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* IntelFsp2Pkg: Added changes to enable FPDT performance measurementsYarlagadda, Satya P2016-10-271-0/+4
| | | | | | | | | | | | | | | | | | | | | | IntelFsp2Pkg: 1.Defined performance measure mask to mask the Perf id (Bits 63:56) of the Perf Data from FSP Global data. 2.Replaced the hard coded perf ids to use the standard defines from FspStatuscode.h 3.Add the PerfData form Fsp Global data ( for TempRaminit entry, TempramInit exit, memoryinit entry) to FPDT entries IntelFsp2WrapperPkg: Moved the code to add the FSP FPDT records and wrapper FPDT records from ReadytoBoot event to EndofFirmware event Cc: Maurice Ma <maurice.ma@intel.com> Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
* Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao2016-05-131-0/+50
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>