| Commit message (Collapse) | Author | Age | Files | Lines |
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[ Upstream commit 07209fcf33542c1ff1e29df2dbdf8f29cdaacb10 ]
There is a particular situation when the cooling device is cpufreq and the heat
dissipation is not efficient enough where the temperature increases little by
little until reaching the critical threshold and leading to a SoC reset.
The behavior is reproducible on a hikey6220 with bad heat dissipation (eg.
stacked with other boards).
Running a simple C program doing while(1); for each CPU of the SoC makes the
temperature to reach the passive regulation trip point and ends up to the
maximum allowed temperature followed by a reset.
This issue has been also reported by running the libhugetlbfs test suite.
What is observed is a ping pong between two cpu frequencies, 1.2GHz and 900MHz
while the temperature continues to grow.
It appears the step wise governor calls get_target_state() the first time with
the throttle set to true and the trend to 'raising'. The code selects logically
the next state, so the cpu frequency decreases from 1.2GHz to 900MHz, so far so
good. The temperature decreases immediately but still stays greater than the
trip point, then get_target_state() is called again, this time with the
throttle set to true *and* the trend to 'dropping'. From there the algorithm
assumes we have to step down the state and the cpu frequency jumps back to
1.2GHz. But the temperature is still higher than the trip point, so
get_target_state() is called with throttle=1 and trend='raising' again, we jump
to 900MHz, then get_target_state() is called with throttle=1 and
trend='dropping', we jump to 1.2GHz, etc ... but the temperature does not
stabilizes and continues to increase.
[ 237.922654] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=1,throttle=1
[ 237.922678] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=1,throttle=1
[ 237.922690] thermal cooling_device0: cur_state=0
[ 237.922701] thermal cooling_device0: old_target=0, target=1
[ 238.026656] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=2,throttle=1
[ 238.026680] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=2,throttle=1
[ 238.026694] thermal cooling_device0: cur_state=1
[ 238.026707] thermal cooling_device0: old_target=1, target=0
[ 238.134647] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=1,throttle=1
[ 238.134667] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=1,throttle=1
[ 238.134679] thermal cooling_device0: cur_state=0
[ 238.134690] thermal cooling_device0: old_target=0, target=1
In this situation the temperature continues to increase while the trend is
oscillating between 'dropping' and 'raising'. We need to keep the current state
untouched if the throttle is set, so the temperature can decrease or a higher
state could be selected, thus preventing this oscillation.
Keeping the next_target untouched when 'throttle' is true at 'dropping' time
fixes the issue.
The following traces show the governor does not change the next state if
trend==2 (dropping) and throttle==1.
[ 2306.127987] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=1,throttle=1
[ 2306.128009] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=1,throttle=1
[ 2306.128021] thermal cooling_device0: cur_state=0
[ 2306.128031] thermal cooling_device0: old_target=0, target=1
[ 2306.231991] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=2,throttle=1
[ 2306.232016] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=2,throttle=1
[ 2306.232030] thermal cooling_device0: cur_state=1
[ 2306.232042] thermal cooling_device0: old_target=1, target=1
[ 2306.335982] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=0,throttle=1
[ 2306.336006] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=0,throttle=1
[ 2306.336021] thermal cooling_device0: cur_state=1
[ 2306.336034] thermal cooling_device0: old_target=1, target=1
[ 2306.439984] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=2,throttle=1
[ 2306.440008] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=2,throttle=0
[ 2306.440022] thermal cooling_device0: cur_state=1
[ 2306.440034] thermal cooling_device0: old_target=1, target=0
[ ... ]
After a while, if the temperature continues to increase, the next state becomes
2 which is 720MHz on the hikey. That results in the temperature stabilizing
around the trip point.
