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authorDavid Hendricks <david.hendricks@gmail.com>2018-02-11 17:40:53 -0800
committerDavid Hendricks <david.hendricks@gmail.com>2018-02-20 01:09:29 +0000
commitc9ee0ed8a62d5b165a22d536753e960e0158460c (patch)
treeeb795574c05b61a4a3f82dbd916c26cc27c256e5 /flashchips.h
parentf701f343117270b4373320eb25ae259b8e513b7d (diff)
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flashchips: Add Winbond W25P80/16/32 support
This adds support for W25P80/16/32 chips. Most notably these chips only have two erase commands - one for 64KiB "sectors" and one for chip erase. Change-Id: Ie09ba8e28fee35c42e17ca05219dc673413de93b Signed-off-by: David Hendricks <david.hendricks@gmail.com> Reviewed-on: https://review.coreboot.org/23700 Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Diffstat (limited to 'flashchips.h')
-rw-r--r--flashchips.h3
1 files changed, 3 insertions, 0 deletions
diff --git a/flashchips.h b/flashchips.h
index 6a7b0ae8b..f487248e9 100644
--- a/flashchips.h
+++ b/flashchips.h
@@ -890,6 +890,9 @@
* byte of device ID is related to log(bitsize).
*/
#define WINBOND_NEX_ID 0xEF /* Winbond (ex Nexcom) serial flashes */
+#define WINBOND_NEX_W25P80 0x2014
+#define WINBOND_NEX_W25P16 0x2015
+#define WINBOND_NEX_W25P32 0x2016
#define WINBOND_NEX_W25X10 0x3011
#define WINBOND_NEX_W25X20 0x3012
#define WINBOND_NEX_W25X40 0x3013