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* dt-bindings: drop redundant part of title (manual)Krzysztof Kozlowski2022-12-161-1/+1
| | | | | | | | | | | | | | | | | | | | The Devicetree bindings document does not have to say in the title that it is a "Devicetree binding" or a "schema", but instead just describe the hardware. Manual updates to various binding titles, including capitalizing them. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org [robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml] Signed-off-by: Rob Herring <robh@kernel.org>
* dt-bindings: drop redundant part of title (end, part three)Krzysztof Kozlowski2022-12-1610-10/+10
| | | | | | | | | | | | | | | | | | | | | | | | | The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org>
* Merge tag 'thermal-6.2-rc1-2' of ↵Linus Torvalds2022-12-157-108/+198
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull more thermal control updates from Rafael Wysocki: "These are updates of assorted thermal drivers, mostly for ARM platforms, generally isolated and fairly straightforward, and the recent Intel HFI driver fix for systems without HFI support. Specifics: - Avoid clearing the HFI status bit on systems without HFI support which triggers unchecked MSR access errors (Srinivas Pandruvada) - Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca Weiss, Neil Armstrong) - Use devm_platform_get_and_ioremap_resource on the ST platform to group two calls into a single one (Minghao Chi) - Use GENMASK instead of bitmaps and validate the temperature after reading it in the imx8mm_thermal driver (Marcus Folkesson) - Convert generic-adc-thermal to DT schema (Rob Herring) - Fix debug print message with inverted logic in the k3_j72xx_bandgap driver (Keerthy) - Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel) - Add support for IPQ8074 in the tsens thermal driver along with the DT bindings (Robert Marko) - Fix and rework the debugfs code in the tsens driver (Christian Marangi) - Add calibration and DT documentation for the imx8mm driver (Marek Vasut) - Add DT bindings and compatible for the Mediatek SoCs mt7981 and mt7983 (Daniel Golle) - Don't show an error message if it happens at probe time while it will be deferred on the QCom SPMI ADC driver (Johan Hovold) - Add HWMon support for the imx8mm board (Alexander Stein) - Remove pointless include from the power allocator governor (Christophe JAILLET) - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450 (Krzysztof Kozlowski) - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss) - Demote error log of thermal zone register to debug in the tsens QCom driver (Manivannan Sadhasivam) - Consolidate the the efuse values and the errata handling in the TI Bandgap driver (Bryan Brattlof) - Document Renesas RZ/Five as compatible with RZ/G2UL in the DT bindings (Lad Prabhakar) - Fix the irq handler return value in the LMh driver (Bjorn Andersson) - Delete empty platform remove callback from imx_sc_thermal (Uwe Kleine-König)" * tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits) thermal/drivers/imx_sc_thermal: Drop empty platform remove function thermal/drivers/qcom/lmh: Fix irq handler return value dt-bindings: thermal: qcom-tsens: Add compatible for sm8550 thermal/drivers/st: Use devm_platform_get_and_ioremap_resource() dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range dt-bindings: thermal: k3-j72xx: elaborate on binding description thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function thermal/drivers/qcom: Demote error log of thermal zone register to debug thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2 dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450 thermal/core/power allocator: Remove a useless include thermal/drivers/imx8mm: Add hwmon support thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC thermal: ti-soc-thermal: Drop comma after SoC match table sentinel thermal/drivers/imx: Add support for loading calibration data from OCOTP ...
