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Changes to support spec changes
1. Remove usage of Pcd.
2. Change code to validate the Temporary Ram size input.
3. Consume the input saved in YMM Register
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Chiu Chasel <chasel.chiu@intel.com>
Cc: Duggapu Chinni B <chinni.b.duggapu@intel.com>
Cc: Ni Ray <ray.ni@intel.com>
Signed-off-by: Duggapu Chinni B <chinni.b.duggapu@intel.com>
Reviewed-by: Chiu Chasel <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3737
Apply uncrustify changes to .c/.h files in the IntelFsp2Pkg package
Cc: Andrew Fish <afish@apple.com>
Cc: Leif Lindholm <leif@nuviainc.com>
Cc: Michael D Kinney <michael.d.kinney@intel.com>
Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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https://bugzilla.tianocore.org/show_bug.cgi?id=1373
Replace BSD 2-Clause License with BSD+Patent License. This change is
based on the following emails:
https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html
RFCs with detailed process for the license change:
V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Added FspMemoryInitDone2, FspTempRamExitDone2, FspSiliconInitDone2
to return error status to Boot Loader for FSP API calls.
To maintain backward compatibility existing functions
(FspMemoryInitDone, FspTempRamExitDone, FspSiliconInitDone)
declaration left untouched.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
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In FSP2.0, Boot loader should migrate its temp ram before
calling the tempramexit API to tear down the tempram. so, we don't need the
function to migrate the BL TempRam in the IntelFsp2Pkg.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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