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authorBob Moore <robert.moore@intel.com>2008-04-10 19:06:39 +0400
committerLen Brown <len.brown@intel.com>2008-04-22 14:29:26 -0400
commit9e41d93c975d403380b7debe05517d630c8e2836 (patch)
tree1f6e7afbca5c54cc16c7e8f88b93f1fccd7ae08a /include/acpi/acopcode.h
parent7f4ac9f91383a0707de559dc8fbca986fc2d302f (diff)
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ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages
Problem introduced in fix for Package references. Signed-off-by: Bob Moore <robert.moore@intel.com> Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de> Signed-off-by: Len Brown <len.brown@intel.com>
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