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* thermal/drivers/mediatek: Relocate driver to mediatek folderBalsam CHIHI2023-02-151-10/+4
| | | | | | | | | | | | Add MediaTek proprietary folder to upstream more thermal zone and cooler drivers, relocate the original thermal controller driver to it, and rename it as "auxadc_thermal.c" to show its purpose more clearly. Signed-off-by: Balsam CHIHI <bchihi@baylibre.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: ACPI: Add ACPI trip point routinesRafael J. Wysocki2023-01-241-0/+4
| | | | | | | | | | | Add library routines to populate a generic thermal trip point structure with data obtained by evaluating a specific object in the ACPI Namespace. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* thermal: Drop obsolete dependency on COMPILE_TESTJean Delvare2022-08-031-2/+2
| | | | | | | | | | | | | | | | | | Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it is possible to test-build any driver which depends on OF on any architecture by explicitly selecting OF. Therefore depending on COMPILE_TEST as an alternative is no longer needed. It is actually better to always build such drivers with OF enabled, so that the test builds are closer to how each driver will actually be built on its intended target. Building them without OF may not test much as the compiler will optimize out potentially large parts of the code. In the worst case, this could even pop false positive warnings. Dropping COMPILE_TEST here improves the quality of our testing and avoids wasting time on non-existent issues. Signed-off-by: Jean Delvare <jdelvare@suse.de> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/governor: Remove deprecated informationDaniel Lezcano2022-04-221-2/+4
| | | | | | | | | | | | | | | The userspace governor is still in use on production systems and the deprecating warning is scary. Even if we want to get rid of the userspace governor, it is too soon yet as the alternatives are not yet adopted. Change the deprecated warning by an information message suggesting to switch to the netlink thermal events. Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated") Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal/drivers: Add TSU driver for RZ/G2LBiju Das2021-11-301-0/+9
| | | | | | | | | | | | | | | | | | | The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the temperature inside the LSI. The thermal sensor in this unit measures temperatures in the range from −40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The TSU repeats measurement at 20 microseconds intervals and automatically updates the results of measurement. The TSU has no interrupts as well as no external pins. This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
* thermal/drivers/zx: Remove zx driverArnd Bergmann2021-02-031-8/+0
| | | | | | | | | | | The zte zx platform is getting removed, so this driver is no longer needed. Cc: Jun Nie <jun.nie@linaro.org> Cc: Shawn Guo <shawnguo@kernel.org> Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
* thermal/drivers/tango: Remove tango driverArnd Bergmann2021-02-031-9/+0
| | | | | | | | | | | | The tango platform is getting removed, so the driver is no longer needed. Cc: Marc Gonzalez <marc.w.gonzalez@free.fr> Cc: Mans Rullgard <mans@mansr.com> Signed-off-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Mans Rullgard <mans@mansr.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
* thermal: Kconfig: Update description for RCAR_GEN3_THERMAL configLad Prabhakar2020-10-121-3/+3
| | | | | | | | | | | The rcar_gen3_thermal driver also supports RZ/G2 SoC's, update the description to reflect this. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200917152141.30070-1-prabhakar.mahadev-lad.rj@bp.renesas.com
* Merge tag 'mfd-next-5.9-1' of ↵Linus Torvalds2020-08-151-0/+11
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd Pull MFD updates from Lee Jones: "Core Frameworks - Make better attempt at matching device with the correct OF node - Allow batch removal of hierarchical sub-devices New Drivers - Add STM32 Clocksource driver - Add support for Khadas System Control Microcontroller Driver Removal - Remove unused driver for TI's SMSC ECE1099 New Device Support - Add support for Intel Emmitsburg PCH to Intel LPSS PCI - Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI - Add support for Dialog DA revision to Dialog DA9063 New Functionality - Add support for AXP803 to be probed by I2C Fix-ups - Numerous W=1 warning fixes - Device Tree changes (stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller) - Enabled Regmap 'fast I/O' in stm32-lptimer - Change BUG_ON to WARN_ON in arizona-core - Remove superfluous code/initialisation (madera, max14577) - Trivial formatting/spelling issues (madera-core, madera-i2c, da9055, max77693-private) - Switch to of_platform_populate() in sprd-sc27xx-spi - Expand out set/get brightness/pwm macros in lm3533-ctrlbank - Disable IRQs on suspend in motorola-cpcap - Clean-up error handling in intel_soc_pmic_mrfld - Ensure correct removal order of sub-devices in madera - Many s/HTTP/HTTPS/ link changes - Ensure name used with Regmap is unique in syscon Bug Fixes - Properly 'put' clock on unbind and error in arizona-core - Fix revision handling in da9063 - Fix 'assignment of read-only location' error in kempld-core - Avoid using the Regmap API when atomic in rn5t618 - Redefine volatile register description in rn5t618 - Use locking to protect event handler in dln2" * tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (76 commits) mfd: syscon: Use a unique name with regmap_config mfd: Replace HTTP links with HTTPS ones mfd: dln2: Run event handler loop under spinlock mfd: madera: Improve handling of regulator unbinding mfd: mfd-core: Add mechanism for removal of a subset of children mfd: intel_soc_pmic_mrfld: Simplify the return expression of intel_scu_ipc_dev_iowrite8() mfd: max14577: Remove redundant initialization of variable current_bits mfd: rn5t618: Fix caching of battery related registers mfd: max77693-private: Drop a duplicated word mfd: da9055: pdata.h: Drop a duplicated word mfd: rn5t618: Make restart handler atomic safe mfd: kempld-core: Fix 'assignment of read-only location' error mfd: axp20x: Allow the AXP803 to be probed by I2C mfd: da9063: Add support for latest DA silicon revision mfd: da9063: Fix revision handling to correctly select reg tables dt-bindings: mfd: st,stmfx: Remove I2C unit name dt-bindings: mfd: ti,j721e-system-controller.yaml: Add J721e system controller mfd: motorola-cpcap: Disable interrupt for suspend mfd: smsc-ece1099: Remove driver mfd: core: Add OF_MFD_CELL_REG() helper ...
| * thermal: Add support for the MCU controlled FAN on Khadas boardsNeil Armstrong2020-06-251-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | The new Khadas VIM2 and VIM3 boards controls the cooling fan via the on-board microcontroller. This implements the FAN control as thermal devices and as cell of the Khadas MCU MFD driver. Signed-off-by: Neil Armstrong <narmstrong@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Lee Jones <lee.jones@linaro.org>
* | thermal: don't make THERMAL_NETLINK 'default y'Linus Torvalds2020-08-071-1/+0
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | We just don't do that. "default y" is for things that are needed for compatibility (when an old feature is made unconditional), or for things that are basically part of the infrastructure of a platform. And it can possibly be used for questions that don't enable code on their own, but are used to enable or disable a whole slew of other questions. A new feature that people aren't using is never 'default y', unless it cures cancer or ends world hunger. Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* | thermal/drivers/clock_cooling: Remove clock_cooling codeAmit Kucheria2020-07-211-10/+0
| | | | | | | | | | | | | | | | | | | | | | clock_cooling has no in-kernel users. It has never found any use in drivers as far as I can tell. Remove the code. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/aa5d5ac2589cf7b14ece882130731b4a916849a6.1593619943.git.amit.kucheria@linaro.org
* | thermal: netlink: Fix compilation error when CONFIG_NET=nDaniel Lezcano2020-07-211-0/+10
|/ | | | | | | | | | | | | | | | | | | When the network is not configured, the netlink is disabled on all the system. The thermal framework assumed the netlink is always opt-in. Fix this by adding a Kconfig option for the netlink notification, defaulting to yes and depending on CONFIG_NET. As the change implies multiple stubs and in order to not pollute the internal thermal header, the thermal_nelink.h has been added and included in the thermal_core.h, so this one regain some kind of clarity. Reported-by: Randy Dunlap <rdunlap@infradead.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
* thermal: qoriq: Add platform dependenciesGeert Uytterhoeven2020-05-221-2/+2
| | | | | | | | | | | | | | The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies to the QORIQ_THERMAL config symbol, to avoid asking the user about it when configuring a kernel without support for any of the aforementioned SoCs. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Li Yang <leoyang.li@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be
* thermal: k3: Add support for bandgap sensorsKeerthy2020-04-141-0/+10
| | | | | | | | | | | | | | | | | | Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
