summaryrefslogtreecommitdiffstats
path: root/drivers/thermal/ti-soc-thermal
Commit message (Collapse)AuthorAgeFilesLines
* Merge branch 'next' of ↵Linus Torvalds2015-06-252-56/+53
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "Specifics: - enhance Thermal Framework with several new capabilities: * use power estimates * compute weights with relative integers instead of percentages * allow governors to have private data in thermal zones * export thermal zone parameters through sysfs Thanks to the ARM thermal team (Javi, Punit, KP). - introduce a new thermal governor: power allocator. First in kernel closed loop PI(D) controller for thermal control. Thanks to ARM thermal team. - enhance OF thermal to allow thermal zones to have sustainable power HW specification. Thanks to Punit. - introduce thermal driver for Intel Quark SoC x1000platform. Thanks to Ong, Boon Leong. - introduce QPNP PMIC temperature alarm driver. Thanks to Ivan T. I. - introduce thermal driver for Hisilicon hi6220. Thanks to kongxinwei. - enhance Exynos thermal driver to handle Exynos5433 TMU. Thanks to Chanwoo C. - TI thermal driver now has a better implementation for EOCZ bit. From Pavel M. - add id for Skylake processors in int340x processor thermal driver. - a couple of small fixes and cleanups." * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits) thermal: hisilicon: add new hisilicon thermal sensor driver dt-bindings: Document the hi6220 thermal sensor bindings thermal: of-thermal: add support for reading coefficients property thermal: support slope and offset coefficients thermal: power_allocator: round the division when divvying up power thermal: exynos: Add the support for Exynos5433 TMU thermal: cpu_cooling: Fix power calculation when CPUs are offline thermal: cpu_cooling: Remove cpu_dev update on policy CPU update thermal: export thermal_zone_parameters to sysfs thermal: cpu_cooling: Check memory allocation of power_table ti-soc-thermal: request temperature periodically if hw can't do that itself ti-soc-thermal: implement eocz bit to make driver useful on omap3 cleanup ti-soc-thermal thermal: remove stale THERMAL_POWER_ACTOR select thermal: Default OF created trip points to writable thermal: core: Add Kconfig option to enable writable trips thermal: x86_pkg_temp: drop const for thermal_zone_parameters of: thermal: Introduce sustainable power for a thermal zone thermal: add trace events to the power allocator governor thermal: introduce the Power Allocator governor ...
| * ti-soc-thermal: request temperature periodically if hw can't do that itselfPavel Machek2015-05-041-0/+8
| | | | | | | | | | | | | | When periodic mode is not enabled, it is neccessary to force reads. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * ti-soc-thermal: implement eocz bit to make driver useful on omap3Pavel Machek2015-05-041-6/+18
| | | | | | | | | | | | | | | | For omap3, proper implementation of eocz bit is needed. It was actually a TODO in the driver. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * cleanup ti-soc-thermalPavel Machek2015-05-042-49/+25
| | | | | | | | | | | | | | | | | | | | | | Simplify code by removing goto's where they point to simple return. Avoid confusing |= on error values. Correct whitespace. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: of: fix cooling device weights in device treeKapileshwar Singh2015-05-041-1/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: ti-soc-thermal: OMAP5: Implement Workaround for Errata i813Keerthy2015-05-083-3/+45
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | DESCRIPTION Spurious Thermal Alert: Talert can happen randomly while the device remains under the temperature limit defined for this event to trig. This spurious event is caused by a incorrect re-synchronization between clock domains. The comparison between configured threshold and current temperature value can happen while the value is transitioning (metastable), thus causing inappropriate event generation. No spurious event occurs as long as the threshold value stays unchanged. Spurious event can be generated while a thermal alert threshold is modified in CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n. WORKAROUND Spurious event generation can be avoided by performing following sequence when the threshold is modified: 1. Mask the hot/cold events at the thermal IP level. 2. Modify Threshold. 3. Unmask the hot/cold events at the thermal IP level. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: ti-soc-thermal: dra7: Implement Workaround for Errata i814Keerthy2015-05-083-2/+42
