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authorGeorgi Djakov <georgi.djakov@linaro.org>2021-04-02 13:12:27 +0300
committerGeorgi Djakov <georgi.djakov@linaro.org>2021-04-02 13:12:17 +0300
commit9e856a74bd02db82c57ad416dd50f91666178499 (patch)
tree785c54ffae1de4762a6cdfa8f1e55e92eac2175f /tools/Makefile
parent173ef5f84b6d57b221215275346cf5b39ca5a425 (diff)
parent7014dfee4e83348d04c450c698ae29add6e9f58f (diff)
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Merge branch 'icc-sdm660' into icc-next
This patch series adds the SDM660 interconnect provider driver in order to stop some timeouts and achieve some decent performance by avoiding to be NoC limited. It's also providing some power consumption improvement, but I have only measured that as less heat, which is quite important when working on thermally constrained devices like smartphones. Please note that this driver's yaml binding is referring to a MMCC clock, so this series does depend on the SDM660 MMCC driver that I have sent separately. The multimedia clock is required only for the Multimedia NoC (mnoc). This patch series has been tested against the following devices: - Sony Xperia XA2 Ultra (SDM630 Nile Discovery) - Sony Xperia 10 (SDM630 Ganges Kirin) - Sony Xperia 10 Plus (SDM636 Ganges Mermaid) * icc-sdm660 dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoC interconnect: qcom: Add SDM660 interconnect provider driver interconnect: qcom: sdm660: Fix kerneldoc warning Link: https://lore.kernel.org/r/20201017133718.31327-1-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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