* thermal: Add COMPILE_TEST support for i.MX8MMAnson Huang2020-03-121-1/+1
| | | | | | | | | | Add COMPILE_TEST support to i.MX8MM thermal driver for better compile testing coverage. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583509057-8197-1-git-send-email-Anson.Huang@nxp.com
* thermal: qoriq: Fix a compiling issueYuantian Tang2020-03-121-0/+1
| | | | | | | | | | | | Qoriq thermal driver is used by both PowerPC and ARM architecture. When built for PowerPC architecture, it reports error: undefined reference to `.__devm_regmap_init_mmio_clk' To fix it, select config REGMAP_MMIO. Fixes: 4316237bd627 (thermal: qoriq: Convert driver to use regmap API) Signed-off-by: Yuantian Tang <andy.tang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200303084641.35687-1-andy.tang@nxp.com
* thermal: Remove COMPILE_TEST for IMX_SC_THERMALAnson Huang2020-03-121-1/+1
| | | | | | | | | | | i.MX SCU thermal driver depends on IMX_SCU which does NOT have COMPILE_TEST enabled, so need to remove COMPILE_TEST for i.MX SCU thermal as well. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reported-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583222684-10229-2-git-send-email-Anson.Huang@nxp.com
* thermal: Rephrase the Kconfig text for thermalLinus Walleij2020-03-121-6/+7
| | | | | | | | | | | | | | | | | | | The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
* thermal: imx8mm: Add support for i.MX8MM thermal monitoring unitAnson Huang2020-03-121-0/+10
| | | | | | | | | | i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one sensor for CPU, add support for reading immediate temperature of this sensor. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
* thermal: imx_sc: add i.MX system controller thermal supportAnson Huang2020-03-121-0/+11
| | | | | | | | | | | | | | | | i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
* thermal: sprd: Add Spreadtrum thermal driver supportFreeman Liu2020-03-121-0/+7
| | | | | | | | | | | This patch adds the support for Spreadtrum thermal sensor controller, which can support maximum 8 sensors. Signed-off-by: Freeman Liu <freeman.liu@unisoc.com> Co-developed-with: Baolin Wang <baolin.wang@unisoc.com> Signed-off-by: Baolin Wang <baolin.wang7@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
* thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40Yangtao Li2020-01-271-0/+14
| | | | | | | | | | | | | This patch adds the support for allwinner thermal sensor, within allwinner SoC. It will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Yangtao Li <tiny.windzz@gmail.com> Signed-off-by: Ondrej Jirman <megous@megous.com> Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
* thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driverDaniel Lezcano2020-01-271-0/+7
| | | | | | | | | | | | | | | | | | | | | | | | | | | | The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
* thermal/drivers/Kconfig: Convert the CPU cooling device to a choiceDaniel Lezcano2020-01-271-2/+12
| | | | | | | | | | | | | | | The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
* thermal: power_allocator: Fix Kconfig warningYueHaibing2019-12-071-1/+1
| | | | | | | | | | | | | | | | | | | | | | | When do randbuiding, we got this: WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n] Selected by [y]: - THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && <choice> The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL which is not enabled. Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR to fix this warning. Suggested-by: Quentin Perret <qperret@google.com> Fixes: a4e893e802e6 ("thermal: cpu_cooling: Migrate to using the EM framework") Signed-off-by: YueHaibing <yuehaibing@huawei.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com
* thermal: cpu_cooling: Migrate to using the EM frameworkQuentin Perret2019-11-071-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The newly introduced Energy Model framework manages power cost tables in a generic way. Moreover, it supports several types of models since the tables can come from DT or firmware (through SCMI) for example. On the other hand, the cpu_cooling subsystem manages its own power cost tables using only DT data. In order to avoid the duplication of data in the kernel, and in order to enable IPA with EMs coming from more than just DT, remove the private tables from cpu_cooling.c and migrate it to using the centralized EM framework. Doing so should have no visible functional impact for existing users of IPA since: - recent extenstions to the the PM_OPP infrastructure enable the registration of EMs in PM_EM using the DT property used by IPA; - the existing upstream cpufreq drivers marked with the 