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* Merge branch 'next' of ↵Linus Torvalds2019-05-161-3/+3
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Remove the 'module' Kconfig option for thermal subsystem framework because the thermal framework are required to be ready as early as possible to avoid overheat at boot time (Daniel Lezcano) - Fix a bug that thermal framework pokes disabled thermal zones upon resume (Wei Wang) - A couple of cleanups and trivial fixes on int340x thermal drivers (Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: drivers: thermal: processor_thermal: Downgrade error message mlxsw: Remove obsolete dependency on THERMAL=m hwmon/drivers/core: Simplify complex dependency thermal/drivers/core: Fix typo in the option name thermal/drivers/core: Remove depends on THERMAL in Kconfig thermal/drivers/core: Remove module unload code thermal/drivers/core: Remove the module Kconfig's option thermal: core: skip update disabled thermal zones after suspend thermal: make device_register's type argument const thermal: intel: int340x: processor_thermal_device: simplify to get driver data thermal/int3403_thermal: favor _TMP instead of PTYP
| * thermal: make device_register's type argument constJean-Francois Dagenais2019-05-061-3/+3
| | | | | | | | | | | | | | | | ...because it can be, the buffer is strlcpy'd into a local buffer in a thermal struct member. Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: Introduce devm_thermal_of_cooling_device_registerGuenter Roeck2019-05-141-0/+13
|/ | | | | | | | | | | | | | | | | | | thermal_of_cooling_device_register() and thermal_cooling_device_register() are typically called from driver probe functions, and thermal_cooling_device_unregister() is called from remove functions. This makes both a perfect candidate for device managed functions. Introduce devm_thermal_of_cooling_device_register(). This function can also be used to replace thermal_cooling_device_register() by passing a NULL pointer as device node. The new function requires both struct device * and struct device_node * as parameters since the struct device_node * parameter is not always identical to dev->of_node. Don't introduce a device managed remove function since it is not needed at this point. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* drivers: thermal: Update license to SPDX formatLina Iyer2018-05-301-16/+1
| | | | | | | | Update licences format for core thermal files. Signed-off-by: Lina Iyer <ilina@codeaurora.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add cooling device's statistics in sysfsViresh Kumar2018-04-021-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal : Remove const to make same prototypeArvind Yadav2017-10-171-1/+1
| | | | | | | | | Here, prototype of thermal_zone_device_register is not matching with static inline thermal_zone_device_register. One is using const thermal_zone_params. Other is using non-const. Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: int3400_thermal: process "thermal table changed" eventBrian Bian2017-08-111-0/+1
| | | | | | | | | | Some BIOS implement ACPI notification code 0x83 to indicate active relationship table(ART) and/or thermal relationship table(TRT) changes to INT3400 device. This event needs to be propagated to user space so that it can be handled by the user space thermal daemon. Signed-off-by: Brian Bian <brian.bian@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal core: convert ID allocation to IDAMatthew Wilcox2017-01-041-2/+2
| | | | | | | | The thermal core does not use the ability to look up pointers by ID, so convert it from using an IDR to the more space-efficient IDA. Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: core: move trips attributes to tz->device.groupsEduardo Valentin2016-11-231-0/+2
| | | | | | | | | | | | | | | | | Finally, move the last thermal zone sysfs attributes to tz->device.groups: trips attributes. This requires adding a attribute_group to thermal_zone_device, creating it dynamically, and then setting all trips attributes in it. The trips attribute is then added to the tz->device.groups. As the removal of all attributes are handled by device core, the device remove calls are not needed anymore. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Enhance thermal_zone_device_update for eventsSrinivas Pandruvada2016-09-271-2/+17
