| Commit message (Collapse) | Author | Age | Files | Lines |
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Marvell keeps their MMP2 datasheet secret, but there are good clues
that TWSI2 is not on 0xd4025000 on that platform, not does it use
IRQ 58. In fact, the IRQ 58 on MMP2 seems to be a signal processor:
arch/arm/mach-mmp/irqs.h:#define IRQ_MMP2_MSP 58
I'm taking a somewhat educated guess that is probably a copy & paste
error from PXA168 or PXA910 and that the real controller in fact hides
at address 0xd4031000 and uses an interrupt line multiplexed via IRQ 17.
I'm also copying some properties from TWSI1 that were missing or
incorrect.
Tested on a OLPC XO 1.75 machine, where the RTC is on TWSI2.
Signed-off-by: Lubomir Rintel <lkundrak@v3.sk>
Tested-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Olof Johansson <olof@lixom.net>
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There's apparently four of them on a MMP2.
Signed-off-by: Lubomir Rintel <lkundrak@v3.sk>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Olof Johansson <olof@lixom.net>
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The timer needs the timer clock to be enabled, otherwise it stops
ticking.
Signed-off-by: Lubomir Rintel <lkundrak@v3.sk>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Olof Johansson <olof@lixom.net>
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This will be useful for boards that actually use GPIO pins.
Signed-off-by: Lubomir Rintel <lkundrak@v3.sk>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Olof Johansson <olof@lixom.net>
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gpio-pxa uses two cell to encode the interrupt source: the pin number
and the trigger type. Adjust the device node accordingly.
Signed-off-by: Lubomir Rintel <lkundrak@v3.sk>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Olof Johansson <olof@lixom.net>
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The timer needs the timer clock to be enabled, otherwise it stops
ticking.
Signed-off-by: Lubomir Rintel <lkundrak@v3.sk>
Reviewed-by: Rob Herring <robh@kernel.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Olof Johansson <olof@lixom.net>
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git://git.kernel.org/pub/scm/linux/kernel/git/dinguyen/linux into next/dt
SoCFPGA DTS updates for v5.0
- Use SPDX license identifier for all SoCFPGA DTS files.
- Remove dma-mask property as it has been deprecated.
- Use tabs in DTS files.
- Use the specific "altr,stratix10-rst-mgr" property for the Stratix10
reset manager.
* tag 'socfpga_dts_updates_for_v5.0' of git://git.kernel.org/pub/scm/linux/kernel/git/dinguyen/linux:
arm64: dts: stratix10: use "altr,stratix10-rst-mgr" binding
ARM: dts: socfpga: use tabs for indentation
arm: dts: socfpga: remove dma-mask property
arm: dts: socfpga*.dts*: use SPDX-License-Identifier
Signed-off-by: Olof Johansson <olof@lixom.net>
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The standard reset-simple driver the uses the "altr,rst-mgr" binding is
not getting initialized early enough in the boot process, so timers
that the kernel needs are still left in reset. Thus an early
reset driver was created. This early reset driver is only for the
SoCFPGA 32-bit platform.
The Stratix10 platform does not need any of the timers that in reset to
boot, thus we don't need to early reset driver. Therefore, use the
"altr,stratix10-rst-mgr" binding for the reset-simple platform driver on
the Stratix10 platform.
Also remove the "altr,modrst-offset" property because the driver no
longer needs it.
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
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In two of the gen5 socfpga devicetree files, there are some lines
indented using spaces instead of tabs.
Fix this by correctly indenting them with tabs.
Signed-off-by: Simon Goldschmidt <simon.k.r.goldschmidt@gmail.com>
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
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The dma-mask property has been removed from the NAND driver. Remove the
property from the DTS files.
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
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Follow the recent trend for the license description.
This is also in an effort to fully sync the devicetrees with U-Boot.