'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP infrastructure, which means they all support PM_EM. The only two exceptions are qoriq-cpufreq which doesn't in fact use an EM and scmi-cpufreq which doesn't use DT for power costs. For existing users of cpu_cooling, PM_EM tables will contain the exact same power values that IPA used to compute on its own until now. The only new dependency for them is to compile in CONFIG_ENERGY_MODEL. The case where the thermal subsystem is used without an Energy Model (cpufreq_cooling_ops) is handled by looking directly at CPUFreq's frequency table which is already a dependency for cpu_cooling.c anyway. Since the thermal framework expects the cooling states in a particular order, bail out whenever the CPUFreq table is unsorted, since that is fairly uncommon in general, and there are currently no users of cpu_cooling for this use-case. Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Quentin Perret <qperret@google.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com
* thermal: amlogic: Add thermal driver to support G12 SoCsGuillaume La Roque2019-11-071-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | Amlogic G12A and G12B SoCs integrate two thermal sensors with the same design. One is located close to the DDR controller and the other one is located close to the PLLs (between the CPU and GPU). The calibration data for each of the thermal sensors instance is stored in a different location within the AO region. Implement reading the temperature from each thermal sensor. The IP block has more functionality, which may be added to this driver in the future: - chip reset when the temperature exceeds a configurable threshold - up to four interrupts when the temperature has risen above a configurable threshold - up to four interrupts when the temperature has fallen below a configurable threshold Tested-by: Christian Hewitt <christianshewitt@gmail.com> Tested-by: Kevin Hilman <khilman@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Guillaume La Roque <glaroque@baylibre.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
* thermal: db8500: Finalize device tree conversionLinus Walleij2019-09-241-1/+1
| | | | | | | | | | | | | | | | | | | At some point there was an attempt to convert the DB8500 thermal sensor to device tree: a probe path was added and the device tree was augmented for the Snowball board. The switchover was never completed: instead the thermal devices came from from the PRCMU MFD device and the probe on the Snowball was confused as another set of configuration appeared from the device tree. Move over to a device-tree only approach, as we fixed up the device trees. Cc: Vincent Guittot <vincent.guittot@linaro.org> Acked-by: Lee Jones <lee.jones@linaro.org> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* treewide: Add SPDX license identifier - Makefile/KconfigThomas Gleixner2019-05-211-0/+1
| | | | | | | | | | | | | | Add SPDX license identifiers to all Make/Kconfig files which: - Have no license information of any form These files fall under the project license, GPL v2 only. The resulting SPDX license identifier is: GPL-2.0-only Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
* Merge branch 'next' of ↵Linus Torvalds2019-05-161-5/+3
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Remove the 'module' Kconfig option for thermal subsystem framework because the thermal framework are required to be ready as early as possible to avoid overheat at boot time (Daniel Lezcano) - Fix a bug that thermal framework pokes disabled thermal zones upon resume (Wei Wang) - A couple of cleanups and trivial fixes on int340x thermal drivers (Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: drivers: thermal: processor_thermal: Downgrade error message mlxsw: Remove obsolete dependency on THERMAL=m hwmon/drivers/core: Simplify complex dependency thermal/drivers/core: Fix typo in the option name thermal/drivers/core: Remove depends on THERMAL in Kconfig thermal/drivers/core: Remove module unload code thermal/drivers/core: Remove the module Kconfig's option thermal: core: skip update disabled thermal zones after suspend thermal: make device_register's type argument const thermal: intel: int340x: processor_thermal_device: simplify to get driver data thermal/int3403_thermal: favor _TMP instead of PTYP
| * thermal/drivers/core: Fix typo in the option nameDaniel Lezcano2019-05-061-1/+1
| | | | | | | | | | | | | | | | Unlike the other options, the cpu cooling option is beginning with a lowercase letter, changing to a uppercase. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal/drivers/core: Remove depends on THERMAL in KconfigDaniel Lezcano2019-05-061-2/+0