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Bandgap Temperature read Dtemp can be corrupted DESCRIPTION Read accesses to registers listed below can be corrupted due to incorrect resynchronization between clock domains. Read access to registers below can be corrupted : • CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4) • CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n WORKAROUND Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]: BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and read right value: 1. Perform two successive reads to BGAP_DTEMP bit field. (a) If read1 returns Val1 and read2 returns Val1, then right value is Val1. (b) If read1 returns Val1, read 2 returns Val2, a third read is needed. 2. Perform third read (a) If read3 returns Val2 then right value is Val2. (b) If read3 returns Val3, then right value is Val3. The above in gist means if val1 and val2 are the same then we can go ahead with that value else we need a third read which will be right since synchronization will be complete by then. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* ti-soc-thermal: Delete an unnecessary check before the function call ↵Markus Elfring2015-02-241-1/+1
| | | | | | | | | | | | "cpufreq_cooling_unregister" The cpufreq_cooling_unregister() function tests whether its argument is NULL and then returns immediately. Thus the test around the call is not needed. This issue was detected by using the Coccinelle software. Signed-off-by: Markus Elfring <elfring@users.sourceforge.net> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: ti-soc-thermal: bandgap: Fix build warning if !CONFIG_PM_SLEEPGrygorii Strashko2015-02-241-1/+1
| | | | | | | | | | | | | | Fix following build warning if CONFIG_PM_SLEEP is not set: drivers/thermal/ti-soc-thermal/ti-bandgap.c:1478:12: warning: 'ti_bandgap_suspend' defined but not used [-Wunused-function] static int ti_bandgap_suspend(struct device *dev) ^ drivers/thermal/ti-soc-thermal/ti-bandgap.c:1492:12: warning: 'ti_bandgap_resume' defined but not used [-Wunused-function] static int ti_bandgap_resume(struct device *dev) ^ Acked-by: Nishanth Menon <nm@ti.com> Signed-off-by: Grygorii Strashko <Grygorii.Strashko@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'fixes' of ↵Zhang Rui2014-12-211-9/+8
|\ | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
| * thermal: ti-soc-thermal: Do not print error message in the EPROBE_DEFER caseEduardo Valentin2014-12-121-3/+8
| | | | | | | | | | | | | | | | | | | | Avoid printing the error message in the EPROBE_DEFER case where registering cpu cooling at ti-soc-thermal thermal driver. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: cpu_cooling: check for the readiness of cpufreq layerEduardo Valentin2014-12-081-6/+0
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In this patch, the cpu_cooling code checks for the usability of cpufreq layer before proceeding with the CPU cooling device registration. The main reason is: CPU cooling device is not usable if cpufreq cannot switch frequencies. Similar checks are spread in thermal drivers. Thus, the advantage now is to have the check in a single place: cpu cooling device registration. For this reason, this patch also updates the existing drivers that depend on CPU cooling to simply propagate the error code of the cpu cooling registration call. Therefore, in case cpufreq is not ready, the thermal drivers will still return -EPROBE_DEFER, in an attempt to try again when cpufreq layer gets ready. Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: of: improve of-thermal sensor registration APIEduardo Valentin2014-11-201-2/+6
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Different drivers request API extensions in of-thermal. For this reason, additional callbacks are required to fit the new drivers needs. The current API implementation expects the registering sensor driver to provide a get_temp and get_trend callbacks as function parameters. As the amount of callbacks is growing, this patch changes the existing implementation to use a .ops field to hold all the of thermal callbacks to sensor drivers. This patch also changes the existing of-thermal users to fit the new API design. No functional change is introduced in this patch. Cc: Alexandre Courbot <gnurou@gmail.com> Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Guenter Roeck <linux@roeck-us.net> Cc: Jean Delvare <jdelvare@suse.de> Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-tegra@vger.kernel.org Cc: lm-sensors@lm-sensors.org Cc: Rob Herring <robh+dt@kernel.org> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Alexandre Courbot <acourbot@nvidia.com> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: ti-soc-thermal: ti-bandgap.c: Cleaning up wrong address is checkedRickard Strandqvist2014-07-011-1/+1
| | | | | | | Wrong address is checked after memory allocation. Signed-off-by: Rickard Strandqvist <rickard_strandqvist@spectrumdigital.se> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: clk_round_rate() can return a zero upon errorPaul Walmsley2014-05-061-1/+1
