| Commit message (Collapse) | Author | Age | Files | Lines |
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3737
Apply uncrustify changes to .c/.h files in the IntelFsp2WrapperPkg package
Cc: Andrew Fish <afish@apple.com>
Cc: Leif Lindholm <leif@nuviainc.com>
Cc: Michael D Kinney <michael.d.kinney@intel.com>
Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Fix various typos in comments and documentation.
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Reviewed-by: Philippe Mathieu-Daude <philmd@redhat.com>
Signed-off-by: Philippe Mathieu-Daude <philmd@redhat.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1716
In API mode FSP wrapper will perform some post
FSP-S process but such process was skipped in Dispatch
mode which may impact some of the boot loaders.
To align behavior between API and Dispatch, an
End-of-Pei callback is introduced to perform same process
in Dispatch mode.
Note: If boot loader implemented its own
PostFspsHobProcess (), it has to check
PcdFspModeSelection and support each mode
properly.
Test: Verified on internal platform and both
FSP API and Dispatch modes booted successfully.
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
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https://bugzilla.tianocore.org/show_bug.cgi?id=1373
Replace BSD 2-Clause License with BSD+Patent License. This change is
based on the following emails:
https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html
RFCs with detailed process for the license change:
V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
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gIntelFsp2WrapperTokenSpaceGuid.
We updated gIntelFspPkgTokenSpaceGuid to gIntelFsp2PkgTokenSpaceGuid
in IntelFsp2Pkg, but we miss the update in IntelFsp2WrapperPkg.
This patch fixed the issue and made them consistent.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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