| * dt-bindings: thermal: qcom-tsens: Add compatible for sm8550Neil Armstrong2022-12-141-0/+1
| | | | | | | | | | | | | | | | | | | | | | The Qualcomm SM8550 platform has three instances of the tsens block, add a compatible for these instances. Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoCLad Prabhakar2022-12-141-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL SoC. "renesas,r9a07g043-tsu" compatible string will be used on the RZ/Five SoC so to make this clear, update the comment to include RZ/Five SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: k3-j72xx: conditionally require efuse reg rangeBryan Brattlof2022-12-141-0/+16
| | | | | | | | | | | | | | | | | | | | | | | | | | | | Only some of TI's J721E SoCs will need a eFuse register range mapped to determine if they're affected by TI's i2128 erratum. All other SoC will not need this eFuse range to function properly Update the bindings for the k3_j72xx_bandgap thermal driver so other devices will only need two register ranges Signed-off-by: Bryan Brattlof <bb@ti.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: k3-j72xx: elaborate on binding descriptionBryan Brattlof2022-12-141-1/+18
| | | | | | | | | | | | | | | | | | | | Elaborate on the function of this device node as well as some of the properties this node uses. Signed-off-by: Bryan Brattlof <bb@ti.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and ↵Krzysztof Kozlowski2022-12-141-0/+3
| | | | | | | | | | | | | | | | | | | | | | | | SM8450 Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450. The compatibles are already used and described. They only missed the constraints of number of interrupts. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoCDaniel Golle2022-12-141-0/+2
| | | | | | | | | | | | | | | | | | | | | | Document compatible string 'mediatek,mt7986-thermal' for V3 thermal unit found in MT7986 SoCs. 'mediatek,mt7981-thermal' is also added as it is identical with the thermal unit of MT7986. Signed-off-by: Daniel Golle <daniel@makrotopia.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: imx8mm-thermal: Document optional nvmem-cellsMarek Vasut2022-12-141-0/+7
| | | | | | | | | | | | | | | | | | | | The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values from OCOTP. Document optional phandle to OCOTP nvmem provider. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Marek Vasut <marex@denx.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
| * dt-bindings: thermal: tsens: Add ipq8074 compatibleRobert Marko2022-12-141-11/+65
| | | | | | | | | | | | | | | | | | | | | | | | | | Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it only uses one IRQ, so tsens v2 compatible cannot be used as the fallback. We also have to make sure that correct interrupts are set according to compatibles, so populate interrupt information per compatibles. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
| * dt-bindings: thermal: Convert generic-adc-thermal to DT schemaRob Herring2022-12-142-95/+84
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Convert the 'generic-adc-thermal' binding to DT schema format. The binding said '#thermal-sensor-cells' should be 1, but all in tree users are 0 and 1 doesn't make sense for a single channel. Drop the example's related providers and consumers of the 'generic-adc-thermal' node as the convention is to not have those in the examples. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
| * dt-bindings: thermal: tsens: Add sm8450 compatibleLuca Weiss2022-12-141-0/+1
| | | | | | | | | | | | | | | | | | Document the tsens-v2 compatible for sm8450 SoC. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221016090035.565350-5-luca@z3ntu.xyz Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | Merge tag 'devicetree-for-6.2' of ↵Linus Torvalds2022-12-134-75/+86
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: "DT Bindings: - Various LED binding conversions and clean-ups. Convert the ir-spi-led, pwm-ir-tx, and gpio-ir-tx LED bindings to schemas. Consistently reference LED common.yaml or multi-led schemas and disallow undefined properties. - Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts, and fsl,imx-fb bindings to schema - Add ata-generic, Broadcom u-boot environment, and dynamic MTD sub-partitions bindings. - Make all SPI based displays reference spi-peripheral-props.yaml - Fix some schema property regex's which should be fixed strings or were missing start/end anchors - Remove 'status' in examples, again... DT Core: - Fix a possible NULL dereference in overlay functions - Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which never worked) - Add of_address_count() helper to count number of 'reg' entries - Support .dtso extension for DT overlay source files. Rename staging and unittest overlay files. - Update dtc to upstream v1.6.1-63-g55778a03df61" * tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (42 commits) dt-bindings: leds: Add missing references to common LED schema dt-bindings: leds: intel,lgm: Add missing 'led-gpios' property of: overlay: fix null pointer dereferencing in find_dup_cset_node_entry() and find_dup_cset_prop() dt-bindings: lcdif: Fix constraints for imx8mp media: dt-bindings: atmel,isc: Drop unneeded unevaluatedProperties dt-bindings: Drop Jee Heng Sia dt-bindings: thermal: cooling-devices: Add missing cache related properties dt-bindings: leds: irled: ir-spi-led: convert to DT schema dt-bindings: leds: irled: pwm-ir-tx: convert to DT schema dt-bindings: leds: irled: gpio-ir-tx: convert to DT schema dt-bindings: leds: mt6360: rework to match multi-led dt-bindings: leds: lp55xx: rework to match multi-led dt-bindings: leds: lp55xx: switch to preferred 'gpios' suffix dt-bindings: leds: lp55xx: allow label dt-bindings: leds: use unevaluatedProperties for common.yaml dt-bindings: thermal: tsens: Add SM6115 compatible of/kexec: Fix reading 32-bit "linux,initrd-{start,end}" values dt-bindings: display: Convert fsl,imx-fb.txt to dt-schema dt-bindings: Add missing start and/or end of line regex anchors dt-bindings: qcom,pdc: Add missing compatibles ...
