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*---. Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git ↵Zhang Rui2014-01-021-1/+22
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| | | * Thermal: ACPI INT3403 thermal driverSrinivas Pandruvada2014-01-021-0/+7
| |_|/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | The ACPI INT3403 device objects present on some systems can be used to retrieve temperature data from thermal sensors. Add a driver registering each INT3403 device object as a thermal zone device and exposing its _TMP, PATx and GTSH method via the standard thermal control interface under /sys/class/thermal/. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * thermal: cpu_cooling: introduce of_cpufreq_cooling_registerEduardo Valentin2013-12-041-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
| | * thermal: introduce device tree parserEduardo Valentin2013-12-041-0/+13
| |/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * thermal: rcar-thermal: Enable driver compilation with COMPILE_TESTLaurent Pinchart2014-01-021-1/+1
|/ | | | | | | | | | | | This helps increasing build testing coverage. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Acked-by: Simon Horman <horms@verge.net.au> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branch 'next' of ↵Linus Torvalds2013-11-141-3/+4
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "This time we only have a few changes as there are no soc thermal changes from Eduardo. The only big change is the introduction of TMON, a tool to help visualize, tune, and test the thermal subsystem. The rest is mostly cleanups and fixes all over. Specifics: - introduce TMON, a tool base on thermal sysfs I/F. It can be used to visualize, tune and test the thermal subsystem. - fix a zone/cooling device binding problem, when both thermal zone bind parameters and .bind() callback are available" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: tools/thermal: Introduce tmon, a tool for thermal subsystem thermal: Fix binding problem when there is thermal zone params thermal: cpu_cooling: fix return value check in cpufreq_cooling_register() Thermal: Check for validity before doing kfree thermal/intel_powerclamp: Add newer CPU models Thermal: Tidy up error handling in powerclamp_init thermal: Kconfig: cosmetic fixes ACPI/thermal : Remove zone disabled warning typo in drivers/thermal/Kconfig: lpatform instead of platform
| * thermal: Kconfig: cosmetic fixesLuka Perkov2013-10-091-2/+3
| | | | | | | | | | | | | | | | | | Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * typo in drivers/thermal/Kconfig: lpatform instead of platformRegid Ichira2013-09-251-1/+1
| | | | | | | | | | | | | | | | Applied to the HEAD of linux.git, VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0 Signed-off-by: Regid Ichira <regid23@nt1.in> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | cpufreq: remove CONFIG_CPU_FREQ_TABLEViresh Kumar2013-10-161-1/+0
|/ | | | | | | | | CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as cpufreq core depends on it. So, we don't need this CONFIG option anymore as it is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: hwmon: move hwmon support to single fileEduardo Valentin2013-09-031-0/+9
| | | | | | | | | | | | | | | | | | In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
*-. Merge branches 'exynos', 'imx' and 'fixes' of .git into nextZhang Rui2013-08-151-0/+11
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| * | thermal: add imx thermal driver supportShawn Guo2013-08-131-0/+11
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* / thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap2013-08-131-8/+5
|/ | | | | | | | | | | | This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge branch 'cpu-package-thermal' of .git into nextZhang Rui2013-06-181-2/+1
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| * thermal: fix x86_pkg_temp_thermal.c build and KconfigRandy Dunlap2013-06-181-2/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Fix build error in x86_pkg_temp_thermal.c. It requires that X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol, since it depends on X86_MCE (indirectly). Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block, so remove that duplicated dependency. ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Acked-by: Borislav Petkov <bp@suse.de> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Merge branch 'cpu-package-thermal' of .git into nextZhang Rui2013-06-181-0/+13
|\| | | | | | | | | | | Conflicts: drivers/thermal/Kconfig drivers/thermal/Makefile
| * Thermal: CPU Package temperature thermalSrinivas Pandruvada2013-06-181-0/+12
