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* Merge tag 'char-misc-6.11-rc1' of ↵Linus Torvalds2024-07-193-0/+160
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char / misc and other driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.11-rc1. Nothing major in here, just loads of new drivers and updates. Included in here are: - IIO api updates and new drivers added - wait_interruptable_timeout() api cleanups for some drivers - MODULE_DESCRIPTION() additions for loads of drivers - parport out-of-bounds fix - interconnect driver updates and additions - mhi driver updates and additions - w1 driver fixes - binder speedups and fixes - eeprom driver updates - coresight driver updates - counter driver update - new misc driver additions - other minor api updates All of these, EXCEPT for the final Kconfig build fix for 32bit systems, have been in linux-next for a while with no reported issues. The Kconfig fixup went in 29 hours ago, so might have missed the latest linux-next, but was acked by everyone involved" * tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits) misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems misc: delete Makefile.rej binder: fix hang of unregistered readers misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI virtio: add missing MODULE_DESCRIPTION() macro agp: uninorth: add missing MODULE_DESCRIPTION() macro spmi: add missing MODULE_DESCRIPTION() macros dev/parport: fix the array out-of-bounds risk samples: configfs: add missing MODULE_DESCRIPTION() macro misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver misc: keba: Fix missing AUXILIARY_BUS dependency slimbus: Fix struct and documentation alignment in stream.c MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches misc: fastrpc: use coherent pool for untranslated Compute Banks misc: fastrpc: support complete DMA pool access to the DSP misc: fastrpc: add missing MODULE_DESCRIPTION() macro misc: fastrpc: Add missing dev_err newlines misc: fastrpc: Use memdup_user() nvmem: core: Implement force_ro sysfs attribute nvmem: Use sysfs_emit() for type attribute ...
| * Merge branch 'icc-msm8953' into icc-nextGeorgi Djakov2024-07-041-0/+93
| |\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add interconnect driver for MSM8953-based devices. * icc-msm8953 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC interconnect: qcom: Add MSM8953 driver Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-0-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| | * dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoCVladimir Lypak2024-06-281-0/+93
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add the device-tree bindings for interconnect providers used on MSM8953 platform. Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * | dt-bindings: interconnect: Add MediaTek EMI Interconnect bindingsAngeloGioacchino Del Regno2024-06-132-0/+67
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add bindings for the MediaTek External Memory Interface Interconnect, which providers support system bandwidth requirements through Dynamic Voltage Frequency Scaling Resource Collector (DVFSRC) hardware. This adds bindings for MediaTek MT8183 and MT8195 SoCs. Note that this is modeled as a subnode of DVFSRC for multiple reasons: - Some SoCs have more than one interconnect on the DVFSRC (and two different kinds of EMI interconnect, and also a SMI interconnect); - Some boards will want to not enable the interconnect driver because some of those are not battery powered (so they just keep the knobs at full thrust from the bootloader and never care scaling busses); - Some DVFSRC interconnect features may depend on firmware. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20240610085735.147134-3-angelogioacchino.delregno@collabora.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* / dt-bindings: interconnect: Add Qualcomm IPQ9574 supportVaradarajan Narayanan2024-07-061-0/+59
|/ | | | | | | | | | | | | | | | Add interconnect-cells to clock provider so that it can be used as icc provider. Add master/slave ids for Qualcomm IPQ9574 Network-On-Chip interfaces. This will be used by the gcc-ipq9574 driver that will for providing interconnect services using the icc-clk framework. Acked-by: Georgi Djakov <djakov@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com> Link: https://lore.kernel.org/r/20240430064214.2030013-3-quic_varada@quicinc.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
* Merge branch 'icc-sm7150' into icc-nextGeorgi Djakov2024-02-291-0/+150
|\ | | | | | | | | | | | | | | | | | | | | Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC. * icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver support Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * dt-bindings: interconnect: Add Qualcomm SM7150 DT bindingsDanila Tikhonov2024-02-291-0/+150
| | | | | | | | | | | | | | | | | | | | The Qualcomm SM7150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Danila Tikhonov <danila@jiaxyga.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-cleanup' into icc-nextGeorgi Djakov2024-02-261-24/+0
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | * icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes interconnect: qcom: sa8775p: constify pointer to qcom_icc_node interconnect: qcom: sm8250: constify pointer to qcom_icc_node interconnect: qcom: sm6115: constify pointer to qcom_icc_node interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address interconnect: constify of_phandle_args in xlate Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * | dt-bindings: interconnect: Remove bogus interconnect nodesKonrad Dybcio2024-01-311-24/+0
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The downstream kernel has infrastructure for passing votes from different interconnect nodes onto different RPMh RSCs. This neither implemented, not is going to be implemented upstream (in favor of a different solution using ICC tags through the same node). Unfortunately, as it happens, meaningless (in the upstream context) parts of the vendor driver were copied, ending up causing havoc - since all "per-RSC" (in quotes because they all point to the main APPS one) BCMs defined within the driver overwrite the value in RPMh on every aggregation. To both avoid keeping bogus code around and possibly introducing impossible-to-track-down bugs (busses shutting down for no reason), get rid of the duplicated ICC node definitions. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* / dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindingsAdam Skladowski2024-01-311-0/+93
|/ | | | | | | | | | | | | Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices. [Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware] Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-sm6115' of ↵Bjorn Andersson2023-12-161-0/+111
|\ | | | | | | | | | | | | https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into HEAD Merge the SM6115 interconnect binding to allow referecing the interconnect header files and the ports defined in these.