| * | dt-bindings: thermal: cooling-devices: Add missing cache related propertiesRob Herring2022-12-061-0/+4
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The examples' cache nodes are incomplete as 'cache-unified' and 'cache-level' are required cache properties. Acked-by: Amit Kucheria <amitk@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221104162450.1982114-1-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
| * | dt-bindings: thermal: tsens: Add SM6115 compatibleAdam Skladowski2022-12-061-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Document compatible for tsens on Qualcomm SM6115 platform according to downstream dts it ship v2.4 of IP Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221130200950.144618-3-a39.skl@gmail.com Signed-off-by: Rob Herring <robh@kernel.org>
| * | dt-bindings: Drop type from 'cpus' propertyRob Herring2022-12-061-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | 'cpus' is a common property, and it is now defined in dtschema schemas, so drop the type references in the tree. Acked-by: Suzuki K Poulose <suzuki.poulse@arm.com> Acked-by: Bjorn Andersson <andersson@kernel.org> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20221111212857.4104308-1-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
| * | dt-bindings: thermal: thermal-idle: Fix example pathsRob Herring2022-12-061-74/+80
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The reference by path (&{/cpus/cpu@101/thermal-idle}) in the example causes an error with new version of dtc: FATAL ERROR: Can't generate fixup for reference to path &{/cpus/cpu@100/thermal-idle} This is because the examples are built as an overlay and absolute paths are not valid as references must be by label. The path was also not resolvable because, by default, examples are placed under 'example-N' nodes. As the example contains top-level nodes, the root node must be explicit for the example to be extracted as-is. This changes the indentation for the whole example, but the existing indentation is a mess of of random amounts. Clean this up to be 4 spaces everywhere. Link: https://lore.kernel.org/r/20221111162729.3381835-1-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
* / dt-bindings: iio: qcom: adc7-pm8350: Allow specifying SID for channelsManivannan Sadhasivam2022-11-061-3/+3
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | As per the new ADC7 architecture used by the Qualcomm PMICs, each PMIC has the static Slave ID (SID) assigned by default. The primary PMIC PMK8350 is responsible for collecting the temperature/voltage data from the slave PMICs and exposing them via it's registers. For getting the measurements from the slave PMICs, PMK8350 uses the channel ID encoded with the SID of the relevant PMIC. So far, the dt-binding for the slave PMIC PM8350 assumed that there will be only one PM8350 in a system. So it harcoded SID 1 with channel IDs. But this got changed in platforms such as Lenovo X13s where there are a couple of PM8350 PMICs available. So to address multiple PM8350s, change the binding to accept the SID specified by the user and use it for encoding the channel ID. It should be noted that, even though the SID is static it is not globally unique. Only the primary PMIC has the unique SID id 0. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Signed-off-by: Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20221103095810.64606-2-manivannan.sadhasivam@linaro.org
* Merge tag 'devicetree-for-6.1' of ↵Linus Torvalds2022-10-101-1/+1
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: "DT core: - Fix node refcounting in of_find_last_cache_level() - Constify device_node in of_device_compatible_match() - Fix 'dma-ranges' handling in bus controller nodes - Fix handling of initrd start > end - Improve error reporting in of_irq_init() - Taint kernel on DT unittest running - Use strscpy instead of strlcpy - Add a build target, dt_compatible_check, to check for compatible strings used in kernel sources against compatible strings in DT schemas. - Handle DT_SCHEMA_FILES changes when rebuilding DT bindings: - LED bindings for MT6370 PMIC - Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller, mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc, and arm,versatile-sysreg to DT schema format - Add nvmem cells to u-boot,env schema - Add more LED_COLOR_ID definitions - Require 'opp-table' uses to be a node - Various schema fixes to match QEMU 'virt' DT usage - Tree wide dropping of redundant 'Device Tree Binding' in schema titles - More (unevaluated|additional)Properties fixes in schema child nodes - Drop various redundant minItems equal to maxItems" * tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits) of: base: Shift refcount decrement in of_find_last_cache_level() dt-bindings: leds: Add MediaTek MT6370 flashlight dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator dt-bindings: mailbox: Convert mtk-gce to DT schema of: base: make of_device_compatible_match() accept const device node of: Fix "dma-ranges" handling for bus controllers of: fdt: Remove unused struct fdt_scan_status dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node dt-bindings: timer: Add power-domains for TI timer-dm on K3 dt: Add a check for undocumented compatible strings in kernel kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML dt-bindings: i2c: migrate mt7621 text bindings to YAML dt-bindings: power: gpcv2: correct patternProperties dt-bindings: virtio: Convert virtio,pci-iommu to DT schema dt-bindings: timer: arm,arch_timer: Allow dual compatible string dt-bindings: arm: cpus: Add kryo240 compatible dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema dt-bindings: nvmem: u-boot,env: add basic NVMEM cells dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema ...