[ 2455.831982] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=1,throttle=1
[ 2455.832006] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=1,throttle=0
[ 2455.832019] thermal cooling_device0: cur_state=1
[ 2455.832032] thermal cooling_device0: old_target=1, target=1
[ 2455.935985] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=0,throttle=1
[ 2455.936013] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=0,throttle=0
[ 2455.936027] thermal cooling_device0: cur_state=1
[ 2455.936040] thermal cooling_device0: old_target=1, target=1
[ 2456.043984] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=0,throttle=1
[ 2456.044009] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=0,throttle=0
[ 2456.044023] thermal cooling_device0: cur_state=1
[ 2456.044036] thermal cooling_device0: old_target=1, target=1
[ 2456.148001] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=1,throttle=1
[ 2456.148028] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=1,throttle=1
[ 2456.148042] thermal cooling_device0: cur_state=1
[ 2456.148055] thermal cooling_device0: old_target=1, target=2
[ 2456.252009] thermal thermal_zone0: Trip0[type=1,temp=65000]:trend=2,throttle=1
[ 2456.252041] thermal thermal_zone0: Trip1[type=1,temp=75000]:trend=2,throttle=0
[ 2456.252058] thermal cooling_device0: cur_state=2
[ 2456.252075] thermal cooling_device0: old_target=2, target=1
IOW, this change is needed to keep the state for a cooling device if the
temperature trend is oscillating while the temperature increases slightly.
Without this change, the situation above leads to a catastrophic crash by a
hardware reset on hikey. This issue has been reported to happen on an OMAP
dra7xx also.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Keerthy <j-keerthy@ti.com>
Cc: John Stultz <john.stultz@linaro.org>
Cc: Leo Yan <leo.yan@linaro.org>
Tested-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Sasha Levin <alexander.levin@verizon.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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[ Upstream commit f37fabb8643eaf8e3b613333a72f683770c85eca ]
In the critical sysfs entry the thermal hwmon was returning wrong
temperature to the user-space. It was reporting the temperature of the
first trip point instead of the temperature of critical trip point.
For example:
/sys/class/hwmon/hwmon0/temp1_crit:50000
/sys/class/thermal/thermal_zone0/trip_point_0_temp:50000
/sys/class/thermal/thermal_zone0/trip_point_0_type:active
/sys/class/thermal/thermal_zone0/trip_point_3_temp:120000
/sys/class/thermal/thermal_zone0/trip_point_3_type:critical
Since commit e68b16abd91d ("thermal: add hwmon sysfs I/F") the driver
have been registering a sysfs entry if get_crit_temp() callback was
provided. However when accessed, it was calling get_trip_temp() instead
of the get_crit_temp().
Fixes: e68b16abd91d ("thermal: add hwmon sysfs I/F")
Cc: <stable@vger.kernel.org>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Sasha Levin <alexander.levin@verizon.com>
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Backport of 81ad4276b505e987dd8ebbdf63605f92cd172b52 failed to adjust
for intervening ->get_trip_temp() argument type change, thus causing
stack protector to panic.
drivers/thermal/thermal_core.c: In function ‘thermal_zone_device_register’:
drivers/thermal/thermal_core.c:1569:41: warning: passing argument 3 of
‘tz->ops->get_trip_temp’ from incompatible pointer type [-Wincompatible-pointer-types]
if (tz->ops->get_trip_temp(tz, count, &trip_temp))
^
drivers/thermal/thermal_core.c:1569:41: note: expected ‘long unsigned int *’
but argument is of type ‘int *’
CC: <stable@vger.kernel.org> #3.18,#4.1
Signed-off-by: Mike Galbraith <umgwanakikbuti@gmail.com>
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[ Upstream commit 81ad4276b505e987dd8ebbdf63605f92cd172b52 ]
In some cases, platform thermal driver may report invalid trip points,
thermal core should not take any action for these trip points.
This fixed a regression that bogus trip point starts to screw up thermal
control on some Lenovo laptops, after
commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461
Author: Zhang Rui <rui.zhang@intel.com>
Date: Fri Oct 30 16:31:47 2015 +0800
Thermal: initialize thermal zone device correctly
After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
CC: <stable@vger.kernel.org> #3.18+
Link: https://bugzilla.redhat.com/show_bug.cgi?id=1317190
Link: https://bugzilla.kernel.org/show_bug.cgi?id=114551
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Sasha Levin <sasha.levin@oracle.com>
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[ Upstream commit 4511f7166a2deb5f7a578cf87fd2fe1ae83527e3 ]
When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.
This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.
Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/
CC: <stable@vger.kernel.org> #3.18+
Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
Signed-off-by: Sasha Levin <sasha.levin@oracle.com>
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[ Upstream commit ff140fea847e1c2002a220571ab106c2456ed252 ]
Current thermal code does not handle system sleep well because
1. the cooling device cooling state may be changed during suspend
2. the previous temperature reading becomes invalid after resumed because
it is got before system sleep
3. updating thermal zone device during suspending/resuming
is wrong because some devices may have already been suspended
or may have not been resumed.
