Commit message (Collapse) | Author | Age | Files | Lines | |
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* | arm64: dts: ti: k3-am62a7: Add MIT license along with GPL-2.0 | Nishanth Menon | 2024-02-06 | 1 | -2/+2 |
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | Modify license to include dual licensing as GPL-2.0-only OR MIT license for SoC and TI evm device tree files. This allows for Linux kernel device tree to be used in other Operating System ecosystems such as Zephyr or FreeBSD. While at this, update the GPL-2.0 to be GPL-2.0-only to be in sync with latest SPDX conventions (GPL-2.0 is deprecated). While at this, update the TI copyright year to sync with current year to indicate license change (and add it at least for one file which was missing TI copyright). Cc: Julien Panis <jpanis@baylibre.com> Cc: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Cc: Pierre Gondois <pierre.gondois@arm.com> Cc: Tony Lindgren <tony@atomide.com> Acked-by: Julien Panis <jpanis@baylibre.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Pierre Gondois <pierre.gondois@arm.com> Acked-by: Tony Lindgren <tony@atomide.com> Signed-off-by: Nishanth Menon <nm@ti.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20240122145539.194512-3-nm@ti.com Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com> | ||||
* | arm64: dts: ti: k3-am62a-wakeup: add VTM node | Bryan Brattlof | 2023-06-14 | 1 | -0/+2 |
| | | | | | | | | | | The am62ax supports a single Voltage and Thermal Management (VTM) device located in the wakeup domain with three associated temperature monitors located in various hot spots of the die. Signed-off-by: Bryan Brattlof <bb@ti.com> Link: https://lore.kernel.org/r/20230405215328.3755561-4-bb@ti.com Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com> | ||||
* | arm64: dts: ti: Use local header for pinctrl register values | Nishanth Menon | 2023-03-20 | 1 | -1/+2 |
| | | | | | | | | | | | | | | | | | | | | The DTS uses hardware register values directly in pin controller pin configuration and not an abstraction of any form. These definitions were previously put in the bindings header to avoid code duplication and to provide some context meaning (name), but they do not fit the purpose of bindings. Store the constants in a header next to DTS and use them instead of bindings. Suggested-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Suggested-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Linus Walleij <linus.walleij@linaro.org> Link: https://lore.kernel.org/all/c4d53e9c-dac0-8ccc-dc86-faada324beba@linaro.org/ Link: https://lore.kernel.org/r/20230315155228.1566883-3-nm@ti.com Signed-off-by: Nishanth Menon <nm@ti.com> | ||||
* | arm64: dts: ti: Introduce AM62A7 family of SoCs | Vignesh Raghavendra | 2022-09-13 | 1 | -0/+122 |
The AM62A SoC belongs to the K3 Multicore SoC architecture platform that can run edge AI applications with Video/Vision processing. This provides advanced system integration with high security support to enable a broad set of applications in industrial/automotive markets such as, driver monitoring, machine vision, smart camera, eMirror, front camera, robotics, and building automation. Some highlights of AM62A SoC are: * Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster. Dual/Single core variants are provided in the same package to allow HW compatible designs. * One Device manager Cortex-R5F for system power and resource management, and one Cortex-R5F for Functional Safety or general-purpose usage. * One AI accelerator (up to 2 TOPS), using one C7x256V DSP w/Matrix Multiplier accelerator (MMA) for Deep Learning usage. * VPAC3L(Vision Pre-processing Accelerator), providing 12-bit ISP up to 315MPixel/s RGB+IR support, and Noise Filter for improved integrated imaging and vision image processing. * H.264/H.265 Video Encode/Decode. + Motion JPEG encode * Display support, providing 24-bit RBG parallel interface up to 200MHz pixel clock support for 2K display resolution. * Integrated Giga-bit Ethernet switch supporting up to a total of two external ports (TSN capable). * 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, GPMC for NAND/FPGA connection, OSPI memory controller, 3x McASP for audio, 1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other peripherals. * Dedicated Centralized Hardware Security Module with support for secure boot, debug security and crypto acceleration and trusted execution environment * One 32 bit DDR Subsystem that supports LPDDR4, DDR4 memory types. * Multiple low power modes support, ex: Deep sleep, Standby, MCU-only, enabling battery powered system design. More details about the SoCs can be found in the Technical Reference Manual: https://www.ti.com/lit/zip/spruj16 Co-developed-by: Bryan Brattlof <bb@ti.com> Signed-off-by: Bryan Brattlof <bb@ti.com> Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com> Tested-by: Devarsh Thakkar <devarsht@ti.com> Link: https://lore.kernel.org/r/20220901141328.899100-5-vigneshr@ti.com |