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* IntelFspWrapperPkg: Replace BSD License with BSD+Patent LicenseMichael D Kinney2019-04-091-7/+1
| | | | | | | | | | | | | | | | | | | | https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
* Update IntelFspWrapperPkg according to FSP1.1.Yao, Jiewen2015-02-111-0/+26
| | | | | | | | Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: "Yao, Jiewen" <jiewen.yao@intel.com> git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@16826 6f19259b-4bc3-4df7-8a09-765794883524
* Add IntelFspWrapper to support boot EDKII on FSP bin.jyao12014-07-241-0/+31
Contributed-under: TianoCore Contribution Agreement 1.0 Signed off by: Jiewen Yao <jiewen.yao@intel.com> Reviewed by: Ravi Rangarajan <ravi.p.rangarajan@intel.com> Reviewed by: Maurice Ma <maurice.ma@intel.com> Reviewed by: Giri Mudusuru <giri.p.mudusuru@intel.com> Reviewed by: Liming Gao <liming.gao@intel.com> git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@15676 6f19259b-4bc3-4df7-8a09-765794883524