| | | | | | | | | | | | | | | | | | Added one additional parameter to thermal_zone_device_update() to provide caller with an optional capability to specify reason. Currently this event is used by user space governor to trigger different processing based on event code. Also it saves an additional call to read temperature when the event is received. The following events are cuurently defined: - Unspecified event - New temperature sample - Trip point violated - Trip point changed - thermal device up and down - thermal device power capability changed Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: streamline get_trend callbacksSascha Hauer2016-09-271-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | The .get_trend callback in struct thermal_zone_device_ops has the prototype: int (*get_trend) (struct thermal_zone_device *, int, enum thermal_trend *); whereas the .get_trend callback in struct thermal_zone_of_device_ops has: int (*get_trend)(void *, long *); Streamline both prototypes and add the trip argument to the OF callback aswell and use enum thermal_trend * instead of an integer pointer. While the OF prototype may be the better one, this should be decided at framework level and not on OF level. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Caesar Wang <wxt@rock-chips.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Reviewed-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: of: implement .set_trips for device tree thermal zonesSascha Hauer2016-09-271-0/+4
| | | | | | | | | | | | | | | | This patch implements .set_trips for device tree thermal zones. As the hardware-tracked trip points is supported by thermal core patch[0]. patch[0] "thermal: Add support for hardware-tracked trip points". Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Caesar Wang <wxt@rock-chips.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add support for hardware-tracked trip pointsSascha Hauer2016-09-271-0/+10
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This adds support for hardware-tracked trip points to the device tree thermal sensor framework. The framework supports an arbitrary number of trip points. Whenever the current temperature is updated, the trip points immediately below and above the current temperature are found. A .set_trips callback is then called with the temperatures. If there is no trip point above or below the current temperature, the passed trip temperature will be -INT_MAX or INT_MAX respectively. In this callback, the driver should program the hardware such that it is notified when either of these trip points are triggered. When a trip point is triggered, the driver should call `thermal_zone_device_update' for the respective thermal zone. This will cause the trip points to be updated again. If .set_trips is not implemented, the framework behaves as before. This patch is based on an earlier version from Mikko Perttunen <mikko.perttunen@kapsi.fi> Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Caesar Wang <wxt@rock-chips.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: core: export apis to get slope and offsetRajendra Nayak2016-09-271-0/+8
| | | | | | | | | Add apis for platform thermal drivers to query for slope and offset attributes, which might be needed for temperature calculations. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add the note for set_trip_tempCaesar Wang2016-06-011-0/+2
| | | | | | | | | | | Fixes commit 60f9ce3ada53 ("thermal: of-thermal: allow setting trip_temp on hardware") Signed-off-by: Caesar Wang <wxt@rock-chips.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: of-thermal: allow setting trip_temp on hardwareWei Ni2016-05-171-0/+1
| | | | | | | | | | | | | In current of-thermal, the .set_trip_temp only support to set trip_temp for SW. But some sensors support to set trip_temp on hardware, so that can trigger interrupt, shutdown or any other events. This patch adds .set_trip_temp() callback in thermal_zone_of_device_ops{}, so that the sensor device can use it to set trip_temp on hardware. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: consistently use int for trip tempWei Ni2016-04-201-2/+2
| | | | | | | | | | | | | | | The commit 17e8351a7739 consistently use int for temperature, however it missed a few in trip temperature and thermal_core. In current codes, the trip->temperature used "unsigned long" and zone->temperature used"int", if the temperature is negative value, it will get wrong result when compare temperature with trip temperature. This patch can fix it. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Thermal: Ignore invalid trip pointsZhang Rui2016-03-181-0/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In some cases, platform thermal driver may report invalid trip points, thermal core should not take any action for these trip points. This fixed a regression that bogus trip point starts to screw up thermal control on some Lenovo laptops, after commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461 Author: Zhang Rui <rui.zhang@intel.com> Date: Fri Oct 30 16:31:47 2015 +0800 Thermal: initialize thermal zone device correctly After thermal zone device registered, as we have not read any temperature before, thus tz->temperature should not be 0, which actually means 0C, and thermal trend is not available. In this case, we need specially handling for the first thermal_zone_device_update(). Both thermal core framework and step_wise governor is enhanced to handle this. And since the step_wise governor is the only one that uses trends, so it's the only thermal governor that needs to be updated. Tested-by: Manuel Krause <manuelkrause@netscape.net> Tested-by: szegad <szegadlo@poczta.onet.pl> Tested-by: prash <prash.n.rao@gmail.com> Tested-by: amish <ammdispose-arch@yahoo.com> Tested-by: Matthias <morpheusxyz123@yahoo.de> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Chen Yu <yu.c.chen@intel.com> CC: <stable@vger.kernel.org> #3.18+ Link: https://bugzilla.redhat.com/show_bug.cgi?id=1317190 Link: https://bugzilla.kernel.org/show_bug.cgi?id=114551 Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: of-thermal: Add devm version of thermal_zone_of_sensor_registerLaxman Dewangan2016-03-091-0/+18
