| Commit message (Collapse) | Author | Age | Files | Lines |
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The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Use "/*" comment for the file's initial comment since it is not
in kernel-doc format. This prevents a kernel-doc warning:
drivers/thermal/uniphier_thermal.c:26: warning: expecting prototype for uniphier_thermal.c(). Prototype was for PVTCTLEN() instead
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Cc: Masami Hiramatsu <mhiramat@kernel.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Link: https://lore.kernel.org/r/20230113064507.17224-1-rdunlap@infradead.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-12-daniel.lezcano@linaro.org
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The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-5-daniel.lezcano@linexp.org
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add basic support for UniPhier NX1 SoC. This includes a compatible string
and the same SoC-dependent data as LD20 SoC.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Link: https://lore.kernel.org/r/1634520891-16801-3-git-send-email-hayashi.kunihiko@socionext.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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This converts license boilerplate to SPDX identifier, and removes
unnecessary lines.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add support for UniPhier PXs3 SoC. It is equivalent to LD20.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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