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* IntelFsp2Pkg: Replace BSD License with BSD+Patent LicenseMichael D Kinney2019-04-091-7/+1
| | | | | | | | | | | | | | | | | | | | https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao2016-05-131-0/+99
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>