Thus, the proper way to do this is to cancel all thermal zone
device update requirements during suspend/resume, and after all
the devices have been resumed, reset and update every registered
thermal zone devices.
This also fixes a regression introduced by:
Commit 19593a1fb1f6 ("ACPI / fan: convert to platform driver")
Because, with above commit applied, all the fan devices are attached
to the acpi_general_pm_domain, and they are turned on by the pm_domain
automatically after resume, without the awareness of thermal core.
CC: <stable@vger.kernel.org> #3.18+
Reference: https://bugzilla.kernel.org/show_bug.cgi?id=78201
Reference: https://bugzilla.kernel.org/show_bug.cgi?id=91411
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
Signed-off-by: Sasha Levin <sasha.levin@oracle.com>
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[ Upstream commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461 ]
After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
CC: <stable@vger.kernel.org> #3.18+
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
Signed-off-by: Sasha Levin <sasha.levin@oracle.com>
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[ Upstream commit 11313746547015ace605c4c347a40350753051e4 ]
On R-Mobile APE6, since it has 3 thermal zones, ENR register
has enable bits in bit 19-16, bit 11-8 and bit 3-0.
However, on R-Car gen2, since it has 1 thermal zone, ENR register has
enable bits in bit 3-0. (In other words, the write value should always
be 0 for bit 31-4 of ENR register.)
So, this patch fixes the ENR register value using I/O resource sets.
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Sasha Levin <sasha.levin@oracle.com>
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[ Upstream commit efa86858e1d8970411a140fa1e0c4dd18a8f2a89 ]
Improve the Armada 380 thermal sensor accuracy by using updated formula.
The updated formula is:
Temperature[C degrees] = 0.4761 * tsen_vsen_out - 279.1
Signed-off-by: Nadav Haklai <nadavh@marvell.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@free-electrons.com>
Cc: <stable@vger.kernel.org> #v3.16
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Sasha Levin <sasha.levin@oracle.com>
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commit a5fd9733a30d18d7ac23f17080e7e07bb3205b69 upstream.
commit 4dbd27711cd9 "tick: export nohz tick idle symbols for module
use" was merged via the thermal tree without an explicit ack from the
relevant maintainers.
The exports are abused by the intel powerclamp driver which implements
a fake idle state from a sched FIFO task. This causes all kinds of
wreckage in the NOHZ core code which rightfully assumes that
tick_nohz_idle_enter/exit() are only called from the idle task itself.
Recent changes in the NOHZ core lead to a failure of the powerclamp
driver and now people try to hack completely broken and backwards
workarounds into the NOHZ core code. This is completely unacceptable
and just papers over the real problem. There are way more subtle
issues lurking around the corner.
The real solution is to fix the powerclamp driver by rewriting it with
a sane concept, but that's beyond the scope of this.
So the only solution for now is to remove the calls into the core NOHZ
code from the powerclamp trainwreck along with the exports.
Fixes: d6d71ee4a14a "PM: Introduce Intel PowerClamp Driver"
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Cc: Preeti U Murthy <preeti@linux.vnet.ibm.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Fengguang Wu <fengguang.wu@intel.com>
Cc: Frederic Weisbecker <frederic@kernel.org>
Cc: Pan Jacob jun <jacob.jun.pan@intel.com>
Cc: LKP <lkp@01.org>
Cc: Peter Zijlstra <peterz@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Link: http://lkml.kernel.org/r/alpine.DEB.2.11.1412181110110.17382@nanos
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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commit 9d367e5e7b05c71a8c1ac4e9b6e00ba45a79f2fc upstream.
thermal_unregister_governors() and class_unregister() were being called in
the wrong order.
Fixes: 80a26a5c22b9 ("Thermal: build thermal governors into thermal_sys module")
Signed-off-by: Luis Henriques <luis.henriques@canonical.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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The functions cpufreq_cooling_unregister() and thermal_zone_device_unregister()
test whether their argument is NULL and then return immediately.
Thus the test around the call is not needed.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Prevents build warning:
st_thermal.c:278:12:
warning: ‘st_thermal_suspend’ defined but not used [-Wunused-function]
st_thermal.c:286:12:
warning: ‘st_thermal_resume’ defined but not used [-Wunused-function]
Acked-by: Maxime Coquelin <maxime.coquelin@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Existing code updates cupfreq policy only while executing
cpufreq_apply_cooling() function (i.e. when notify_device != NOTIFY_INVALID).