| | | | | | | | | | | Add resource managed version of thermal_zone_of_sensor_register() and thermal_zone_of_sensor_unregister(). This helps in reducing the code size in error path, remove of driver remove callbacks and making proper sequence for deallocations. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Thermal: do thermal zone update after a cooling device registeredChen Yu2015-12-291-0/+2
| | | | | | | | | | | | | | | | | | | | | | | When a new cooling device is registered, we need to update the thermal zone to set the new registered cooling device to a proper state. This fixes a problem that the system is cool, while the fan devices are left running on full speed after boot, if fan device is registered after thermal zone device. Here is the history of why current patch looks like this: https://patchwork.kernel.org/patch/7273041/ CC: <stable@vger.kernel.org> #3.18+ Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431 Tested-by: Manuel Krause <manuelkrause@netscape.net> Tested-by: szegad <szegadlo@poczta.onet.pl> Tested-by: prash <prash.n.rao@gmail.com> Tested-by: amish <ammdispose-arch@yahoo.com> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Chen Yu <yu.c.chen@intel.com>
* Thermal: initialize thermal zone device correctlyZhang Rui2015-12-291-0/+3
| | | | | | | | | | | | | | | | | | | | | | | After thermal zone device registered, as we have not read any temperature before, thus tz->temperature should not be 0, which actually means 0C, and thermal trend is not available. In this case, we need specially handling for the first thermal_zone_device_update(). Both thermal core framework and step_wise governor is enhanced to handle this. And since the step_wise governor is the only one that uses trends, so it's the only thermal governor that needs to be updated. CC: <stable@vger.kernel.org> #3.18+ Tested-by: Manuel Krause <manuelkrause@netscape.net> Tested-by: szegad <szegadlo@poczta.onet.pl> Tested-by: prash <prash.n.rao@gmail.com> Tested-by: amish <ammdispose-arch@yahoo.com> Tested-by: Matthias <morpheusxyz123@yahoo.de> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Chen Yu <yu.c.chen@intel.com>
* thermal: fix thermal_zone_bind_cooling_device prototypeArnd Bergmann2015-11-231-1/+2
| | | | | | | | | | | | | | | | | | When the prototype for thermal_zone_bind_cooling_device changed, the static inline wrapper function was left alone, which in theory can cause build warnings: I have seen this error in the past: drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind': drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device' ret = thermal_zone_bind_cooling_device(thermal, i, cdev, while this one no longer shows up, there is no doubt that the prototype is still wrong, so let's just fix it anyway. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Fixes: 6cd9e9f629f1 ("thermal: of: fix cooling device weights in device tree") Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* linux/thermal.h: rename KELVIN_TO_CELSIUS to DECI_KELVIN_TO_CELSIUSRasmus Villemoes2015-10-101-3/+5
| | | | | | | | | | | The macros KELVIN_TO_CELSIUS and CELSIUS_TO_KELVIN actually convert between deciKelvins and Celsius, so rename them to reflect that. While at it, use a statement expression in DECI_KELVIN_TO_CELSIUS to prevent expanding the argument multiple times and get rid of a few casts. Signed-off-by: Rasmus Villemoes <linux@rasmusvillemoes.dk> Acked-by: Darren Hart <dvhart@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add a function to get the minimum powerJavi Merino2015-09-141-0/+6
| | | | | | | | | | | | The thermal core already has a function to get the maximum power of a cooling device: power_actor_get_max_power(). Add a function to get the minimum power of a cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reviewed-by: Daniel Kurtz <djkurtz@chromium.org> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Fix thermal_zone_of_sensor_register to match documentationPunit Agrawal2015-09-131-1/+1
