summaryrefslogtreecommitdiffstats
path: root/IntelFsp2Pkg/FspSecCore/SecFspApiChk.c
Commit message (Collapse)AuthorAgeFilesLines
* IntelFsp2Pkg: Support Multi-Phase SiInit and debug handlers.Chasel Chiu2020-05-141-3/+3
| | | | | | | | | | | | | | | | | | | | | | | REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2698 To enhance FSP silicon initialization flexibility an optional Multi-Phase API is introduced and FSP header needs update for new API offset. Also new SecCore module created for FspMultiPhaseSiInit API New ARCH_UPD introduced for enhancing FSP debug message flexibility now bootloader can pass its own debug handler function pointer and FSP will call the function to handle debug message. To support calling bootloader functions, a FspGlobalData field added to indicate if FSP needs to switch stack when FSP running on separate stack from bootloader. Cc: Maurice Ma <maurice.ma@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Star Zeng <star.zeng@intel.com> Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
* IntelFsp2Pkg: Replace BSD License with BSD+Patent LicenseMichael D Kinney2019-04-091-7/+1
| | | | | | | | | | | | | | | | | | | | https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2Pkg: Clean up source filesLiming Gao2018-06-281-3/+3
| | | | | | | | | 1. Do not use tab characters 2. No trailing white space in one line 3. All files must end with CRLF Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Liming Gao <liming.gao@intel.com>
* Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao2016-05-131-0/+97
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>