one critical trip points, which is set to TJ MAX - offset. The offset can be changed via module parameter (default 5C). Also it uses one of the thresholds to get notification for this temperature violation. This is very important for orderly shutdown as the many of these devices don't have ACPI thermal zone, and expects that there is some other thermal control mechanism present in OSPM. When a Linux distro is used without additional specialized thermal control program, BIOS can do force shutdown when thermals are not under control. When temperature reaches critical, the Linux thermal core will initiate an orderly shutdown. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
*-. Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git ↵Zhang Rui2014-01-021-0/+2
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| | * Thermal: ACPI INT3403 thermal driverSrinivas Pandruvada2014-01-021-0/+1
| |/ |/| | | | | | | | | | | | | | | | | The ACPI INT3403 device objects present on some systems can be used to retrieve temperature data from thermal sensors. Add a driver registering each INT3403 device object as a thermal zone device and exposing its _TMP, PATx and GTSH method via the standard thermal control interface under /sys/class/thermal/. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: introduce device tree parserEduardo Valentin2013-12-041-0/+1
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: hwmon: move hwmon support to single fileEduardo Valentin2013-09-031-0/+3
| | | | | | | | | | | | | | | | | | In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
*-. Merge branches 'exynos', 'imx' and 'fixes' of .git into nextZhang Rui2013-08-151-0/+1
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| * | thermal: add imx thermal driver supportShawn Guo2013-08-131-0/+1
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* / thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap2013-08-131-1/+1
|/ | | | | | | | | | | | This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge branch 'cpu-package-thermal' of .git into nextZhang Rui2013-06-181-0/+1
|\ | | | | | | | | | | Conflicts: drivers/thermal/Kconfig drivers/thermal/Makefile
| * Thermal: CPU Package temperature thermalSrinivas Pandruvada2013-06-181-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | This driver register CPU digital temperature sensor as a thermal zone at package level. Each package will show up as one zone with at max two trip points. These trip points can be both read and updated. Once a non zero value is set in the trip point, if the package package temperature goes above or below this setting, a thermal notification is generated. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: introduce TI SoC thermal driverEduardo Valentin2013-05-281-1/+1
|/ | | | | | | | | | | | | | | | | | | | | | This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: build cpu_cooling code into thermal_sys moduleZhang Rui2013-04-141-1/+1
| | | | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
* Thermal: build thermal governors into thermal_sys moduleZhang Rui2013-04-141-3/+3
| | | | | | | | | | | | | | | | | The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
* Thermal: rename thermal_sys.c to thermal_core.cZhang Rui2013-04-141-0/+1
| | | | | | | | | | | this is the preparation work to build all the thermal core framework source file, like governors, cpu cooling, etc, into one module. No functional change in this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
* thermal: Add driver for Armada 370/XP SoC thermal managementEzequiel Garcia2013-04-021-0/+1
| | | | | | | | | | | | | | | | | | | This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: rename thermal governor Kconfig option to avoid generic namingZhang Rui2013-02-081-3/+3
| | | | | | | | | | | | Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Dove: Add Themal sensor support for Dove.Andrew Lunn2013-02-081-0/+1
| | | | | | | | | The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add support for the thermal sensor on Kirkwood SoCsNobuhiro Iwamatsu2013-02-081-0/+1
| | | | | | | | This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* PM: Introduce Intel PowerClamp DriverJacob Pan2013-02-061-0/+2
| | | | | | | | | | | | | | | | Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang2012-11-151-0/+2
| | | | | | | | | | | | | | This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* drivers/thermal/Makefile refactorZhang Rui2012-11-151-6/+12
| | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add a thermal notifier for user spaceDurgadoss R2012-11-051-0/+1
| | | | | | | | | | This patch registers a governor which will let the user land manage the platform thermals. Whenever a trip happens, this governor just notifies the user space using kobj_uevent(). Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Introduce a step_wise thermal governorDurgadoss R2012-11-051-0/+1
| | | | | | | | | | | | | | This patch adds a simple step_wise governor to the generic thermal layer. This algorithm throttles the cooling devices in a linear fashion. If the 'trend' is heating, it throttles by one step. And if the thermal trend is cooling it de-throttles by one step. This actually moves the throttling logic from thermal_sys.c and puts inside step_wise.c, without any change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
generated by cgit v1.2.3 (git 2.25.1) at 2024-10-02 12:08:44 +0000