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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3916
Provide FSP 2.4 MultiPhase interface and scripts
support.
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3737
Apply uncrustify changes to .c/.h files in the IntelFsp2Pkg package
Cc: Andrew Fish <afish@apple.com>
Cc: Leif Lindholm <leif@nuviainc.com>
Cc: Michael D Kinney <michael.d.kinney@intel.com>
Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2698
To enhance FSP silicon initialization flexibility an optional
Multi-Phase API is introduced and FSP header needs update for
new API offset. Also new SecCore module created for
FspMultiPhaseSiInit API
New ARCH_UPD introduced for enhancing FSP debug message
flexibility now bootloader can pass its own debug handler
function pointer and FSP will call the function to handle
debug message.
To support calling bootloader functions, a FspGlobalData field
added to indicate if FSP needs to switch stack when FSP running
on separate stack from bootloader.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
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Fix various typos in IntelFsp2Pkg.
Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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This reverts commit f527942e6bdd9f198db90f2de99a0482e9be5b1b.
Commit message was incorrect.
Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Fix one typo in FmpDevicePkg.
Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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https://bugzilla.tianocore.org/show_bug.cgi?id=1373
Replace BSD 2-Clause License with BSD+Patent License. This change is
based on the following emails:
https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html
RFCs with detailed process for the license change:
V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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