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author | Bob Moore <robert.moore@intel.com> | 2008-04-10 19:06:39 +0400 |
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committer | Len Brown <len.brown@intel.com> | 2008-04-22 14:29:26 -0400 |
commit | 9e41d93c975d403380b7debe05517d630c8e2836 (patch) | |
tree | 1f6e7afbca5c54cc16c7e8f88b93f1fccd7ae08a /include/acpi/acopcode.h | |
parent | 7f4ac9f91383a0707de559dc8fbca986fc2d302f (diff) | |
download | linux-stable-9e41d93c975d403380b7debe05517d630c8e2836.tar.gz linux-stable-9e41d93c975d403380b7debe05517d630c8e2836.tar.bz2 linux-stable-9e41d93c975d403380b7debe05517d630c8e2836.zip |
ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages
Problem introduced in fix for Package references.
Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'include/acpi/acopcode.h')
0 files changed, 0 insertions, 0 deletions