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* IntelFsp2Pkg: Add YAML file generation supportLoo Tung Lun2021-02-091-0/+39
| | | | | | | | | | | | | | | | | | | | | | REF:https://bugzilla.tianocore.org/show_bug.cgi?id=3091 Add support for YAML format file generation in addition to current BSF structure. Configuration of YAML format output will be supported by an open source ConfigEditor. Reference to YAML code, test and ConfigEditor is at https://github.com/joshloo/fsp_yaml_cfg/tree/master/Tools A unit test is also added in Tests folder. This test compares the generated yaml file against the expected output to know if it is constructing the yaml data structure as expected. Cc: Maurice Ma <maurice.ma@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Star Zeng <star.zeng@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Signed-off-by: Loo Tung Lun <tung.lun.loo@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2Pkg: Fix various typosAntoine Cœur2019-07-112-2/+2
| | | | | | | | Fix various typos in IntelFsp2Pkg. Signed-off-by: Cœur <coeur@gmx.fr> Reviewed-by: Star Zeng <star.zeng@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* Revert "FmpDevicePkg: Fix various typos"Antoine Cœur2019-07-112-2/+2
| | | | | | | | This reverts commit f527942e6bdd9f198db90f2de99a0482e9be5b1b. Commit message was incorrect. Signed-off-by: Cœur <coeur@gmx.fr> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* FmpDevicePkg: Fix various typosAntoine Cœur2019-07-092-2/+2
| | | | | | | | Fix one typo in FmpDevicePkg. Signed-off-by: Cœur <coeur@gmx.fr> Reviewed-by: Star Zeng <star.zeng@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* IntelFsp2Pkg/SplitFspBin.py: Support rebasing 1.x binary.Chasel Chiu2019-06-111-22/+25
| | | | | | | | | | | | | | | | | | | REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1308 Support rebasing FSP 1.x binary. FSP 1.x has single component in binary so not supported by split command and rebase can be done with the same command for rebasing FSP-T component in FSP 2.x image. Test: both FSP 2.x (Kabylake) and FSP 1.x (BroadwellDE) binary can be rebased successfully. Cc: Maurice Ma <maurice.ma@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Star Zeng <star.zeng@intel.com> Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Star Zeng <star.zeng@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
* IntelFsp2Pkg/SplitFspBin.py: Revert FSP 1.x support.Chasel Chiu2019-05-311-25/+22
| | | | | | | | | | This reverts commit: 591b8cb7f3d026d2fa4483c59f3d5fb14be181bf. Will submit again after freeze done. Cc: Liming Gao <liming.gao@intel.com> Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Liming Gao <liming.gao@intel.com>
* IntelFsp2Pkg/SplitFspBin.py: Support rebasing 1.x binary.Chasel Chiu2019-05-311-22/+25
| | | | | | | | | | | | | | | | | | | REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1308 Support rebasing FSP 1.x binary. FSP 1.x has single component in binary so not supported by split command and rebase can be done with the same command for rebasing FSP-T component in FSP 2.x image. Test: both FSP 2.x (Kabylake) and FSP 1.x (BroadwellDE) binary can be rebased successfully. Cc: Maurice Ma <maurice.ma@intel.com> Cc: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Star Zeng <star.zeng@intel.com> Signed-off-by: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Star Zeng <star.zeng@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
* IntelFsp2Pkg: Converted PatchFvUserManual from .docx to .md formatMudusuru, Giri P2016-08-082-0/+123
| | | | | | | | | | | | | | | Converted the the word format of the documentation into markdown format for PatchFv.py V2: updated the commit message descripton Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com> Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
* IntelFsp2Pkg: Converted GenCfgOptUserManual from .docx to .md formatMudusuru, Giri P2016-08-082-0/+353
| | | | | | | | | | | | Converted the the word format of the documentation into markdown format for GenCfgOpt.py Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
* InterFsp2Pkg:Tool: Add user manual for SplitFspBin tool.Jiewen Yao2016-06-161-0/+69
| | | | | | | | | | | | | Besides Split FSP binary, we added some more feature to SplitFspBin tool. Here we add user manual for it to describe all usage. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com>
* Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao2016-05-132-0/+0
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>