| | | | | | | | | | | | | | | | | | | | | | | | The dependency on the THERMAL option to be set is already there implicitly by the "if THERMAL" conditionnal option. The sub Kconfigs do not have to check against the THERMAL option as they are called from a Kconfig block which is enabled by the conditionnal option. Remove the useless "depends on THERMAL" in the Kconfigs. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal/drivers/core: Remove the module Kconfig's optionDaniel Lezcano2019-05-061-2/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The module support for the thermal subsystem makes little sense: - some subsystems relying on it are not modules, thus forcing the framework to be compiled in - it is compiled in for almost every configs, the remaining ones are a few platforms where I don't see why we can not switch the thermal to 'y'. The drivers can stay in tristate. - platforms need the thermal to be ready as soon as possible at boot time in order to mitigate Usually the subsystems framework are compiled-in and the plugs are as module. Remove the module option. The removal of the module related dead code will come after this patch gets in or is acked. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Guenter Roeck <groeck@chromium.org> For mini2440: Acked-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Paul Burton <paul.burton@mips.com> # MIPS part Acked-by: Robert Jarzmik <robert.jarzmik@free.fr> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: Fix build error of missing devm_ioremap_resource on UMTalel Shenhar2019-05-141-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/thermal/thermal_mmio.o: In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1): undefined reference to `devm_ioremap_resource' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Reported-by: kbuild test robot <lkp@intel.com> Signed-off-by: Talel Shenhar <talel@amazon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: Introduce Amazon's Annapurna Labs Thermal DriverTalel Shenhar2019-05-141-0/+10
|/ | | | | | | | | | | | | This is a generic thermal driver for simple MMIO sensors, of which amazon,al-thermal is one. This device uses a single MMIO transaction to read the temperature and report it to the thermal subsystem. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'linus' of ↵Linus Torvalds2019-03-081-1/+2
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal soc updates from Eduardo Valentin: "Specifics: - mediatek thermal now supports MT8183 - broadcom thermal now supports Stingray - qoirq now supports multiple sensors - fixes on different drivers: rcar, tsens, tegra Some new drivers are still pending further review and I chose to leave them for the next merge window while still sending this material" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: thermal: rcar_gen3_thermal: Register hwmon sysfs interface thermal/qcom/tsens-common : fix possible object reference leak thermal: tegra: add get_trend ops thermal: tegra: fix memory allocation thermal: tegra: remove unnecessary warnings thermal: mediatek: add support for MT8183 dt-bindings: thermal: add binding document for mt8183 thermal controller thermal: mediatek: add flag for bank selection thermal: mediatek: add thermal controller offset thermal: mediatek: add calibration item thermal: mediatek: add common index of vts settings. thermal: mediatek: fix register index error thermal: qoriq: add multiple sensors support thermal: broadcom: Add Stingray thermal driver dt-bindings: thermal: Add binding document for SR thermal
| * thermal: broadcom: Add Stingray thermal driverPramod Kumar2019-02-051-1/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Stingray SoC has six temperature sensor and those are configured, controlled and accessed to read temperature and update in DDR memory using m0 firmware. All six sensors has been given 4 bytes of memory in DDR to write temperature in millivolts. This thermal driver read temperature values from DDR because no direct access to sensors. Like this all temparature sensors are monitored and trips at critical temperature. If driver can't handle thermal runaways because of any unknown reason, then firmware in m0 Processor will handle. Reviewed-by: Ray Jui <ray.jui@broadcom.com> Reviewed-by: Scott Branden <scott.branden@broadcom.com> Reviewed-by: Vikram Prakash <vikram.prakash@broadcom.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com> Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: cpu_cooling: Require thermal core to be compiled inAmit Kucheria2019-01-291-0/+1
