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* Merge branch 'next' of ↵Linus Torvalds2014-01-242-1/+2
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "This time, the biggest change is the work of representing hardware thermal properties in device tree infrastructure. This work includes the introduction of a device tree bindings for describing the hardware thermal behavior and limits, and also a parser to read and interpret the data, and build thermal zones and thermal binding parameters. It also contains three examples on how to use the new representation on sensor devices, using three different drivers to accomplish it. One driver is in thermal subsystem, the TI SoC thermal, and the other two drivers are in hwmon subsystem. Actually, this would be the first step of the complete work because we still need to check other potential drivers to be converted and then validate the proposed API. But the reason why I include it in this pull request is that, first, this change does not hurt any others without using this approach, second, the principle and concept of this change would not break after converting the remaining drivers. BTW, as you can see, there are several points in this change that do not belong to thermal subsystem. Because it has been suggested by Guenter R that in such cases, it is recommended to send the complete series via one single subsystem. Specifics: - representing hardware thermal properties in device tree infrastructure - fix a regression that the imx thermal driver breaks system suspend. - introduce ACPI INT3403 thermal driver to retrieve temperature data from the INT3403 ACPI device object present on some systems. - introduce debug statement for thermal core and step_wise governor. - assorted fixes and cleanups for thermal core, cpu cooling, exynos thrmal, intel powerclamp and imx thermal driver" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits) thermal: remove const flag from .ops of imx thermal Thermal: update thermal zone device after setting emul_temp intel_powerclamp: Fix cstate counter detection. thermal: imx: add necessary clk operation Thermal cpu cooling: return error if no valid cpu frequency entry thermal: fix cpu_cooling max_level behavior thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST thermal: debug: add debug statement for core and step_wise thermal: imx_thermal: add module device table drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c thermal:samsung: fix compilation warning thermal: imx: correct suspend/resume flow thermal: exynos: fix error return code Thermal: ACPI INT3403 thermal driver MAINTAINERS: add thermal bindings entry in thermal domain arm: dts: make OMAP4460 bandgap node to belong to OCP arm: dts: make OMAP443x bandgap node to belong to OCP arm: dts: add cooling properties on omap5 cpu node arm: dts: add omap5 thermal data arm: dts: add omap5 CORE thermal data ...
| * thermal:samsung: fix compilation warningNaveen Krishna Chatradhi2014-01-021-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | This patch fixes a compilation warning. warning: passing argument 5 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *' but argument is of type 'const struct thermal_zone_device_ops *' Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: exynos: fix error return codeJulia Lawall2014-01-021-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Set the return variable to an error code as done elsewhere in the function. A simplified version of the semantic match that finds this problem is as follows: (http://coccinelle.lip6.fr/) // <smpl> ( if@p1 (\(ret < 0\|ret != 0\)) { ... return ret; } | ret@p1 = 0 ) ... when != ret = e1 when != &ret *if(...) { ... when != ret = e2 when forall return ret; } // </smpl> Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr> Reviewed-by: Jingoo Han <jg1.han@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: exynos: boost: Automatic enable/disable of BOOST feature (at ↵Lukasz Majewski2014-01-171-6/+6
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Exynos4412) This patch provides auto disable/enable operation for boost. It uses already present thermal infrastructure to provide BOOST hysteresis. The TMU data is modified to work properly with or without BOOST. Hence, the two first trip points with corresponding clip frequencies are adjusted. The first one is reduced from 85 to 70 degrees and the clip frequency is increased to 1.4 GHz from 800 MHz. This trip point is in fact responsible for providing BOOST hysteresis. When temperature exceeds 70 deg, the maximal non BOOST frequency for Exynos4412 is imposed. Since the first trigger level has been "stolen" for BOOST, the second one needs to be a compromise for the previously used two for non BOOST configuration. The 95 deg with modified clip freq (to 400 MHz) should provide a good balance between cooling down the overheated device and throughput on an acceptable level. Two last trigger levels are not modified since, they cause platform shutdown on emergency overheat to happen. The third trip point passage results in SW managed shut down of the system. If the last trip point is crossed, the PMU HW generates the power off signal. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Myungjoo Ham <myungjoo.ham@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Zhang Rui <rui.zhang@intel.com> [rjw: Changelog] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: exynos: Provide initial setting for TMU's test MUX address at ↵Lukasz Majewski2013-10-154-0/+13
| | | | | | | | | | | | | | | | | Exynos4412 The commit d0a0ce3e77c795258d47f9163e92d5031d0c5221 ("thermal: exynos: Add missing definations and code cleanup") has removed setting of test MUX address value at TMU configuration setting. This field is not present on Exynos4210 and Exynos5 SoCs. However on Exynos4412 SoC it is required to set this field after reset because without it TMU shows maximal available temperature, which causes immediate platform shutdown. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Provide separate TMU data for Exynos4412Lukasz Majewski2013-10-154-12/+37