| | | | | | | | | | | | | | | | | | | | | | | | | | This driver register CPU digital temperature sensor as a thermal zone at package level. Each package will show up as one zone with at max two trip points. These trip points can be both read and updated. Once a non zero value is set in the trip point, if the package package temperature goes above or below this setting, a thermal notification is generated. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: introduce TI SoC thermal driverEduardo Valentin2013-05-281-0/+3
|/ | | | | | | | | | | | | | | | | | | | | | This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: cpu_cooling: update Kconfig entryEduardo Valentin2013-04-251-2/+3
| | | | | | | | | There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: build cpu_cooling code into thermal_sys moduleZhang Rui2013-04-141-1/+1
| | | | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
* thermal: add a warning for temperature emulation featureEduardo Valentin2013-04-021-0/+4
| | | | | | | | | | Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: exynos: Adapt to temperature emulation core thermal frameworkAmit Daniel Kachhap2013-04-021-9/+0
| | | | | | | | | | | | | | | | | This removes the driver specific sysfs support of the temperature emulation and uses the newly added core thermal framework for thermal emulation. An exynos platform specific handler is added to support this. In this patch, the exynos senor(tmu) related code and exynos framework related (thermal zone, cooling devices) code are intentionally kept separate. So an emulated function pointer is passed from sensor to framework. This is beneficial in adding more sensor support using the same framework code which is an ongoing work. The goal is to finally split them totally. Even the existing read_temperature also follows the same execution method. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add driver for Armada 370/XP SoC thermal managementEzequiel Garcia2013-04-021-0/+8
| | | | | | | | | | | | | | | | | | | This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: rename thermal governor Kconfig option to avoid generic namingZhang Rui2013-02-081-6/+6
| | | | | | | | | | | | Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Dove: Add Themal sensor support for Dove.Andrew Lunn2013-02-081-0/+8
| | | | | | | | | The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add support for the thermal sensor on Kirkwood SoCsNobuhiro Iwamatsu2013-02-081-0/+8
| | | | | | | | This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: sysfs: Add a new sysfs node emul_temp for thermal emulationAmit Daniel Kachhap2013-02-061-0/+8
| | | | | | | | | | | | | | | | This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* PM: Introduce Intel PowerClamp DriverJacob Pan2013-02-061-0/+10
| | | | | | | | | | | | | | | | Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: exynos: Add sysfs node supporting exynos's emulation mode.Jonghwa Lee2013-01-041-0/+9
| | | | | | | | | | | | This patch supports exynos's emulation mode with newly created sysfs node. Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit. Thermal emulation mode supports software debug for TMU's operation. User can set temperature manually with software code and TMU will read current temperature from user value not from sensor's value. This patch includes also documentary placed under Documentation/thermal/. Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branch 'for-linus' of ↵Linus Torvalds2012-12-131-1/+1
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial Pull trivial branch from Jiri Kosina: "Usual stuff -- comment/printk typo fixes, documentation updates, dead code elimination." * 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits) HOWTO: fix double words typo x86 mtrr: fix comment typo in mtrr_bp_init propagate name change to comments in kernel source doc: Update the name of profiling based on sysfs treewide: Fix typos in various drivers treewide: Fix typos in various Kconfig wireless: mwifiex: Fix typo in wireless/mwifiex driver messages: i2o: Fix typo in messages/i2o scripts/kernel-doc: check that non-void fcts describe their return value Kernel-doc: Convention: Use a "Return" section to describe return values radeon: Fix typo and copy/paste error in comments doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c various: Fix spelling of "asynchronous" in comments. Fix misspellings of "whether" in comments. eisa: Fix spelling of "asynchronous". various: Fix spelling of "registered" in comments. doc: fix quite a few typos within Documentation target: iscsi: fix comment typos in target/iscsi drivers treewide: fix typo of "suport" in various comments and Kconfig treewide: fix typo of "suppport" in various comments ...