| * dt-bindings: Remove 'Device Tree Bindings' from end of title:Andrew Lunn2022-08-251-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | As indicated in link: https://lore.kernel.org/all/20220822204945.GA808626-robh@kernel.org/ DT schema files should not have 'Device Tree Binding' as part of there title: line. Remove this in most .yaml files, so hopefully preventing developers copying it into new .yaml files, and being asked to remove it. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Link: https://lore.kernel.org/r/20220825020427.3460650-1-andrew@lunn.ch Signed-off-by: Rob Herring <robh@kernel.org>
* | Merge branch 'thermal-core'Rafael J. Wysocki2022-08-271-0/+1
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Merge thermal control core fixes for 6.0-rc3: - Fix missing required property for thermal zone description (Daniel Lezcano). - Add missing export symbol for thermal_zone_device_register_with_trips() (Daniel Lezcano). * thermal-core: dt-bindings: thermal: Fix missing required property thermal/core: Add missing EXPORT_SYMBOL_GPL
| * | dt-bindings: thermal: Fix missing required propertyDaniel Lezcano2022-08-151-0/+1
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | When the thermal zone description was converted to yaml schema, the required 'trips' property was forgotten. The initial text bindings was describing: " [ ... ] * Thermal zone nodes The thermal zone node is the node containing all the required info for describing a thermal zone, including its cooling device bindings. The thermal zone node must contain, apart from its own properties, one sub-node containing trip nodes and one sub-node containing all the zone cooling maps. Required properties: - polling-delay: The maximum number of milliseconds to wait between polls Type: unsigned when checking this thermal zone. Size: one cell - polling-delay-passive: The maximum number of milliseconds to wait Type: unsigned between polls when performing passive cooling. Size: one cell - thermal-sensors: A list of thermal sensor phandles and sensor specifier Type: list of used while monitoring the thermal zone. phandles + sensor specifier - trips: A sub-node which is a container of only trip point nodes Type: sub-node required to describe the thermal zone. Optional property: - cooling-maps: A sub-node which is a container of only cooling device Type: sub-node map nodes, used to describe the relation between trips and cooling devices. [ ... ] " Now the schema describes: " [ ... ] required: - polling-delay - polling-delay-passive - thermal-sensors [ ... ] " Add the missing 'trips' property in the required properties. Fixed: 1202a442a31fd ("dt-bindings: thermal: Add yaml bindings for thermal zones") Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
* / dt-bindings: Fix incorrect "the the" correctionsGeert Uytterhoeven2022-08-181-1/+1
|/ | | | | | | | | | Lots of double occurrences of "the" were replaced by single occurrences, but some of them should become "to the" instead. Fixes: 12e5bde18d7f6ca4 ("dt-bindings: Fix typo in comment") Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/c5743c0a1a24b3a8893797b52fed88b99e56b04b.1660755148.git.geert+renesas@glider.be Signed-off-by: Jakub Kicinski <kuba@kernel.org>
* Merge tag 'devicetree-for-6.0' of ↵Linus Torvalds2022-08-043-3/+3
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: "Bindings: - Add spi-peripheral-props.yaml references to various SPI device bindings - Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x, skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and arm-firmware-suite bindings to DT schema format - New bindings for Arm virtual platforms display, Qualcomm IMEM memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027 RTC, and arm,cortex-a78ae - Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec, quanta, and densitron - Add missing MSI and IOMMU properties to host-generic-pci - Remove bindings for removed EFM32 platform - Remove old chosen.txt binding (replaced by schema) - Treewide add missing type information for properties - Treewide fixing of typos and its vs. it's in bindings. Its all good now. - Drop unnecessary quoting in power related schemas - Several LED binding updates which didn't get picked up - Move various bindings to proper directories DT core code: - Convert unittest GPIO related tests to use fwnode - Check ima-kexec-buffer against memory bounds - Print reserved-memory allocation/reservation failures as errors - Cleanup early_init_dt_reserve_memory_arch() - Simplify of_overlay_fdt_apply() tail" * tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits) dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml dt-bindings: power: supply: drop quotes when not needed dt-bindings: power: reset: drop quotes when not needed dt-bindings: power: drop quotes when not needed dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties of/fdt: declared return type does not match actual return type devicetree/bindings: correct possessive "its" typos dt-bindings: net: convert emac_rockchip.txt to YAML dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory dt-bindings: eeprom: at25: use spi-peripheral-props.yaml dt-bindings: display: use spi-peripheral-props.yaml dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema dt-bindings: power: reset: qcom,pon: use absolute path to other schema dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts' dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat' dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode' of/fdt: Clean up early_init_dt_reserve_memory_arch() dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high' dt-bindings: rtc: Add EM Microelectronic EM3027 bindings dt-bindings: rtc: ds1307: Convert to json-schema ...