| | | | | | | | | | | | | | | | | | Up till now Exynos5250 and Exynos4412 had the same definitions for TMU data. Following commit changes that, by introducing separate exynos4412_default_tmu_data structure. Since Exynos4412 was chronologically first, the corresponding name for TMU registers and default data was renamed. Additionally, new SOC_ARCH_EXYNOS4412 type has been defined. Moreover, the SOC_ARCH_EXYNOS name has been changed to SOC_ARCH_EXYNOS5250. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Remove check for thermal device pointer at ↵Lukasz Majewski2013-10-151-2/+0
| | | | | | | | | | | | | | | | | | | | | | | exynos_report_trigger() The commit 4de0bdaa9677d11406c9becb70c60887c957e1f0 ("thermal: exynos: Add support for instance based register/unregister") broke check for presence of therm_dev at global thermal zone in exynos_report_trigger(). The resulting wrong test prevents thermal_zone_device_update() call, which calls handlers for situation when trip points are passed. Such behavior prevents thermal driver from proper reaction (when TMU interrupt is raised) in a situation when overheating is detected at TMU hardware. It turns out, that after exynos thermal subsystem redesign (at v3.12) this check is not needed, since it is not possible to register thermal zone without valid thermal device. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Clean up non-DT remnantsSachin Kamat2013-08-292-19/+13
| | | | | | | | | Commit 1cd1ecb6 ("thermal: exynos: Remove non DT based support") cleaned up some non-DT code. However, there were few more things needed for complete cleanup to make this driver DT only. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Fix potential NULL pointer dereferenceSachin Kamat2013-08-291-3/+3
| | | | | | | | NULL pointer was being dereferenced in its own error message. Changed it to the correct device pointer. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Fix typos in KconfigSachin Kamat2013-08-291-5/+5
| | | | | | | Fixes some trivial typos. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos_tmu: fix wrong error check for mapped memoryNaveen Krishna Chatradhi2013-08-151-1/+1
| | | | | | | | The error check is checking for a "base" mapped memory base instead of "base_common". Fixing the same. Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: exynos: Support for TMU regulator defined at device treeAmit Daniel Kachhap2013-08-131-0/+23
| | | | | | | | | | | | | TMU probe function now checks for a device tree defined regulator. For compatibility reasons it is allowed to probe driver even without this regulator defined. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add hardware mode thermal calibration supportAmit Daniel Kachhap2013-08-134-1/+44
| | | | | | | | | | | This patch adds support for h/w mode calibration in the TMU controller. Soc's like 5440 support this features. The h/w bits needed for calibration setting are same as that of enum calibration_type. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Fix to set the second point correction valueAmit Daniel Kachhap2013-08-131-4/+9
| | | | | | | | | | | This patch sets the second point trimming value according to the platform data if the register value is 0. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add thermal configuration data for exynos5440 TMU sensorAmit Daniel Kachhap2013-08-133-0/+82
| | | | | | | | | | | This patch adds configuration data for exynos5440 soc. Also register definations for the controller are added. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add driver support for exynos5440 TMU sensorAmit Daniel Kachhap2013-08-134-9/+90
| | | | | | | | | | | | | | | This patch modifies TMU controller to add changes needed to work with exynos5440 platform. This sensor registers 3 instance of the tmu controller with the thermal zone and hence reports 3 temperature output. This controller supports upto five trip points. For critical threshold the driver uses the core driver thermal framework for shutdown. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Jungseok Lee <jays.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add support to access common register for multistanceAmit Daniel Kachhap2013-08-131-0/+20
| | | | | | | | | | | | This patch adds support to parse one more common set of TMU register. First set of register belongs to each instance of TMU and second set belongs to common TMU registers. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: use device resource management infrastructureAmit Daniel Kachhap2013-08-131-13/+23
| | | | | | | | | | | This patch uses the device pointer stored in the configuration structure and converts to dev_* prints and devm API's. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add TMU features to check instead of using SOC typeAmit Daniel Kachhap2013-08-133-11/+52
| | | | | | | | | | | | | This patch adds several features supported by TMU as bitfields. This features varies across different SOC type and comparing the features present in the TMU is more logical than comparing the soc itself. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add support to handle many instances of TMUAmit Daniel Kachhap2013-08-135-118/+203
| | | | | | | | | | | | | | | | | This patch adds support to handle multiple instances of the TMU controllers. This is done by removing the static structure to register with the core thermal and creating it dynamically for each instance of the TMU controller. The interrupt is made shared type to handle shared interrupts. Now since the ISR needs the core thermal framework to be registered so request_irq is moved after the core registration is done. Also the identifier of the TMU controller is extracted from device tree alias. This will be used for TMU specific initialisation. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Remove non DT based supportAmit Daniel Kachhap2013-08-131-16/+1