| * dt-bindings: interconnect: Add Qualcomm SM6115 NoCKonrad Dybcio2023-12-061-0/+111
| | | | | | | | | | | | | | | | | | Add bindings for Qualcomm SM6115 Network-On-Chip interconnect. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-x1e80100' of ↵Bjorn Andersson2023-12-071-0/+207
|\ \ | | | | | | | | | | | | | | | | | | https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into arm64-for-6.8 Merge the X1E80100 interconnect binding to get access to the interconnect port constants.
| * | dt-bindings: interconnect: Add Qualcomm X1E80100 SoCRajendra Nayak2023-11-241-0/+207
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Co-developed-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com> Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* / dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in ↵Neil Armstrong2023-11-241-0/+154
|/ | | | | | | | | | | Qualcomm SM8650 SoC Document the RPMh Network-On-Chip Interconnect of the SM8650 platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* dt-bindings: interconnect: Add compatibles for SDX75Rohit Agarwal2023-10-101-0/+102
| | | | | | | | | | Add dt-bindings compatibles and interconnect IDs for Qualcomm SDX75 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1694614256-24109-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-sm8250-qup' into icc-nextGeorgi Djakov2023-07-181-0/+7
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | SM8250 (like SM8150 but unlike all other QUP-equipped SoCs) doesn't provide a qup-core path. Adjust the bindings and drivers as necessary, and then describe the icc paths in the device tree. This makes it possible for interconnect sync_state succeed so long as you don't use UFS. * icc-sm8250-qup dt-bindings: interconnect: qcom,rpmh: Add SM8250 QUP virt dt-bindings: interconnect: qcom,sm8250: Add QUP virt interconnect: qcom: sm8250: Fix QUP0 nodes Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-0-9ba0a9460be2@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * dt-bindings: interconnect: qcom,sm8250: Add QUP virtKonrad Dybcio2023-07-161-0/+7
| | | | | | | | | | | | | | | | | | Add the required defines for QUP_virt nodes. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-2-9ba0a9460be2@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | dt-bindings: interconnect: Add Qcom RPM ICC bindingsKonrad Dybcio2023-07-151-0/+13
|/ | | | | | | | | | | The SMD RPM interconnect driver requires different icc tags to the RPMh driver. Add bindings to reflect that. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20230526-topic-smd_icc-v7-1-09c78c175546@linaro.org Signed-off-by: Bjorn Andersson <andersson@kernel.org>
* dt-bindings: interconnect/msm8996-cbf: add defines to be used by CBFDmitry Baryshkov2023-05-181-0/+12
| | | | | | | | | | | On msm8996 CBF interconnects power and performance CPU clusters. Add corresponding interconnect defines to be used in device trees. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Tested-by: Yassine Oudjana <y.oudjana@protonmail.com> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230512001334.2983048-2-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov2023-02-061-0/+231
|\ | | | | | | | | | | | | | | | | | | * icc-sa8775p dt-bindings: interconnect: qcom: document the interconnects for sa8775p interconnect: qcom: add a driver for sa8775p dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * dt-bindings: interconnect: qcom: document the interconnects for sa8775pBartosz Golaszewski2023-01-191-0/+231
| | | | | | | | | | | | | | | | | | | | Add a DT binding document for the RPMh interconnects on Qualcomm sa8775p platforms. Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-sdm670' into icc-nextGeorgi Djakov2023-02-061-0/+136
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | * icc-sdm670 dt-bindings: interconnect: add sdm670 interconnects interconnect: qcom: add sdm670 interconnects Link: https://lore.kernel.org/r/20230111005155.50452-1-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * | dt-bindings: interconnect: add sdm670 interconnectsRichard Acayan2023-01-191-0/+136
| |/ | | | | | | | | | | | | | | | | | | | | | | | | There are controllable interconnects on Snapdragon 670. Add the compatible strings to the documentation and interconnect ID definitions. The device tree header was generated by linux-interconnect-driver-generator and the copyright year was changed. Signed-off-by: Richard Acayan <mailingradian@gmail.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230111005155.50452-2-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-ip0-migration' into icc-nextGeorgi Djakov2023-02-066-16/+2