| * dt-bindings: Fix typo in commentSlark Xiao2022-07-213-3/+3
| | | | | | | | | | | | | | | | | | Fix typo in the comment Signed-off-by: Slark Xiao <slark_xiao@163.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220721011746.19663-1-slark_xiao@163.com
* | Merge tag 'thermal-5.20-rc1' of ↵Linus Torvalds2022-08-023-65/+107
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control updates from Rafael Wysocki: "These start a rework of the handling of trip points in the thermal core, improve the cpufreq/devfreq cooling device handling, update some thermal control drivers and the tmon utility and clean up code. Specifics: - Consolidate the thermal core code by beginning to move the thermal trip structure from the thermal OF code as a generic structure to be used by the different sensors when registering a thermal zone (Daniel Lezcano). - Make per cpufreq / devfreq cooling device ops instead of using a global variable, fix comments and rework the trace information (Lukasz Luba). - Add the include/dt-bindings/thermal.h under the area covered by the thermal maintainer in the MAINTAINERS file (Lukas Bulwahn). - Improve the error output by giving the sensor identification when a thermal zone failed to initialize, the DT bindings by changing the positive logic and adding the r8a779f0 support on the rcar3 (Wolfram Sang). - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof Kozlowski). - Remove the pointless get_trend() function in the QCom, Ux500 and tegra thermal drivers, along with the unused DROP_FULL and RAISE_FULL trends definitions. Simplify the code by using clamp() macros (Daniel Lezcano). - Fix ref_table memory leak at probe time on the k3_j72xx bandgap (Bryan Brattlof). - Fix array underflow in prep_lookup_table (Dan Carpenter). - Add static annotation to the k3_j72xx_bandgap_j7* data structure (Jin Xiaoyun). - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall). - Fix typos in comments on rzg2l (Biju Das). - Remove as unnecessary call to dev_err() as the error is already printed by the failing function on u8500 (Yang Li). - Register the thermal zones as hwmon sensors for the Qcom thermal sensors (Dmitry Baryshkov). - Fix 'tmon' tool compilation issue by adding phtread.h include (Markus Mayer). - Fix typo in the comments for the 'tmon' tool (Slark Xiao). - Make the thermal core use ida_alloc()/free() directly instead of ida_simple_get()/ida_simple_remove() that have been deprecated (keliu). - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control driver (Rafael Wysocki)" * tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits) thermal/of: Initialize trip points separately thermal/of: Use thermal trips stored in the thermal zone thermal/core: Add thermal_trip in thermal_zone thermal/core: Rename 'trips' to 'num_trips' thermal/core: Move thermal_set_delay_jiffies to static thermal/core: Remove unneeded EXPORT_SYMBOLS thermal/of: Move thermal_trip structure to thermal.h thermal/of: Remove the device node pointer for thermal_trip thermal/of: Replace device node match with device node search thermal/core: Remove duplicate information when an error occurs thermal/core: Avoid calling ->get_trip_temp() unnecessarily thermal/tools/tmon: Fix typo 'the the' in comment thermal/tools/tmon: Include pthread and time headers in tmon.h thermal/ti-soc-thermal: Fix comment typo thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors thermal/drivers/u8500: Remove unnecessary print function dev_err() thermal/drivers/rzg2l: Fix comments thermal/drivers/sun8i: Fix typo in comment thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static ...