| * treewide: Fix typos in various KconfigMasanari Iida2012-12-031-1/+1
| | | | | | | | | | | | | | Correct spelling typo within various Kconfig. Signed-off-by: Masanari Iida <standby24x7@gmail.com> Signed-off-by: Jiri Kosina <jkosina@suse.cz>
* | thermal: cpu cooling: allow module buildsEduardo Valentin2012-11-221-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | As thermal drivers can be built as modules and also the thermal framework itself, building cpu cooling only as built-in can cause linking errors. For instance: * Generic Thermal sysfs driver * Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y with the following drive: CONFIG_OMAP_BANDGAP=m generates: ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! This patch changes cpu cooling driver to allow it to be built as module. Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang2012-11-151-0/+20
| | | | | | | | | | | | | | | | | | | | | | | | | | | | This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Exynos: Add missing dependencyZhang Rui2012-11-151-1/+1
| | | | | | | | | | | | | | | | | | | | | | CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking for dependencies gives the following compilation warnings: warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 && CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ) Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Refactor drivers/thermal/KconfigZhang Rui2012-11-151-52/+51
| | | | | | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: Provide option to choose default thermal governorDurgadoss R2012-11-051-0/+31
| | | | | | | | | | | | | | | | | | This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: Add a thermal notifier for user spaceDurgadoss R2012-11-051-0/+6
| | | | | | | | | | | | | | | | | | | | This patch registers a governor which will let the user land manage the platform thermals. Whenever a trip happens, this governor just notifies the user space using kobj_uevent(). Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: Introduce a step_wise thermal governorDurgadoss R2012-11-051-0/+6
| | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch adds a simple step_wise governor to the generic thermal layer. This algorithm throttles the cooling devices in a linear fashion. If the 'trend' is heating, it throttles by one step. And if the thermal trend is cooling it de-throttles by one step. This actually moves the throttling logic from thermal_sys.c and puts inside step_wise.c, without any change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: Introduce fair_share thermal governorDurgadoss R2012-11-051-0/+6
|/ | | | | | | | | | | | | | | This patch introduces a simple 'weight' based governor named fair_share governor. Whenever the thermal framework gets notified of the trip point violation, this governor (if configured), throttles the cooling devices associated with a thermal zone. This mapping between a thermal zone and a cooling device and the effectiveness of cooling are provided in the platform layer. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configuredDavid Rientjes2012-10-151-0/+2
| | | | | | | | | | | | | | | | | | | | Commit 023614183768 ("thermal: add generic cpufreq cooling implementation") requires cpufreq_frequency_get_table(), but that function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the following build error: drivers/built-in.o: In function `cpufreq_get_max_state': drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table' drivers/built-in.o: In function `get_cpu_frequency': drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table' Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration. It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so select it there as well. Signed-off-by: David Rientjes <rientjes@google.com> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* thermal: exynos5: add exynos5250 thermal sensor driver supportAmit Daniel Kachhap2012-09-241-1/+1
| | | | | | | | | | | | | | | | | | Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4 changes are made generic for exynos series. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: SangWook Ju <sw.ju@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap2012-09-241-0/+7
| | | | | | | | | | | | | | | | | | | This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap2012-09-241-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto2012-09-241-0/+8
| | | | | | | | | | | | | | This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* drivers/thermal/spear_thermal.c: add Device Tree probing capabilityViresh Kumar2012-06-021-0/+1
| | | | | | | | | | | | | | | | SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: add support for thermal sensor present on SPEAr13xx machinesVincenzo Frascino2012-03-221-0/+8
| | | | | | | | | | | | | | | | | ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: hide CONFIG_THERMAL_HWMONJean Delvare2011-08-021-6/+2
| | | | | | | | | | | | | | | It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* ACPI: Fix build for CONFIG_NET unsetRafael J. Wysocki2011-02-281-1/+0
| | | | | | | | | | | | | | | | | | | | | Several ACPI drivers fail to build if CONFIG_NET is unset, because they refer to things depending on CONFIG_THERMAL that in turn depends on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend on CONFIG_NET, because the only part of it requiring CONFIG_NET is the netlink interface in thermal_sys.c. Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET and remove the dependency of CONFIG_THERMAL on CONFIG_NET from drivers/thermal/Kconfig. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: Randy Dunlap <randy.dunlap@oracle.com> Cc: Ingo Molnar <mingo@elte.hu> Cc: Len Brown <lenb@kernel.org> Cc: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Luming Yu <luming.yu@intel.com> Cc: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* thermal: Add event notification to thermal frameworkR.Durgadoss2011-01-121-0/+1
| | | | | | | | | This patch adds event notification support to the generic thermal sysfs framework in the kernel. The notification is in the form of a netlink event. Signed-off-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: add missing Kconfig dependencyJan Beulich2009-09-191-0/+1
| | | | | | | | | | | Otherwise THERMAL_HWMON can be selected when HWMON=n and THERMAL=n, which fails to build. Signed-off-by: Jan Beulich <jbeulich@novell.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Matthew Garrett <mjg@redhat.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
generated by cgit v1.2.3 (git 2.25.1) at 2024-11-06 07:31:55 +0000