| | | | | | | | | | | | | | | | | | | | | Treat both negative and zero return values from clk_round_rate() as errors. This is needed since subsequent patches will convert clk_round_rate()'s return value to be an unsigned type, rather than a signed type, since some clock sources can generate rates higher than (2^31)-1 Hz. Eventually, when calling clk_round_rate(), only a return value of zero will be considered a error. All other values will be considered valid rates. The comparison against values less than 0 is kept to preserve the correct behavior in the meantime. This patch also gets rid of a comparison between unsigned and signed values; a side-benefit. Signed-off-by: Paul Walmsley <pwalmsley@nvidia.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: ti-soc-thermal: Use SIMPLE_DEV_PM_OPS macroJingoo Han2014-04-081-4/+2
| | | | | | | Use SIMPLE_DEV_PM_OPS macro in order to make the code simpler. Signed-off-by: Jingoo Han <jg1.han@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: use thermal DT infrastructureEduardo Valentin2013-12-041-15/+62
| | | | | | | | | | | | | | | | | | | | | | | | This patch improves the ti-soc-thermal driver by adding the support to build the thermal zones based on DT nodes. The driver will have two options now to build the thermal zones. The first option is the zones originally coded in this driver. So, the driver behavior will be same if there is no DT node describing the zones. The second option, when it is found a DT node with thermal data, will used the common infrastructure to build the thermal zone and bind its cooling devices. In case the driver loads thermal data using the legacy mode, this driver still adds to the system a cpufreq cooling device. Loading the thermal data from DT, the driver assumes someone else will add the cpufreq cooling device, like the cpufreq driver. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* drivers: thermal: allow ti-soc-thermal run without pcb zoneEduardo Valentin2013-10-151-0/+1
| | | | | | | | | | | | | | | This patch changes the behavior of TI SoC thermal driver when there is a PCB thermal zone. Instead of reporting an error code when reading from PCB temperature sensor fails, this patch will make the driver attempt to compose the hotspot extrapolation based on bandgap readings only. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: Ensure to compute thermal trendRanganath Krishnan2013-08-291-1/+5
| | | | | | | | | Workaround to compute thermal trend even when update interval is not set. This patch will ensure to compute the thermal trend when bandgap counter delay is not set. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: Set the bandgap mask counter delay valueRanganath Krishnan2013-08-291-0/+7
| | | | | | | | | Set the bandgap mask counter_delay with the polling_delay value on registering the thermal zone. This patch will ensure to get the correct update interval for computing the thermal trend. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensorsRanganath Krishnan2013-08-291-0/+5
| | | | | | | | Initialize MPU, GPU, CORE, DSPEVE and IVA thermal sensors of DRA752 bandgap with the counter delay mask. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: use standard GPIO DT bindingsEduardo Valentin2013-07-081-6/+2
| | | | | | | | | | | | | | | | | | This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: add dra752 chip to device tableEduardo Valentin2013-06-132-0/+11
| | | | | | | | | | | Add support to TI dra752 chips by adapting the driver device table. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: add thermal data for DRA752 chipsEduardo Valentin2013-06-135-0/+775
| | | | | | | | | | | | | | | | | | | | | This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULLEduardo Valentin2013-06-132-11/+14
| | | | | | | | | | | | | | | | | | | | This patch changes the driver to avoid the usage of IS_ERR_OR_NULL() macro. This macro can lead to dangerous results, like returning success (0) during a failure scenario (NULL pointer handling). For this reason this patch is changing the driver after revisiting the code. These are the cases: i. For cases in which IS_ERR_OR_NULL() is used for checking return values of functions that returns either PTR_ERR() or a valid pointer, it has been translated to IS_ERR() check only. ii. For cases that a NULL check is still needed, it has been translated to if (!ptr || IS_ERR(ptr)). Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: freeze FSM while computing trendEduardo Valentin2013-06-131-3/+9
| | | | | | | | | | | | | In order to read the history buffer, it is required to freeze BG FSM. This patch adds the missing piece of code to freeze the FSM and also a contention area to avoid other parts of the code to access the DTEMPs. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: remove external heat while extrapolating hotspotEduardo Valentin2013-06-131-10/+20
| | | | | | | | | | | | | | | For boards that provide a PCB sensor close to SoC junction temperature, it is possible to remove the cumulative heat reported by the SoC temperature sensor. This patch changes the extrapolation computation to consider an external sensor in the extrapolation equations. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: introduce TI SoC thermal driverEduardo Valentin2013-05-2811-0/+3499
This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
generated by cgit v1.2.3 (git 2.25.1) at 2024-12-25 17:39:58 +0000