| Commit message (Collapse) | Author | Age | Files | Lines |
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Fix various typos in IntelFsp2Pkg.
Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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This reverts commit f527942e6bdd9f198db90f2de99a0482e9be5b1b.
Commit message was incorrect.
Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Fix one typo in FmpDevicePkg.
Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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https://bugzilla.tianocore.org/show_bug.cgi?id=1373
Replace BSD 2-Clause License with BSD+Patent License. This change is
based on the following emails:
https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html
RFCs with detailed process for the license change:
V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Commit formats had issues so reverted 9 commits
from IntelFsp2Pkg and IntelFsp2WrapperPkg.
Will re-submit them with correct formats.
Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
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PCDs
The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Keep NASM file only for new added modules.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
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The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/Stack.asm to Ia32/Stack.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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