It doesn't apply constraints when cpufreq policy update happens from any other
place but it should update the cpufreq policy with thermal constraints every
time when there is a cpufreq policy update, to keep state of
cpufreq_cooling_device and max_feq of cpufreq policy in sync. For instance
while resuming cpufreq updates cpufreq_policy and it restores default
policy->usr_policy values irrespective of cooling device's cpufreq_state since
notification gets missed because (notify_device == NOTIFY_INVALID).
Another problem, is that userspace is able to change max_freq irrespective of
cooling device's state, as notification gets missed.
This patch modifies code to maintain a global cpufreq_dev_list and applies
constraints of all matching cooling devices for policy's cpu when there is any
policy update(ends up applying the lowest max_freq among the matching cpu
cooling devices).
This patch also removes redundant check (max_freq > policy->user_policy.max),
as cpufreq framework takes care of user_policy constraints already where ever
required, otherwise its causing an issue while increasing max_freq in normal
scenerio as it restores max_freq with policy->user_policy.max which is old
(smaller) value.
Signed-off-by: Yadwinder Singh Brar <yadi.brar@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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imx_get_temp might be called before the sensor clock is prepared
thus resulting in a timeout of the first attempt to read temp:
thermal thermal_zone0: failed to read out thermal zone 0
Happened to me on a Utilite Standard with IMX6 Dual SoC.
Reason is that in imx_thermal_probe thermal_zone_device_register
is called before the sensor clock is prepared.
thermal_zone_device_register however calls
thermal_zone_device_update which eventually calls imx_get_temp.
Fix this by preparing the clock before calling
thermal_zone_device_register.
Signed-off-by: Heiner Kallweit <heiner.kallweit@web.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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In exynos5260_tmu_registers tmu_ctrl entry is erroneously
assigned twice. The second assignment (to EXYNOS_TMU_REG_CONTROL1
define which represents 0x24 value) overrides the first one
(to EXYNOS_TMU_REG_CONTROL define which represents 0x20 value)
which results in the wrong (according to the Exynos5260 SoC
documentation that I have) offset being used for TMU_CONTROL
register. Fix it by removing the wrong assignment and then
remove no longer used EXYNOS_TMU_REG_CONTROL1 define.
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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thermal driver should be regisetered after cpufreq driver has
been registered and probed. Doing so is to make sure that thermal
driver can get the max cpu cooling states correctly when calling
get_property.
Signed-off-by: Bai Ping <b51503@freescale.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Thermal hysteresis represents a temperature difference.
But the original code treats it as a temperature value,
Convert it from tenths of degree Kelvin to Milli-Celsius
by deducing 273200. This is not right.
Kelvin and Celsius have same degree size. From temperature
difference view, the conversion between tenths of degree
Kelvin unit and Milli-Celsius unit is just to multiply 100.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Acked-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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result is always zero when comes here.
Signed-off-by: Yao Dongdong <yaodongdong@huawei.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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* Factor out code for clearing raised IRQs from exynos_tmu_work() to
exynos_tmu_clear_irqs().
* Add a comment about documentation bugs to exynos_tmu_clear_irqs().
[ The documentation for Exynos3250, Exynos4412, Exynos5250 and
Exynos5260 incorrectly states that INTCLEAR register has
a different placing of bits responsible for FALL IRQs than
INTSTAT register. Exynos5420 and Exynos5440 documentation is
correct (Exynos4210 doesn't support FALL IRQs at all). ]
* Use exynos_tmu_clear_irqs() in exynos_tmu_initialize() instead
of open-coded code trying to clear IRQs according to predefined
masks. After this change exynos_tmu_initialize() just clears
IRQs that are raised like it is already done in exynos_tmu_work().
As a nice side-effect the code now uses the correct offset
(16 instead of 12) for bits responsible for clearing FALL IRQs
in INTCLEAR register on Exynos3250, Exynos4412 and Exynos5250.
* Remove no longer needed intclr_rise_[mask,shift] and
intclr_fall_[mask,shift] fields from struct exynos_tmu_registers.
* Remove no longer needed defines.
This patch has been tested on Exynos4412 and Exynos5420 SoCs.