Signed-off-by: Simon Goldschmidt <simon.k.r.goldschmidt@gmail.com>
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
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https://git.kernel.org/pub/scm/linux/kernel/git/horms/renesas into next/dt
Renesas ARM64 Based SoC DT Updates for v4.21
* H3 (r8a7795) SoC:
- Remove unneeded sound #address/size-cells
* M3-W (r8a7796) SoC:
- Describe CMT (Compare Match Timer) devices in DT
- Describe I2C-DVFS device node in DT
* M3-N (r8a77965) SoC:
- Describe CAN, CANFD and LVDS in DT
* R-Car H3 (r8a7795) and M3-W (r8a7796) SoCs:
- Describe CPU topology, capacity and cooling maps in DT
- Add SSIU support to R-Car audio
* R-Car H3 (r8a7795), M3-W (r8a7796) and M3-N (r8a77965) SoCs:
- Extend register range of HSUSB device to match documentation
* R-Car H3 (r8a7795), M3-W (r8a7796) and M3-N (r8a77965) based
Salvator-X, Salvator-XS and ULCB boards:
- Switch eMMC bus to 1V8
* R-Car H3 (r8a7795), M3-W (r8a7796) and M3-N (r8a77965) based
Salvator-X and Salvator-XS boards:
- Describe USB3.0 xHCI host and prerepheral devices as companions
* R-Car E3 (r8a77990) SoC:
- Add thermal support
- Add support for interupt controller for external devices (INTC-EX)
- Describe all SCIF devices and SYS-DMA for I2C and MSIOF devices
* R-Car E3 (r8a77990) based Ebisu board:
- Enable SDHI, CAN, CANFD, audio and USB3.0
- Describe serial console pins
* R-Car E3 (r8a77990) based Ebisu and
R-Car D3 (r8a77995) based Draak board:
- Enable USB2.0 peripheral device
* R-Car M3-N (r8a77965), E3 (r8a77990) and V3H (r8a77980) SoCs:
- Connect EtherAVB to IPMMU
* R-Car V3M (r8a77970) and V3H (r8a77980) SoCs:
- Describe TMU (timer unit), PWM timer controller and MSIOF devides in DT
- Add thermal support
* RZ/G2M (r8a774a1) SoC:
- Use clock and power index macros
- Describe VIN, CSI-2 and CAN devices in DT
* tag 'renesas-arm64-dt-for-v4.21' of https://git.kernel.org/pub/scm/linux/kernel/git/horms/renesas: (40 commits)
arm64: dts: renesas: Add all CPUs in cooling maps
arm64: dts: renesas: r8a77990: add thermal device support
arm64: dts: renesas: r8a77990: Enable I2C DMA
arm64: dts: renesas: r8a7796: Add CMT device nodes
arm64: dts: renesas: r8a7796: add SSIU support for sound
arm64: dts: renesas: r8a77990: Add I2C-DVFS device node
arm64: dts: renesas: r8a77990: ebisu: Add and enable CAN,FD device nodes
arm64: dts: renesas: r8a77965: Add CAN and CANFD controller nodes
arm64: dts: renesas: r8a77990: ebisu: Add and enable PCIe device node
arm64: dts: renesas: Add CPU capacity-dmips-mhz
arm64: dts: renesas: Add CPU topology on R-Car Gen3 SoCs
arm64: dts: renesas: r8a774a1: Replace clock magic numbers
arm64: dts: renesas: r8a774a1: Replace power magic numbers
arm64: dts: renesas: r8a7795: add SSIU support for sound
arm64: dts: renesas: r8a77990: Fix VIN endpoint numbering
arm64: dts: renesas: ebisu: Add and enable SDHI device nodes
arm64: dts: renesas: ebisu: Add serial console pins
arm64: dts: renesas: Switch eMMC bus to 1V8 on Salvator-X and ULCB
arm64: dts: renesas: r8a77990: Add all HSCIF nodes
arm64: dts: renesas: r8a779{7|8}0: add TMU support
...
Signed-off-by: Olof Johansson <olof@lixom.net>
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Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.
Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.
Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds the thermal device node and the thermal-zone for
the R8A77990 SoC.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch enables I2C DMA.
NOTE: I2C7 DMA is not supported by R-Car Gen3 Hardware User's Manual
Rev.0.80E.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds CMT{0|1|2|3} device nodes for r8a7796 SoC.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
To avoid git merge timing issue / git bisect issue,
this patch doesn't remove it so far, but will be removed in
the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds I2C-DVFS device node for the R8A77990 SoC.
v2
* Drop aliases update as in upstream it is not required to configure the
BD9571 PMIC for DDR backup, nor is the use of i2c are aliases desired.
* Do not describe the device as compatible with "renesas,rcar-gen3-iic" or
"renesas,rmobile-iic" fallback compat strings. The absence of automatic
transmission registers leads us to declare the r8a77990 IIC controller as
incompatible.
v2.1
* Reduced register range to reflect documentation
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds CAN0,1 and CANFD device nodes for the r8a77990 SoC
and enables CANFD connected to CN10 on the E3 Ebisu board using the
R8A77990 SoC.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds CAN{0,1} and CANFD controller nodes for the R8A77965 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds PCI express channel 0 device node to the R8A77990 SoC
and enables PCIEC0 PCI express controller on the Ebisu board.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Set the capacity-dmips-mhz for R-Car Gen3 SoCs, that is based on
dhrystone. The average in 10 times of dhrystone result as follows:
r8a7795 SoC (A57x4 + A53x4)
CPU max-freq dhrystone
---------------------------------
A57 1500 MHz 11470943 lps/s
A53 1200 MHz 4798583 lps/s
r8a7796 SoC (A57x2 + A53x4)
CPU max-freq dhrystone
---------------------------------
A57 1500 MHz 11463526 lps/s
A53 1200 MHz 4793276 lps/s
Based on above, capacity-dmips-mhz values are calculated as follows:
r8a7795 SoC
A57 : 1024 / (11470943 / 1500) * (11470943 / 1500) = 1024
A53 : 1024 / (11470943 / 1500) * ( 4798583 / 1200) = 535
r8a7796 SoC
A57 : 1024 / (11463526 / 1500) * (11463526 / 1500) = 1024
A53 : 1024 / (11463526 / 1500) * ( 4793276 / 1200) = 535
However, since each CPUs have different max frequencies, the final
CPU capacities of A53 are scaled by this difference, the values are
as follows.