| | | | | | | | | | | Recently non DT support from Exynos platform is removed and hence removing non DT support from the driver also. This will help in easy maintainence. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Make the zone handling use trip informationAmit Daniel Kachhap2013-08-133-28/+47
| | | | | | | | | | | This code simplifies the zone handling to use the trip information passed by the TMU driver and not the hardcoded macros. This also helps in adding more zone support. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Return success even if no cooling data suppliedAmit Daniel Kachhap2013-08-131-2/+2
| | | | | | | | | | | This patch removes the error return in the bind/unbind routine as the platform may not register any cpufreq cooling data. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Modify private_data to appropriate name driver_dataAmit Daniel Kachhap2013-08-133-4/+4
| | | | | | | | | | | | This patch renames member private_data to driver_data of the thermal zone registration structure as this item stores the driver related data and uses it to call the driver related callbacks. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add support for instance based register/unregisterAmit Daniel Kachhap2013-08-133-26/+49
| | | | | | | | | | | | This code modifies the thermal driver to have multiple thermal zone support by replacing the global thermal zone variable with device data member of thermal_zone_device. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Fix to clear only the generated interruptsAmit Daniel Kachhap2013-08-132-6/+7
| | | | | | | | | | | This patch uses the TMU status register to know the generated interrupts and only clear them in the interrupt handler. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Support thermal trippingAmit Daniel Kachhap2013-08-133-5/+44
| | | | | | | | | | | | | TMU urgently sends active-high signal (thermal trip) to PMU, and thermal tripping by hardware logic. Thermal tripping means that PMU cuts off the whole power of SoC by controlling external voltage regulator. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Move register definitions from driver to data fileAmit Daniel Kachhap2013-08-134-117/+315
| | | | | | | | | | | | This patch migrates the TMU register definition/bitfields to data file. This is needed to support SoC's which use the same TMU controller but register validity, offsets or bitfield may slightly vary across SOC's. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add extra entries in the tmu platform dataAmit Daniel Kachhap2013-08-134-48/+85
| | | | | | | | | | | | | | | This patch adds entries min_efuse_value, max_efuse_value, default_temp_offset, trigger_type, cal_type, trim_first_point, trim_second_point, max_trigger_level trigger_enable in the TMU platform data structure. Also the driver is modified to use the data passed by these new platform memebers instead of the constant macros. All these changes helps in separating the SOC specific data part from the TMU driver. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Add missing definations and code cleanupAmit Daniel Kachhap2013-08-131-16/+46
| | | | | | | | | | | | | This patch adds some extra register bitfield definations and cleans up the code to prepare for moving register macros and definations inside the TMU data section. In this code cleanup the TMU enable bit is correctly used as bit0 and bit1 is taken care which is reserve bit. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Bifurcate exynos tmu driver and configuration dataAmit Daniel Kachhap2013-08-135-65/+126
| | | | | | | | | | | This code splits the exynos tmu driver code into SOC specific data parts. This will simplify adding new SOC specific data to the same TMU controller. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Move exynos_thermal.h from include/* to driver/* folderAmit Daniel Kachhap2013-08-134-2/+124
| | | | | | | | | | | | | | | | This patch renames and moves include/linux/platform_data/exynos_thermal.h to drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos SOC's are not supporting non-DT based platforms and this file now just contains exynos tmu driver related definations. Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes the compilation issue occuring because now this new tmu header file is included in tmu driver c file and not in the common thermal header file. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Rename exynos_thermal.c to exynos_tmu.cAmit Daniel Kachhap2013-08-132-4/+4
| | | | | | | | | | | | This patch renames exynos_thermal.c to exynos_tmu.c. This change is needed as this file now just contains exynos tmu driver related codes and thermal zone or cpufreq cooling registration related changes are not there anymore. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Bifurcate exynos thermal common and tmu controller codeAmit Daniel Kachhap2013-08-135-419/+491
| | | | | | | | | | | | | This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Remove un-necessary CPU_THERMAL dependencyAmit Daniel Kachhap2013-08-131-1/+0
| | | | | | | | | | | | This patch removes the dependency on CPU_THERMAL for compiling TMU driver. This is useful for cases when only TMU controller needs to be initialised without cpu cooling action. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Use ARCH_HAS_BANDGAP config to know the supported soc'sAmit Daniel Kachhap2013-08-131-1/+1
| | | | | | | | | | | | | This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable the TMU driver. This will allow adding support for new soc easily as now it is the platform responsibility to enable this config symbol for a particular soc. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap2013-08-133-0/+1072
This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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