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Here on function return all temporarily used device nodes shall
decrement their usage counter. The problems are found with device
nodes allocated by for_each_child_of_node(), of_parse_phandle()
and of_find_node_by_name(), fix all problems at once.
Signed-off-by: Vladimir Zapolskiy <vz@mleia.com>
Cc: devicetree@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch add support for TRIM_RELOAD feature at Exynos3250. The TMu of
Exynos3250 has two TRIMINFO_CON register and must need to set RELOAD bit
before reading TRIMINFO register.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch support many TRIMINFO_CTRL registers if specific Exynos SoC
has one more TRIMINFO_CTRL registers. Also this patch uses proper 'RELOAD'
shift/mask bit operation to set RELOAD feature instead of static value.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Currently these SoCs claim TRIM_RELOAD support but don't have
triminfo_ctrl register address defined in their struct
exynos_tmu_registers entries. This causes incorrect write of
value "1" to data->base + 0x00 address (which happens to be
TRIMINFO register). Additionally according to the documentation
that I have neither Exynos5260 nor Exynos5420 support/require
TRIM_RELOAD feature. Thus fix the aforementioned issue by
removing TMU_SUPPORT_TRIM_RELOAD flag for both Exynos5260 and
Exynos5420.
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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There is no need for abstracting configuration for registers that
are identical on all SoC types.
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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pdata->reference_voltage and pdata->gain are always defined
to non-zero values so remove the redundant checks from
exynos_tmu_control().
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Cache number of non-hardware trigger levels in a new pdata field
(non_hw_trigger_levels) and convert code in exynos_tmu_initialize()
accordingly.
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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* Remove dead temp check from temp_to_code() (this function users
in exynos_tmu_initialize() always pass correct temperatures and
exynos_tmu_set_emulation() returns early for EXYNOS4210 because
TMU_SUPPORT_EMULATION flag is not set on this SoC).
* Move temp_code check from code_to_temp() to exynos_tmu_read()
(code_to_temp() only user).
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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exynos_tmu_initialize()
Remove runtime checks for negative return values of temp_to_code()
from exynos_tmu_initialize().
The current level temperature data hardcoded in pdata will never
cause a negative temp_to_code() return values and checking itself
is not proper. The checks in question are done at runtime in
a production code for data that is hardcoded inside driver during
development time and later it doesn't change. Such data should
be verified during development and review time (i.e. by a script
parsing relevant data from exynos_tmu_data.c, one can also argue
that verification to be done is so simple that the review by
a maintainer should be enough).
Theres should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Remove runtime checks for pdata sanity from exynos_tmu_initialize().
The current values hardcoded in pdata will never trigger the checks
and checking itself is not proper. The checks in question are done
at runtime in a production code for data that is hardcoded inside
driver during development time and later it doesn't change. Such
data should be verified during development and review time (i.e. by
a script parsing relevant data from exynos_tmu_data.c, one can also
argue that verification to be done is so simple that the review by
a maintainer should be enough).
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The commit 1928457 ("thermal: exynos: Add hardware mode thermal
calibration support") has added HW_MODE feature but it has never
been enabled. As such it has been a dead code for over a year
now and should be removed from the kernel.
We don't keep the unused/untested features in the kernel just
in case that some future hardware might need it. Such code has
a real maintainance cost (all other code changes have to take
the dead code into account) and usually makes future changes
more difficult, not easier (i.e. recent additions of Exynos5420
SoC and Exynos5260 SoC thermal support has not made use of any
of the driver's currently unused/untested features, moreover
the recently added code is more complex than needed because of
the existing dead code). Also all removed dead code is still
accessible in the kernel git repository and can be easily
brought back if/when needed.
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Remove unused / write-only entries from struct exynos_tmu_registers.
Then remove unused defines while at it.
We don't keep the unused/untested features in the kernel just
in case that some future hardware might need it. Such code has
a real maintainance cost (all other code changes have to take
the dead code into account) and usually makes future changes
more difficult, not easier (i.e. recent additions of Exynos5420
SoC and Exynos5260 SoC thermal support has not made use of any
of the driver's currently unused/untested features, moreover
the recently added code is more complex than needed because of
the existing dead code). Also all removed dead code is still
accessible in the kernel git repository and can be easily
brought back if/when needed.