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The CPU cooling driver (cpu_cooling.c) allows the platform's cpufreq driver to register as a cooling device and cool down the platform by throttling the CPU frequency. In order to be able to auto-register a cpufreq driver as a cooling device from the cpufreq core, we need access to code inside cpu_cooling.c which, in turn, accesses code inside thermal core. CPU_FREQ is a bool while THERMAL is tristate. In some configurations (e.g. allmodconfig), CONFIG_THERMAL ends up as a module while CONFIG_CPU_FREQ is compiled in. This leads to following error: drivers/cpufreq/cpufreq.o: In function `cpufreq_offline': cpufreq.c:(.text+0x407c): undefined reference to `cpufreq_cooling_unregister' drivers/cpufreq/cpufreq.o: In function `cpufreq_online': cpufreq.c:(.text+0x70c0): undefined reference to `of_cpufreq_cooling_register' Given that platforms using CPU_THERMAL usually want it compiled-in so it is available early in boot, make CPU_THERMAL depend on THERMAL being compiled-in instead of allowing it to be a module. As a result of this change, get rid of the ugly (!CPU_THERMAL || THERMAL) dependency in all cpufreq drivers using CPU_THERMAL. Suggested-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* Merge branch 'next' of ↵Linus Torvalds2019-01-051-89/+5
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Add locking for cooling device sysfs attribute in case the cooling device state is changed by userspace and thermal framework simultaneously. (Thara Gopinath) - Fix a problem that passive cooling is reset improperly after system suspend/resume. (Wei Wang) - Cleanup the driver/thermal/ directory by moving intel and qcom platform specific drivers to platform specific sub-directories. (Amit Kucheria) - Some trivial cleanups. (Lukasz Luba, Wolfram Sang) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: thermal/intel: fixup for Kconfig string parsing tightening up drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir drivers: thermal: Move various drivers for intel platforms into a subdir thermal: Fix locking in cooling device sysfs update cur_state Thermal: do not clear passive state during system sleep thermal: zx2967_thermal: simplify getting .driver_data thermal: st: st_thermal: simplify getting .driver_data thermal: spear_thermal: simplify getting .driver_data thermal: rockchip_thermal: simplify getting .driver_data thermal: int340x_thermal: int3400_thermal: simplify getting .driver_data thermal: remove unused function parameter
| * drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdirAmit Kucheria2018-12-071-11/+0
| | | | | | | | | | | | | | | | | | | | | | This cleans up the directory a bit allowing just one place to look for thermal related drivers for QCOM platforms instead of being scattered in the root directory and the qcom/ subdirectory. Compile-tested with ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * drivers: thermal: Move various drivers for intel platforms into a subdirAmit Kucheria2018-12-071-78/+5
| | | | | | | | | | | | | | | | | | | | This cleans up the directory a bit, now that we have several other platforms using platform-specific sub-directories. Compile-tested with ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Merge branch 'linus' of ↵Linus Torvalds2019-01-051-1/+1
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Eduardo Valentin: - Tegra DT binding documentation for Tegra194 - Armada now supports ap806 and cp110 - RCAR thermal now supports R8A774C0 and R8A77990 - Fixes on thermal_hwmon, IMX, generic-ADC, ST, RCAR, Broadcom, Uniphier, QCOM, Tegra, PowerClamp, and Armada thermal drivers. * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (22 commits) thermal: generic-adc: Fix adc to temp interpolation thermal: rcar_thermal: add R8A77990 support dt-bindings: thermal: rcar-thermal: add R8A77990 support thermal: rcar_thermal: add R8A774C0 support dt-bindings: thermal: rcar-thermal: add R8A774C0 support dt-bindings: cp110: document the thermal interrupt capabilities dt-bindings: ap806: document the thermal interrupt capabilities MAINTAINERS: thermal: add entry for Marvell MVEBU thermal driver thermal: armada: add overheat interrupt support thermal: st: fix Makefile typo thermal: uniphier: Convert to SPDX identifier thermal/intel_powerclamp: Change to use DEFINE_SHOW_ATTRIBUTE macro thermal: tegra: soctherm: Change to use DEFINE_SHOW_ATTRIBUTE macro dt-bindings: thermal: tegra-bpmp: Add Tegra194 support thermal: imx: save one condition block for normal case of nvmem initialization thermal: imx: fix for dependency on cpu-freq thermal: tsens: qcom: do not create duplicate regmap debugfs entries thermal: armada: Use PTR_ERR_OR_ZERO in armada_thermal_probe_legacy() dt-bindings: thermal: rcar-gen3-thermal: All variants use 3 interrupts thermal: broadcom: use devm_thermal_zone_of_sensor_register ...
