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| author | Flavio Leitner <fbl@redhat.com> | 2011-05-25 08:38:58 +0000 |
|---|---|---|
| committer | David S. Miller <davem@davemloft.net> | 2011-05-25 17:55:33 -0400 |
| commit | 94265cf5f731c7df29fdfde262ca3e6d51e6828c (patch) | |
| tree | e19d43a5e8b19a220a4258a5a9f30d63ffc4bf55 /Documentation | |
| parent | 9fe0617d9b6d21f700ee9e658e1c9fe3be2fb402 (diff) | |
| download | linux-stable-94265cf5f731c7df29fdfde262ca3e6d51e6828c.tar.gz linux-stable-94265cf5f731c7df29fdfde262ca3e6d51e6828c.tar.bz2 linux-stable-94265cf5f731c7df29fdfde262ca3e6d51e6828c.zip | |
bonding: documentation and code cleanup for resend_igmp
Improves the documentation about how IGMP resend parameter
works, fix two missing checks and coding style issues.
Signed-off-by: Flavio Leitner <fbl@redhat.com>
Acked-by: Rick Jones <rick.jones2@hp.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
Diffstat (limited to 'Documentation')
| -rw-r--r-- | Documentation/networking/bonding.txt | 13 |
1 files changed, 11 insertions, 2 deletions
diff --git a/Documentation/networking/bonding.txt b/Documentation/networking/bonding.txt index 1f45bd887d65..675612ff41ae 100644 --- a/Documentation/networking/bonding.txt +++ b/Documentation/networking/bonding.txt @@ -770,8 +770,17 @@ resend_igmp a failover event. One membership report is issued immediately after the failover, subsequent packets are sent in each 200ms interval. - The valid range is 0 - 255; the default value is 1. This option - was added for bonding version 3.7.0. + The valid range is 0 - 255; the default value is 1. A value of 0 + prevents the IGMP membership report from being issued in response + to the failover event. + + This option is useful for bonding modes balance-rr (0), active-backup + (1), balance-tlb (5) and balance-alb (6), in which a failover can + switch the IGMP traffic from one slave to another. Therefore a fresh + IGMP report must be issued to cause the switch to forward the incoming + IGMP traffic over the newly selected slave. + + This option was added for bonding version 3.7.0. 3. Configuring Bonding Devices ============================== |