| * \ Merge tag 'thermal-v5.20-rc1' of ↵Rafael J. Wysocki2022-07-293-65/+107
| |\ \ | | |/ | |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal control changes for 5.20-rc1 from Daniel Lezcano: "- Make per cpufreq / devfreq cooling device ops instead of using a global variable, fix comments and rework the trace information (Lukasz Luba) - Add the include/dt-bindings/thermal.h under the area covered by the thermal maintainer in the MAINTAINERS file (Lukas Bulwahn) - Improve the error output by giving the sensor identification when a thermal zone failed to initialize, the DT bindings by changing the positive logic and adding the r8a779f0 support on the rcar3 (Wolfram Sang) - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof Kozlowski) - Remove the pointless get_trend() function in the QCom, Ux500 and tegra thermal drivers, along with the unused DROP_FULL and RAISE_FULL trends definitions. Simplify the code by using clamp() macros (Daniel Lezcano) - Fix ref_table memory leak at probe time on the k3_j72xx bandgap (Bryan Brattlof) - Fix array underflow in prep_lookup_table (Dan Carpenter) - Add static annotation to the k3_j72xx_bandgap_j7* data structure (Jin Xiaoyun) - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall) - Fix typos in comments on rzg2l (Biju Das) - Remove as unnecessary call to dev_err() as the error is already printed by the failing function on u8500 (Yang Li) - Register the thermal zones as hwmon sensors for the Qcom thermal sensors (Dmitry Baryshkov) - Fix 'tmon' tool compilation issue by adding phtread.h include (Markus Mayer) - Fix typo in the comments for the 'tmon' tool (Slark Xiao) - Consolidate the thermal core code by beginning to move the thermal trip structure from the thermal OF code as a generic structure to be used by the different sensors when registering a thermal zone (Daniel Lezcano)" * tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits) thermal/of: Initialize trip points separately thermal/of: Use thermal trips stored in the thermal zone thermal/core: Add thermal_trip in thermal_zone thermal/core: Rename 'trips' to 'num_trips' thermal/core: Move thermal_set_delay_jiffies to static thermal/core: Remove unneeded EXPORT_SYMBOLS thermal/of: Move thermal_trip structure to thermal.h thermal/of: Remove the device node pointer for thermal_trip thermal/of: Replace device node match with device node search thermal/core: Remove duplicate information when an error occurs thermal/core: Avoid calling ->get_trip_temp() unnecessarily thermal/tools/tmon: Fix typo 'the the' in comment thermal/tools/tmon: Include pthread and time headers in tmon.h thermal/ti-soc-thermal: Fix comment typo thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors thermal/drivers/u8500: Remove unnecessary print function dev_err() thermal/drivers/rzg2l: Fix comments thermal/drivers/sun8i: Fix typo in comment thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static ...
| | * dt-bindings: thermal: rcar-gen3-thermal: Add r8a779f0 supportWolfram Sang2022-07-281-5/+14
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for R-Car S4. The S4 IP differs a bit from its siblings in such way that it has 3 out of 4 TSC nodes for Linux and the interrupts are not routed to the INTC-AP but to the ECM. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
| | * dt-bindings: thermal: rcar-gen3-thermal: use positive logicWolfram Sang2022-07-281-11/+10
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | When handling the V3U/r8a779a0 exception, avoid using 'not:' because then its subschemas are far away in the 'else:' branch. Keep them together using positive logic. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20220610201701.7946-1-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
| | * dt-bindings: thermal: qcom,spmi-temp-alarm: convert to dtschemaKrzysztof Kozlowski2022-07-282-51/+85
| | | | | | | | | | | | | | | | | | | | | | | | | | | Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220608112702.80873-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: Add fsl,scu-thermal yaml fileAbel Vesa2022-07-081-0/+38
|/ / | | | | | | | | | | | | | | | | | | | | In order to replace the fsl,scu txt file from bindings/arm/freescale, we need to split it between the right subsystems. This patch documents separately the 'thermal' child node of the SCU main node. Signed-off-by: Abel Vesa <abel.vesa@nxp.com> Signed-off-by: Viorel Suman <viorel.suman@nxp.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Shawn Guo <shawnguo@kernel.org>
* | Merge tag 'devicetree-for-5.19' of ↵Linus Torvalds2022-05-251-0/+1
|\ \ | |/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: "Bindings: - Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm, qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen, Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq, fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers - Convert various Arm Ltd peripheral IP bindings to schemas - New bindings for Menlo board CPLD, DH electronics board CPLD, Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751 GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and Microchip/SMSC LAN95xx USB Ethernet controllers - Add vendor prefix for Enclustra - Add various compatible string additions - Various example fixes and cleanups - Remove unused hisilicon,hi6220-reset binding - Treewide fix properties missing type definition - Drop some empty and unreferenced .txt bindings - Documentation improvements for writing schemas DT driver core: - Drop static IRQ resources for DT platform devices as IRQ setup is dynamic and drivers have all been converted to use platform_get_irq() and friends - Rework memory allocations and frees for overlays - Continue overlay notifier callbacks on successful calls and add unittests - Handle 'interrupts-extended' in early DT IRQ setup - Fix of_property_read_string() errors to match documentation - Ignore disabled nodes in FDT API calls" * tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits) of/irq: fix typo in comment dt-bindings: Fix properties without any type Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example" dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings dt-bindings: timer: samsung,exynos4210-mct: define strict clock order dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems dt-bindings: timer: cdns,ttc: drop unneeded minItems dt-bindings: mailbox: zynqmp_ipi: convert to yaml dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers dt-bindings: net: add schema for ASIX USB Ethernet controllers of/fdt: Ignore disabled memory nodes dt-bindings: arm: fix typos in compatible dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360 dt-bindings: display: convert Arm Komeda to DT schema dt-bindings: display: convert Arm Mali-DP to DT schema dt-bindings: display: convert Arm HDLCD to DT schema dt-bindings: display: convert PL110/PL111 to DT schema dt-bindings: arm: convert vexpress-config to DT schema dt-bindings: arm: convert vexpress-sysregs to DT schema ...