[r8a7795 SoC]
$ cat /sys/devices/system/cpu/cpu*/cpu_capacity
1024 <---- CPU capacity of A57
1024
1024
1024
428 <---- CPU capacity of A53
428
428
428
[r8a7796 SoC]
$ cat /sys/devices/system/cpu/cpu*/cpu_capacity
1024 <---- CPU capacity of A57
1024
428 <---- CPU capacity of A53
428
428
428
Signed-off-by: Gaku Inami <gaku.inami.xh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds the "cpu-map" into r8a7795/r8a7796 composed of
multi-cluster. This definition is used to parse the cpu topology.
Signed-off-by: Gaku Inami <gaku.inami.xh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Now that include/dt-bindings/clock/r8a774a1-cpg-mssr.h is in Linus'
master branch we can replace clock related magic numbers with the
corresponding labels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
[simon: corrected whitespace]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Now that include/dt-bindings/power/r8a774a1-sysc.h is in Linus'
master branch we can replace power related magic numbers with
the corresponding labels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
To avoid git merge timing issue / git bisect issue,
this patch doesn't remove it so far, but will be removed in
the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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The VIN driver bindings dictates fixed numbering for VIN endpoints connected
to CSI-2 endpoints, even when a single endpoint exists.
Without proper endpoint numbering the VIN driver fails to probe.
Based on a patch in BSP from Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Fixes: ec70407ae7d7 ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds SDHI{0,1,3} device nodes for the r8a77990 SoC
and enables SD card slot connected to SDHI0, micro SD card slot
connected to SDHI1 and eMMC connected to SDHI3 on the Ebisu board
using the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Simon Horman <horms+renesas@verge.net.au>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Cc: linux-renesas-soc@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds pin control for SCIF2 on R8A77990 E3 Ebisu.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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The eMMC card has two supplies, VCC and VCCQ. The VCC supplies the NAND
array and the VCCQ supplies the bus. On Salvator-X and ULCB, the VCC is
connected to 3.3V rail, while the VCCQ is connected to 1.8V rail. Adjust
the pinmux to match the bus, which is always operating in 1.8V mode.
While at it, deduplicate the pinmux entries, which are now the same for
both default and UHS modes. We still need the two pinctrl entries to
match the bindings though.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds the device nodes for all HSCIF serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Describe TMUs in the R8A779{7|8}0 device trees.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch enables Audio for the Ebisu board on R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: rebased]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds Audio-DMAC0 device node and Sound device node
for the R8A77990 SoC.
Based on work by Takeshi Kihara and Hai Nguyen Pham.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
[simon: dropped include update, which is already present]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds/enables USB2.0 peripheral for R-Car [DE]3 boards.
R-Car E3 Ebisu board connects the ID pin to the SoC, so this adds
a group "usb0_id" into usb0_pins node. Also, to use SW15 pin 3 side,
this patch adds vbus0_usb2 node on r8a77990-ebisu.dts.
R-Car D3 Draak board doesn't connect the ID pin, so this adds
"renesas,no-otg-pins" property into usb2_phy0 node.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds a property "companion" with xhci0 phandle to
the usb3_peri0 node in salvator-common.dtsi.
About the detail of this property for renesas_usb3 udc driver, please
refer to the commit 39facfa01c9f ("usb: gadget: udc: renesas_usb3:
Add register of usb role switch").
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Hook up the R-Car E3 AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Hook up the R-Car V3H AVB device to IPMMU-DS1 33 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Hook up the R-Car M3-N AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds/enables USB3.0 peripheral device node for r8a77990
ebisu board.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds the device nodes for SCIF-{0,1,3,4,5} serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Describe MSIOF in the R8A779{7|8}0 device trees.
The DMA props are omitted for R8A77980 as the RT-DMAC isn't supported
(yet?)...
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Add VIN and CSI-2 nodes to RZ/G2M SoC dtsi.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch revises the reg size of each hsusb device node for
r8a7795, r8a7796 and r8a77965.
Reported-by: Biju Das <biju.das@bp.renesas.com>
Fixes: d2422e108812 ("arm64: dts: r8a7795: Add HSUSB device node")
Fixes: 4725f2b88057 ("arm64: dts: renesas: r8a7795: add hsusb ch3 device node")
Fixes: b9535853777f ("arm64: dts: r8a7796: Add HSUSB device node")
Fixes: 9e1b00a2ef43 ("arm64: dts: renesas: r8a77965: Add "reg" properties")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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The M3-N (r8a77965) platform has one LVDS encoder connected to the DU.
Add the corresponding DT node and wire it up.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Describe THS/CIVM in the R8A77980 device trees.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Describe THS/CIVM in the R8A77970 device tree.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds DMA properties to the MSIOF device nodes of R8A77990 SoC.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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Describe PWMs in the R8A779{7|8}0 device trees.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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This patch adds a device node for the Interrupt Controller for External
Devices (INTC-EX) on R-Car E3, which serves external IRQ pins IRQ[0-5].
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
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