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Commits 2f3724930eb4 ("interconnect: qcom: sc7180: Drop IP0 interconnects") and 2fb251c26560 ("interconnect: qcom: sdx55: Drop IP0 interconnects") removed IP0 interconnects (and ipa-virt devices support) in favour of the RPMH clocks. Follow this example for other platforms defining IP0 RPMH resource. While we are at it, remove several leftover from the mentioned patches. * icc-ip0-migration: interconnect: qcom: sdx55: drop IP0 remnants interconnect: qcom: sc7180: drop IP0 remnants interconnect: move ignore_list out of of_count_icc_providers() interconnect: qcom: sm8150: Drop IP0 interconnects interconnect: qcom: sm8250: Drop IP0 interconnects interconnect: qcom: sc8180x: Drop IP0 interconnects interconnect: qcom: sc8280xp: Drop IP0 interconnects dt-bindings: interconnect: qcom: Remove ipa-virt compatibles dt-bindings: interconnect: qcom: drop IPA_CORE related defines Link: https://lore.kernel.org/r/20230109002935.244320-1-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * | dt-bindings: interconnect: qcom: drop IPA_CORE related definesDmitry Baryshkov2023-01-186-16/+2
| |/ | | | | | | | | | | | | | | | | | | These interconnects are modeled as clks, not interconnects, therefore remove corresponding defines from the binding as they're unused. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230109002935.244320-10-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-qdu1000' into icc-nextGeorgi Djakov2023-01-051-0/+98
|\ \ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add dt bindings and driver support for the Qualcomm QDU1000 and QRU1000 SoCs. The Qualcomm Technologies, Inc. Distributed Unit 1000 and Radio Unit 1000 are new SoCs meant for enabling Open RAN solutions. See more at https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/qualcomm_5g_ran_platforms_product_brief.pdf Link: https://lore.kernel.org/r/20221216230914.21771-1-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * | dt-bindings: interconnect: Add QDU1000/QRU1000 devicesMelody Olvera2023-01-051-0/+98
| |/ | | | | | | | | | | | | | | | | | | Add separate schema for QDU1000 and QRU1000 interconnect devices to document the different NoCs on these platforms. Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20221216230914.21771-2-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* / dt-bindings: interconnect: Add Qualcomm SM8550Abel Vesa2022-12-291-0/+189
|/ | | | | | | | | | The Qualcomm SM8550 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221202232054.2666830-2-abel.vesa@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-imx8mp' into icc-nextGeorgi Djakov2022-07-151-0/+59
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial value after power up is invalid, need set a valid value after related power domain up. This patchset also includes two patch[1,2] during my development to enable the ICC feature for i.MX8MP. I not include ddrc DVFS in this patchset, ths patchset is only to support NoC value mode/priority/ext_control being set to a valid value that suggested by i.MX Chip Design Team. The value is same as NXP downstream one inside Arm Trusted Firmware: https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97 Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * dt-bindings: interconnect: add fsl,imx8mp.hPeng Fan2022-07-041-0/+59
| | | | | | | | | | | | | | | | | | Add fsl,imx8mp.h for i.MX8MP Signed-off-by: Peng Fan <peng.fan@nxp.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220703091132.1412063-3-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | dt-bindings: interconnect: Add Qualcomm SM6350 NoC supportLuca Weiss2022-06-201-0/+148
|/ | | | | | | | | | | | Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices. As SM6350 has two pairs of NoCs sharing the same reg, allow this in the binding documentation, as was done for qcm2290. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-sc8180x' into icc-nextGeorgi Djakov2022-05-181-0/+7
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | This contains a few fixes for the sc8180x interconnect provider driver to make it functional. * icc-sc8180x dt-bindings: interconnect: Add SC8180X QUP0 virt provider interconnect: qcom: sc8180x: Modernize sc8180x probe interconnect: qcom: sc8180x: Fix QUP0 nodes interconnect: qcom: sc8180x: Mark some BCMs keepalive Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * interconnect: qcom: sc8180x: Fix QUP0 nodesBjorn Andersson2022-05-181-0/+7
| | | | | | | | | | | | | | | | | | | | The QUP0 BCM relates to some internal property of the QUPs, and should be configured independently of the path to the QUP. In line with other platforms expose QUP_CORE endpoints in order allow this configuration. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-sdx65' into icc-nextGeorgi Djakov2022-05-181-0/+67
|\ \ | | | | | | | | | | | | | | | | | | | | | This adds interconnect driver support for SDX65 platform for scaling the bandwidth requirements over RPMh. Link: https://lore.kernel.org/r/1649854415-11174-1-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * | dt-bindings: interconnect: Add Qualcomm SDX65 DT bindingsRohit Agarwal2022-04-261-0/+67
| |/ | | | | | | | | | | | | | | | | Add interconnect IDs for Qualcomm SDX65 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1649854415-11174-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* / dt-bindings: interconnect: qcom: Add sc8280xp bindingBjorn Andersson2022-04-221-0/+232