| * Merge branch 'dt/linus' into dt/nextRob Herring2022-05-091-1/+0
| |\ | | | | | | | | | Pick up new meta-schema fixes.
| * | dt-bindings: thermal: tsens: Add SM6350 compatibleLuca Weiss2022-04-081-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add devicetree compatible for tsens on SM6350 SoC. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211213082614.22651-6-luca.weiss@fairphone.com
* | | dt-bindings: thermal: k3-j72xx: Add VTM bindings documentationKeerthy2022-05-191-0/+63
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 J72XX supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: tsens: Add sc8280xp compatibleBjorn Andersson2022-05-191-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The Qualcomm SC8280XP platform has three instances of the tsens block, add a compatible for these instances. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatibleBjorn Andersson2022-05-191-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add compatible for the LMh blocks found in the Qualcomm sc8180x platform. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindingsBiju Das2022-05-191-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one found on RZ/G2L SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: qcom-tsens.yaml: add msm8960 compat stringDmitry Baryshkov2022-05-191-1/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add compatibility string for the thermal sensors on MSM8960/APQ8064 platforms. Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: qcom: add PMIC5 Gen2 ADC_TM bindingsJishnu Prakash2022-05-191-2/+108
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add documentation for PMIC5 Gen2 ADC_TM peripheral. It is used for monitoring ADC channel thresholds for PMIC7-type PMICs. It is present on PMK8350, like PMIC7 ADC and can be used to monitor up to 8 ADC channels, from any of the PMIC7 PMICs on a target, through PBS(Programmable Boot Sequence). Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | dt-bindings: thermal: rzg2l-thermal: Document RZ/V2L bindingsLad Prabhakar2022-05-191-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one found on RZ/G2L SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | | Merge tag 'devicetree-fixes-for-5.18-3' of ↵Linus Torvalds2022-05-051-1/+0
|\ \ \ | | |/ | |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree fixes from Rob Herring: - Drop unused 'max-link-speed' in Apple PCIe - More redundant 'maxItems/minItems' schema fixes - Support values for pinctrl 'drive-push-pull' and 'drive-open-drain' - Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding - Add missing 'power-domains' property to Cadence UFSHC * tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: dt-bindings: pci: apple,pcie: Drop max-link-speed from example dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties' dt-bindings: ufs: cdns,ufshc: Add power-domains
| * | dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemasRob Herring2022-05-041-1/+0
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Another round of removing redundant minItems/maxItems when 'items' list is specified. This time it is in if/then schemas as the meta-schema was failing to check this case. If a property has an 'items' list, then a 'minItems' or 'maxItems' with the same size as the list is redundant and can be dropped. Note that is DT schema specific behavior and not standard json-schema behavior. The tooling will fixup the final schema adding any unspecified minItems/maxItems. Signed-off-by: Rob Herring <robh@kernel.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Marc Kleine-Budde <mkl@pengutronix.de> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for IIO Link: https://lore.kernel.org/r/20220503162738.3827041-1-robh@kernel.org
* / dt-bindings: update Krzysztof Kozlowski's emailKrzysztof Kozlowski2022-04-041-1/+1
|/ | | | | | | | | | Krzysztof Kozlowski's @canonical.com email stopped working, so switch to generic @kernel.org account for all Devicetree bindings. Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Acked-by: Arnd Bergmann <arnd@arndb.de> Link: https://lore.kernel.org/r/20220330074016.12896-2-krzysztof.kozlowski@linaro.org
* Merge tag 'devicetree-for-5.18' of ↵Linus Torvalds2022-03-262-7/+7