There should be no functional changes caused by this patch.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Tested-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
"Sorry that I missed the merge window as there is a bug found in the
last minute, and I have to fix it and wait for the code to be tested
in linux-next tree for a few days. Now the buggy patch has been
dropped entirely from my next branch. Thus I hope those changes can
still be merged in 3.18-rc2 as most of them are platform thermal
driver changes.
Specifics:
- introduce ACPI INT340X thermal drivers.
Newer laptops and tablets may have thermal sensors and other
devices with thermal control capabilities that are exposed for the
OS to use via the ACPI INT340x device objects. Several drivers are
introduced to expose the temperature information and cooling
ability from these objects to user-space via the normal thermal
framework.
From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui.
- introduce a new thermal governor, which just uses a hysteresis to
switch abruptly on/off a cooling device. This governor can be used
to control certain fan devices that can not be throttled but just
switched on or off. From: Peter Feuerer.
- introduce support for some new thermal interrupt functions on
i.MX6SX, in IMX thermal driver. From: Anson, Huang.
- introduce tracing support on thermal framework. From: Punit
Agrawal.
- small fixes in OF thermal and thermal step_wise governor"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
Thermal: int340x thermal: select ACPI fan driver
Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs
Thermal: int340x_thermal: expose acpi thermal relationship tables
Thermal: introduce int3403 thermal driver
Thermal: introduce INT3402 thermal driver
Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h
ACPI / Fan: support INT3404 thermal device
ACPI / Fan: add ACPI 4.0 style fan support
ACPI / fan: convert to platform driver
ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant
ACPI / fan: remove no need check for device pointer
ACPI / fan: remove unused macro
Thermal: int3400 thermal: register to thermal framework
Thermal: int3400 thermal: add capability to detect supporting UUIDs
Thermal: introduce int3400 thermal driver
ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package()
ACPI: make acpi_create_platform_device() an external API
thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
ACPI: introduce ACPI int340x thermal scan handler
thermal: Added Bang-bang thermal governor
...
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we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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ACPI _TRT and _ART parsing code has been moved to acpi_thermal_rel such
that it can be used by other devices in the future. Use the parsing APIs
in acpi_thermal_rel.c instead.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.
This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.
The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.
The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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ACPI INT3402 device object could report temperature for the memory module.
To expose such information to user space, a thermal zone device is registered
for it so that the thermal sysfs interface can expose such information for
userspace to use.
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.
This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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It turns out that some boards can have instance->lower greater than 0 and
when thermal trend is dropping it results with next_target equal to -1.
Since the next_target is defined as unsigned long it is interpreted as
0xFFFFFFFF and larger than instance->upper.
As a result the next_target is set to instance->upper which ramps up to
maximal cooling device target when the temperature is steadily decreasing.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device. It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only. For those special devices the driver needs to
explicitely request it.
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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i.MX6SX has some new features of thermal interrupt function,
there are LOW, HIGH and PANIC irq for thermal sensor, so add
platform data to separate different thermal version;
The reset value of LOW ALARM is 0 which means the highest
temp, so the LOW ALARM will be triggered once irq is enabled,
so we need to correct it before enabling thermal irq;
Enable PANIC ALARM as critical trip point, it will trigger
system reset via SRC module once PANIC IRQ is triggered, it
is pure hardware function, so use it instead of software
reset by cooling device.
Signed-off-by: Anson Huang <b20788@freescale.com>
Tested-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add support to check status of the thermal zone before registering the
zone. This will help on disabling some non-existing thermal zone from
the top level DTS file out of common dtsi thermalzone file.
For example,
we have 3 platforms almost same but thermal zones on this platform are
little bit different. Platform 1 and 2 have three thermal zones and
platform 3 has two thermal zones. To avoid duplication of the thermal
zones entries on each DTS file of platforms,we created one common
dtsi file for thermal zone and included this dtsi file from these
3 platform's top level dts file.
On common thermal zone com dtsi file, all thermal zone are enabled and
need to disable one of thermal zone on platform 3 dts file. For this, we
just added entry status = "disabled" for that thermal zone on platform 3
dts file and along with this change to make it work.
This way, we reuse the common file and control the enable/disable of the
thermal zone from top level dts file.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Create a new event to trace when the temperature is above a trip
point. Use the trace-point when handling non-critical and critical
trip pionts.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Steven Rostedt <rostedt@goodmis.org>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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