|/ | | | | | | | | | | The Qualcomm SC8280XP platform has the usual set of busses, add a binding for these interconnect providers and port definitions to allow interconnect paths to be expressed in the sc8280xp DeviceTree. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-qcm2290' into icc-nextGeorgi Djakov2021-12-151-0/+94
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for QCM2290 including a few prep changes. * icc-qcm2290 interconnect: icc-rpm: Define ICC device type interconnect: icc-rpm: Add QNOC type QoS support interconnect: icc-rpm: Support child NoC device probe dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support interconnect: qcom: Add QCM2290 driver support Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * dt-bindings: interconnect: Add Qualcomm QCM2290 NoC supportShawn Guo2021-12-151-0/+94
| | | | | | | | | | | | | | | | | | Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211215002324.1727-5-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | Merge branch 'icc-sm8450' into icc-nextGeorgi Djakov2021-12-141-0/+171
|\ \ | |/ |/| | | | | | | | | | | | | | | | | | | This add device tree binding and driver for interconnect providers found in SM8450 SoC. * icc-sm8450 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings interconnect: qcom: Add SM8450 interconnect provider driver Link: https://lore.kernel.org/r/20211209084842.189627-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
| * dt-bindings: interconnect: Add Qualcomm SM8450 DT bindingsVinod Koul2021-12-141-0/+171
| | | | | | | | | | | | | | | | | | | | The Qualcomm SM8450 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand Signed-off-by: Vinod Koul <vkoul@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211209084842.189627-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* | dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindingsYassine Oudjana2021-11-221-0/+163
|/ | | | | | | | | | | Add bindings for interconnects on Qualcomm MSM8996. Signed-off-by: Yassine Oudjana <y.oudjana@protonmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Tested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> #db820c Link: https://lore.kernel.org/r/20211021132329.234942-4-y.oudjana@protonmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
* dt-bindings: interconnect: Add Qualcomm SC8180x DT bindingsGeorgi Djakov2021-08-091-0/+185
| | | | | | | | | | | | Add compatibles and port definitions for the SC8180x RPMH interconnect providers. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> [bjorn: Split defines from driver patch and added binding update] Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* dt-bindings: interconnect: Add Qualcomm SC7280 DT bindingsOdelu Kukatla2021-05-111-0/+165
| | | | | | | | | | The Qualcomm SC7280 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
* Merge branch 'icc-sm8350' into icc-nextGeorgi Djakov2021-04-021-0/+172
|\ | | | | | | | | | | | | | | | | | | | | | | | | This adds interconnect support for SM8350 SoC. * icc-sm8350 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings interconnect: qcom: Add SM8350 interconnect provider driver interconnect: qcom: sm8350: Use the correct ids interconnect: qcom: sm8350: Add missing link between nodes Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
| * dt-bindings: interconnect: Add Qualcomm SM8350 DT bindingsVinod Koul2021-03-271-0/+172
| | | | | | | | | | | | | | | | | | | | The Qualcomm SM8350 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Vinod Koul <vkoul@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* | dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoCAngeloGioacchino Del Regno2021-03-081-0/+116
|/ | | | | | | | | | Add the bindings for the Qualcomm SDM660-class NoC, valid for SDM630, SDM636, SDM660 and SDA variants. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* Merge branch 'icc-sdx55' into icc-nextGeorgi Djakov2021-02-011-0/+76
|\ | | | | | | | | | | | | | | | | | | | | | | Add interconnect driver support for SDX55 platform for scaling the bandwidth requirements over RPMh. * icc-sdx55 dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings interconnect: qcom: Add SDX55 interconnect provider driver Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
| * dt-bindings: interconnect: Add Qualcomm SDX55 DT bindingsManivannan Sadhasivam2021-01-271-0/+76
| | | | | | | | | | | | | | | | | | | | The Qualcomm SDX55 platform has several bus fabrics that could be controlled and tuned dynamically over RPMh according to the bandwidth demand. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* | dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindingsJun Nie2021-01-051-0/+105
|/ | | | | | | | | | The Qualcomm MSM8939 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jun Nie <jun.nie@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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