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: - Add Krzysztof Kozlowski as co-maintainer for DT bindings providing much needed help. - DT schema validation now takes DTB files as input rather than intermediate YAML files. This decouples the validation from the source level syntax information. There's a bunch of schema fixes as a result of switching to DTB based validation which exposed some errors and incomplete schemas and examples. - Kbuild improvements to explicitly warn users running 'make dt_binding_check' on missing yamllint - Expand DT_SCHEMA_FILES kbuild variable to take just a partial filename or path instead of the full path to 1 file. - Convert various bindings to schema format: mscc,vsc7514-switch, multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma, msm/mdp4, rda,8810pl-uart - New schemas for u-boot environment variable partition, TI clksel - New compatible strings for Renesas RZ/V2L SoC - Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated HiSilicon - Add/fix schemas for QEMU Arm 'virt' machine - Drop unused of_alias_get_alias_list() function - Add a script to check DT unittest EXPECT message output. Pass messages also now print by default at PR_INFO level to help test automation. * tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (96 commits) dt-bindings: kbuild: Make DT_SCHEMA_LINT a recursive variable dt-bindings: nvmem: add U-Boot environment variables binding dt-bindings: ufs: qcom: Add SM6350 compatible string dt-bindings: dmaengine: sifive,fu540-c000: include generic schema dt-bindings: gpio: pca95xx: drop useless consumer example Revert "of: base: Introduce of_alias_get_alias_list() to check alias IDs" dt-bindings: virtio,mmio: Allow setting devices 'dma-coherent' dt-bindings: gnss: Add two more chips dt-bindings: gnss: Rewrite sirfstar binding in YAML dt-bindings: gnss: Modify u-blox to use common bindings dt-bindings: gnss: Rewrite common bindings in YAML dt-bindings: ata: ahci-platform: Add rk3568-dwc-ahci compatible dt-bindings: ata: ahci-platform: Add power-domains property dt-bindings: ata: ahci-platform: Convert DT bindings to yaml dt-bindings: kbuild: Use DTB files for validation dt-bindings: kbuild: Pass DT_SCHEMA_FILES to dt-validate dt-bindings: Add QEMU virt machine compatible dt-bindings: arm: Convert QEMU fw-cfg to DT schema dt-bindings: i2c: at91: Add SAMA7G5 compatible strings list dt-bindings: i2c: convert i2c-at91 to json-schema ...
| * dt-bindings: Improve phandle-array schemasRob Herring2022-02-042-7/+7
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The 'phandle-array' type is a bit ambiguous. It can be either just an array of phandles or an array of phandles plus args. Many schemas for phandle-array properties aren't clear in the schema which case applies though the description usually describes it. The array of phandles case boils down to needing: items: maxItems: 1 The phandle plus args cases should typically take this form: items: - items: - description: A phandle - description: 1st arg cell - description: 2nd arg cell With this change, some examples need updating so that the bracketing of property values matches the schema. Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Acked-by: Vinod Koul <vkoul@kernel.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Acked-by: Stephen Boyd <sboyd@kernel.org> Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Acked-by: Marc Kleine-Budde <mkl@pengutronix.de> Link: https://lore.kernel.org/r/20220119015038.2433585-1-robh@kernel.org
* | dt-bindings: thermal: tsens: Add msm8953 compatibleLuca Weiss2022-03-081-0/+1
| | | | | | | | | | | | | | | | | | | | | | Document the compatible string for tsens found in msm8953. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org> Acked-by: Amit Kucheria <amitk@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | dt-bindings: thermal: Add sm8150 compatible string for LMhThara Gopinath2022-03-081-0/+1
| | | | | | | | | | | | | | | | | | | | | | Extend the LMh dt binding document to include compatible string supporting sm8150 SoC. Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220106173138.411097-4-thara.gopinath@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* | dt-bindings: thermal: samsung: Convert to dtschemaKrzysztof Kozlowski2022-03-082-106/+184
|/ | | | | | | | | | Convert the Samsung Exynos SoC Thermal Management Unit bindings to DT schema format. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220122132554.65192-2-krzysztof.kozlowski@canonical.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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