| | | | | | | | | | | | | | | thermal_zone_of_sensor_register is documented as returning a pointer to either a valid thermal_zone_device on success, or a corresponding ERR_PTR() value. In contrast, the function returns NULL when THERMAL_OF is configured off. Fix this. Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: consistently use int for temperaturesSascha Hauer2015-08-031-15/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The thermal code uses int, long and unsigned long for temperatures in different places. Using an unsigned type limits the thermal framework to positive temperatures without need. Also several drivers currently will report temperatures near UINT_MAX for temperatures below 0°C. This will probably immediately shut the machine down due to overtemperature if started below 0°C. 'long' is 64bit on several architectures. This is not needed since INT_MAX °mC is above the melting point of all known materials. Consistently use a plain 'int' for temperatures throughout the thermal code and the drivers. This only changes the places in the drivers where the temperature is passed around as pointer, when drivers internally use another type this is not changed. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Jean Delvare <jdelvare@suse.de> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Darren Hart <dvhart@linux.intel.com> Reviewed-by: Heiko Stuebner <heiko@sntech.de> Reviewed-by: Peter Feuerer <peter@piie.net> Cc: Punit Agrawal <punit.agrawal@arm.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: Jean Delvare <jdelvare@suse.de> Cc: Peter Feuerer <peter@piie.net> Cc: Heiko Stuebner <heiko@sntech.de> Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: linux-acpi@vger.kernel.org Cc: platform-driver-x86@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-omap@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Guenter Roeck <linux@roeck-us.net> Cc: Rafael J. Wysocki <rjw@rjwysocki.net> Cc: Maxime Ripard <maxime.ripard@free-electrons.com> Cc: Darren Hart <dvhart@infradead.org> Cc: lm-sensors@lm-sensors.org Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: support slope and offset coefficientsEduardo Valentin2015-05-111-0/+11
| | | | | | | | | | | | | | | | | | | | It is common to have a linear extrapolation from the current sensor readings and the actual temperature value. This is specially the case when the sensor is in use to extrapolate hotspots. This patch adds slope and offset constants for single sensor linear extrapolation equation. Because the same sensor can be use in different locations, from board to board, these constants are added as part of thermal_zone_params. The constants are available through sysfs. It is up to the device driver to determine the usage of these values. Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: introduce the Power Allocator governorJavi Merino2015-05-041-5/+32
| | | | | | | | | | | | | | | | | | | | | | | | | | The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: extend the cooling device API to include power informationJavi Merino2015-05-041-0/+25
| | | | | | | | | | | Add three optional callbacks to the cooling device interface to allow them to express power. In addition to the callbacks, add helpers to identify cooling devices that implement the power cooling device API. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: let governors have private data for each thermal zoneJavi Merino2015-05-041-0/+9
| | | | | | | | | | | | | | | | | A governor may need to store its current state between calls to throttle(). That state depends on the thermal zone, so store it as private data in struct thermal_zone_device. The governors may have two new ops: bind_to_tz() and unbind_from_tz(). When provided, these functions let governors do some initialization and teardown when they are bound/unbound to a tz and possibly store that information in the governor_data field of the struct thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: fair_share: generalize the weight conceptJavi Merino2015-05-041-3/+6
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The fair share governor has the concept of weights, which is the influence of each cooling device in a thermal zone. The current implementation forces the weights of all cooling devices in a thermal zone to add up to a 100. This complicates setups, as you need to know in advance how many cooling devices you are going to have. If you bind a new cooling device, you have to modify all the other cooling devices weights, which is error prone. Furthermore, you can't specify a "default" weight for platforms since that default value depends on the number of cooling devices in the platform. This patch generalizes the concept of weight by allowing any number to be a "weight". Weights are now relative to each other. Platforms that don't specify weights get the same default value for all their cooling devices, so all their cdevs are considered to be equally influential. It's important to note that previous users of the weights don't need to alter the code: percentages continue to work as they used to. This patch just removes the constraint of all the weights in a thermal zone having to add up to a 100. If they do, you get the same behavior as before. If they don't, fair share now works for that platform. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: of: fix cooling device weights in device treeKapileshwar Singh2015-05-041-1/+5
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Introduce dummy functions when thermal is not definedNishanth Menon2015-02-241-2/+54
