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* IntelFsp2Pkg: Fix various typosAntoine Cœur2019-07-111-2/+2
| | | | | | | | Fix various typos in IntelFsp2Pkg. Signed-off-by: Cœur <coeur@gmx.fr> Reviewed-by: Star Zeng <star.zeng@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* Revert "FmpDevicePkg: Fix various typos"Antoine Cœur2019-07-111-2/+2
| | | | | | | | This reverts commit f527942e6bdd9f198db90f2de99a0482e9be5b1b. Commit message was incorrect. Signed-off-by: Cœur <coeur@gmx.fr> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* FmpDevicePkg: Fix various typosAntoine Cœur2019-07-091-2/+2
| | | | | | | | Fix one typo in FmpDevicePkg. Signed-off-by: Cœur <coeur@gmx.fr> Reviewed-by: Star Zeng <star.zeng@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2Pkg: Replace BSD License with BSD+Patent LicenseMichael D Kinney2019-04-093-20/+3
| | | | | | | | | | | | | | | | | | | | https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2Pkg/BaseFspSwitchStackLib: Remove unused PCDsshenglei2018-09-281-4/+0
| | | | | | | | | | | | | The PCDs below are unused, so they have been removed from inf. gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Laszlo Ersek <lersek@redhat.com> Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: shenglei <shenglei.zhang@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2(Wrapper)Pkg: Revert from e8208100 to 737f812bChasel, Chiu2018-09-281-0/+4
| | | | | | | | | | | | Commit formats had issues so reverted 9 commits from IntelFsp2Pkg and IntelFsp2WrapperPkg. Will re-submit them with correct formats. Cc: Jiewen Yao <Jiewen.yao@intel.com> Cc: Star Zeng <star.zeng@intel.com> Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Star Zeng <star.zeng@intel.com>
* [PATCH v3 04/16] IntelFsp2Pkg/BaseFspSwitchStackLib: Remove unusedChasel, Chiu2018-09-271-4/+0
| | | | | | | | | | | | | | | PCDs The PCDs below are unused, so they have been removed from inf. gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Cc: Laszlo Ersek <lersek@redhat.com> Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: shenglei <shenglei.zhang@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2Pkg BaseFspSwitchStackLib: Remove MASM/GAS filesLiming Gao2016-07-113-157/+0
| | | | | | | | | | Keep NASM file only for new added modules. Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Giri Mudusuru <giri.p.mudusuru@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Liming Gao <liming.gao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
* IntelFsp2Pkg BaseFspSwitchStackLib: Convert Ia32/Stack.asm to NASMLiming Gao2016-06-282-3/+78
| | | | | | | | The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert Ia32/Stack.asm to Ia32/Stack.nasm Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Liming Gao <liming.gao@intel.com>
* Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao2016-05-134-0/+240
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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