| * | thermal: imx: fix for dependency on cpu-freqAnson Huang2019-01-021-1/+1
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | The thermal driver is a standalone driver for monitoring SoC temperature by enabling thermal sensor, so it can be enabled even when CONFIG_CPU_FREQ is NOT set. So remove the dependency with CPU_THERMAL. Introduce dummy function of legacy cooling register/unregister to make thermal driver probe successfully when CONFIG_CPU_FREQ is NOT set. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* / treewide: surround Kconfig file paths with double quotesMasahiro Yamada2018-12-221-1/+1
|/ | | | | | | | | | | | | | | | | | | The Kconfig lexer supports special characters such as '.' and '/' in the parameter context. In my understanding, the reason is just to support bare file paths in the source statement. I do not see a good reason to complicate Kconfig for the room of ambiguity. The majority of code already surrounds file paths with double quotes, and it makes sense since file paths are constant string literals. Make it treewide consistent now. Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com> Acked-by: Wolfram Sang <wsa@the-dreams.de> Acked-by: Geert Uytterhoeven <geert@linux-m68k.org> Acked-by: Ingo Molnar <mingo@kernel.org>
* Merge branch 'linus' of ↵Linus Torvalds2018-10-261-1/+1
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal Pull thermal SoC updates from Eduardo Valentin: "Several new things coming up. Specifics: - Rework of tsens and hisi thermal drivers - OF-thermal now allows sharing multiple cooling devices on maps - Added support for r8a7744 and R8A77970 on rcar thermal driver - Added support for r8a774a1 on rcar_gen3 thermal driver - New thermal driver stm32 - Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada, qcom-spmi, rcar, da9062/61" * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits) thermal: da9062/61: Prevent hardware access during system suspend thermal: rcar_thermal: Prevent doing work after unbind thermal: rcar_thermal: Prevent hardware access during system suspend thermal: rcar_gen3_thermal: add R8A77980 support dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings thermal: add stm32 thermal driver dt-bindings: stm32-thermal: add binding documentation thermal: rcar_thermal: add R8A77970 support dt-bindings: thermal: rcar-thermal: document R8A77970 bindings thermal: rcar_thermal: fix duplicate IRQ request dt-bindings: thermal: rcar: Add device tree support for r8a7744 thermal/drivers/hisi: Add the dual clusters sensors for hi3660 thermal/drivers/hisi: Add more sensors channel thermal/drivers/hisi: Remove pointless irq field thermal/drivers/hisi: Use platform_get_irq_byname thermal/drivers/hisi: Replace macro name with relevant sensor location thermal/drivers/hisi: Add multiple sensors support thermal/drivers/hisi: Prepare to support multiple sensors thermal/drivers/hisi: Factor out the probe functions thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer ...
| * thermal: add stm32 thermal driverDavid HERNANDEZ SANCHEZ2018-10-251-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for DTS thermal sensor that can be found on some STM32 platforms. This driver is based on OF and works in interrupt mode. It offers two temperature trip points: passive and critical. The first is intended for passive cooling notification while the second is used for over-temperature reset. Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq numberHans de Goede2018-07-261-1/+1
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The Intel SoC DTS uses a hardcoded GSI number, before this commit it was passing it to request_irq as if it were a linux irq number, but there is no 1:1 mapping so in essence it was requesting a random interrupt. Besides this causing the DTS driver to not actually get an interrupt if the thermal thresholds are exceeded this also is causing an interrupt conflict on some devices since the linux irq 86 which is being requested is already in use, leading to oopses like this: genirq: Flags mismatch irq 86. 00002001 (soc_dts) vs. 00000083 (volume_down) CPU: 0 PID: 601 Comm: systemd-udevd Tainted: G C OE 4.17.0-rc6+ #45 Hardware name: Insyde i86/Type2 - Board Product Name, BIOS CHUWI.D86JLBNR03 01/14/2015 Call Trace: dump_stack+0x5c/0x80 __setup_irq.cold.50+0x4e/0xac ? request_threaded_irq+0xad/0x160 request_threaded_irq+0xf5/0x160 ? 0xffffffffc0a93000 intel_soc_thermal_init+0x74/0x1000 [intel_soc_dts_thermal] This commit makes the intel_soc_dts_thermal.c code call acpi_register_gsi() to translate the hardcoded IO-APIC GSI number (86) to a linux irq, so that the dts code uses the right interrupt and we no longer get an oops about an irq conflict. Signed-off-by: Hans de Goede <hdegoede@redhat.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add cooling device's statistics in sysfsViresh Kumar2018-04-021-0/+7
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: armada: Update Kconfig and module descriptionMiquel Raynal2018-01-011-2/+2
| | | | | | | | | | | | | | Update Armada thermal driver Kconfig entry as well as the driver's MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported, eg. Armada 7K and Armada 8K. Use the generic term "Marvell EBU Armada SoCs" instead of listing all the supported SoCs everywhere (excepted in the Kconfig description, where it is useful to have a list). Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com> Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
generated by cgit v1.2.3 (git 2.25.1) at 2024-10-31 20:31:39 +0000