| | | | | | | | | | | | | | | | | When CONFIG_THERMAL is not enabled, it is better to introduce equivalent dummy functions in the exported header than to introduce #ifdeffery in drivers using the function. This will prevent issues such as that reported in: http://www.spinics.net/lists/linux-next/msg31573.html While at it switch over to IS_ENABLED for thermal macros to allow for thermal framework to be built as framework and relevant APIs be usable by relevant drivers as a result. Reported-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Nishanth Menon <nm@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'fixes' of ↵Zhang Rui2014-12-211-1/+1
|\ | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
| * thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bitPunit Agrawal2014-12-101-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The size of unsigned long varies between 32 and 64 bit systems while the size of phandle arguments is always 32 bits per parameter. On 64-bit systems, cooling devices registered via of-thermal apis fail to bind when the min/max cooling state is specified as THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read from the device tree (32bit) and the pre-processor define (64bit). As we're unlikely to need cooling states larger than 32 bits, and for consistency with the size of phandle arguments, explicitly limit THERMAL_NO_LIMIT to 32 bits. Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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*-. | Merge branches 'thermal-core-fix', 'thermal-soc' and 'thermal-int340x' into nextZhang Rui2014-12-131-6/+36
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| * | thermal: of: Extend current of-thermal.c code to allow setting emulated tempLukasz Majewski2014-12-081-0/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Before this change it was only possible to set get_temp() and get_trend() methods to be used in the common code handling passing parameters via device tree to "cpu-thermal" CPU thermal zone device. Now it is possible to also set emulated value of temperature for debug purposes. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * | thermal: of: Rename struct __thermal_trip to struct thermal_tripLukasz Majewski2014-12-081-0/+15
| | | | | | | | | | | | | | | | | | | | | | | | This patch changes name of struct __thermal_trip to thermal_trip and moves declaration of the latter to ./include/linux/thermal.h for better visibility. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * | thermal: of: improve of-thermal sensor registration APIEduardo Valentin2014-11-201-6/+18
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Different drivers request API extensions in of-thermal. For this reason, additional callbacks are required to fit the new drivers needs. The current API implementation expects the registering sensor driver to provide a get_temp and get_trend callbacks as function parameters. As the amount of callbacks is growing, this patch changes the existing implementation to use a .ops field to hold all the of thermal callbacks to sensor drivers. This patch also changes the existing of-thermal users to fit the new API design. No functional change is introduced in this patch. Cc: Alexandre Courbot <gnurou@gmail.com> Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Guenter Roeck <linux@roeck-us.net> Cc: Jean Delvare <jdelvare@suse.de> Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-tegra@vger.kernel.org Cc: lm-sensors@lm-sensors.org Cc: Rob Herring <robh+dt@kernel.org> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Alexandre Courbot <acourbot@nvidia.com> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* / thermal: provide an UAPI header fileFlorian Fainelli2014-12-091-30/+1
|/ | | | | | | | | | | | | | | | | | include/linux/thermal.h contains definitions for the Thermal generic netlink family, but none of the valuable information relevant to user-space such as the Genl family name, multicast group, version or command set and data types is exported to user-space. Export all the relevant generic netlink information to user-space to make this genl family usable by user-space, and while at it, export THERMAL_NAME_LENGTH since it limits name length for thermal_hwmon devices. Kbuild and MAINTAINERS are also updated accordingly to reflect this new file: include/uapi/linux/thermal.h. Signed-off-by: Florian Fainelli <f.fainelli@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: introduce INT3402 thermal driverAaron Lu2014-10-101-0/+2
| | | | | | | | | | ACPI INT3402 device object could report temperature for the memory module. To expose such information to user space, a thermal zone device is registered for it so that the thermal sysfs interface can expose such information for userspace to use. Signed-off-by: Aaron Lu <aaron.lu@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.hAaron Lu2014-10-101-0/+2
| | | | | | | | | This macro can be used by other component so move it to a common header, but in a slightly different way: define two macros, one macro with an offset and the other doesn't. Signed-off-by: Aaron Lu <aaron.lu@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: document struct thermal_zone_device and thermal_governorJavi Merino2014-07-221-2/+44
| | | | | | | | | | Document struct thermal_zone_device and struct thermal_governor fields and their use by the thermal framework code. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: core: introduce thermal_of_cooling_device_registerEduardo Valentin2013-12-041-0/+4
| | | | | | | | | | | | | | | This patch adds a new API to allow registering cooling devices in the thermal framework derived from device tree nodes. This API links the cooling device with the device tree node so that binding with thermal zones is possible, given that thermal zones are pointing to cooling device device tree nodes. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: introduce device tree parserEduardo Valentin2013-12-041-2/+26
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: thermal_core: allow binding with limits on bind_paramsEduardo Valentin2013-09-031-0/+10
| | | | | | | | | | | | | | | | When registering a thermal zone device using platform information via bind_params, the thermal framework will always perform the cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT). This patch changes the data structures so that it is possible to inform what are the desired limits for each trip point inside a bind_param. The way the binding is performed is also changed so that it uses the new data structure. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* drivers: thermal: make usage of CONFIG_THERMAL_HWMON optionalEduardo Valentin2013-09-031-0/+8
| | | | | | | | | | | | | | | | | | | | | | When registering a new thermal_device, the thermal framework will always add a hwmon sysfs interface. This patch adds a flag to make this behavior optional. Now when registering a new thermal device, the caller can optionally inform if hwmon interface is desirable. This can be done by means of passing a thermal_zone_params.no_hwmon == true. In order to keep same behavior as of today, all current calls will by default create the hwmon interface. Cc: David Woodhouse <dwmw2@infradead.org> Cc: linux-acpi@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: Zhang Rui <rui.zhang@intel.com> Suggested-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge branch 'next' of ↵Linus Torvalds2013-05-091-7/+8
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management update from Zhang Rui: "The most important one is to build thermal core and governor and cpu cooling code into one module. This fixes a regression that thermal core does not work if it is built as module, since 3.7. I'll backport them to stable kernel once those changes are in upstream. The largest batch is the thermal kernel-doc & coding style updates/cleanups from Eduardo. Highlights: - build all thermal framework code into one module to fix a regression that thermal does not work if it is built as module. - Marvell Armada 370/XP thermal sensor driver - thermal core/cpu cooling kernel-doc & coding style updates and cleanups. - Add Eduardo Valentin as thermal sub-maintainer, both in mailing list and patchwork. He will help me on arm thermal drivers." * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (68 commits) thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL() thermal: thermal_core: remove usage of IS_ERR_OR_NULL thermal: cpu_cooling: improve line breaking thermal: cpu_cooling: alignment improvements thermal: cpu_cooling: remove checkpatch.pl warning thermal: cpu_cooling: remove trailing blank line thermal: cpu_cooling: align on open parenthesis thermal: cpu_cooling: standardize comment style thermal: cpu_cooling: standardize end of function thermal: cpu_cooling: remove trailing white spaces Thermal: update documentation for thermal_zone_device_register thermal: update kernel-doc for thermal_zone_device_register thermal: update kernel-doc for create_trip_attrs thermal: update kernel-doc for thermal_cooling_device_register thermal: update kernel-doc for thermal_zone_unbind_cooling_device thermal: update kernel-doc for thermal_zone_bind_cooling_device thermal: use EXPORT_SYMBOL_GPL thermal: rename notify_thermal_framework to thermal_notify_framework thermal: update driver license thermal: use strlcpy instead of strcpy ...
| * thermal: rename notify_thermal_framework to thermal_notify_frameworkEduardo Valentin2013-04-251-1/+1
| | | | | | | | | | | | | | | | To follow the prefix names used by the thermal functions, this patch renames notify_thermal_framework to thermal_notify_framework. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: expose thermal_zone_get_temp APIEduardo Valentin2013-04-151-0/+1
| | | | | | | | | | | | | | | | | | | | This patch exports the thermal_zone_get_temp API so that driver writers can fetch temperature of thermal zones managed by other drivers. Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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